LED PACKAGING STRUCTURE

• US 20100052001A1
• Filed: 11/10/2009
• Published: 03/04/2010
• Est. Priority Date: 07/24/2006
• Status: Active Grant

• Current Assignee: Hsiao-Chiao Li, Yi-Tsuo Wu
• Original Assignee: Hsiao-Chiao Li, Yi-Tsuo Wu
• Inventors: Wu, Yi-Tsuo, Li, Hsiao-Chiao
• Granted Patent: US 8,093,600 B2
• Time in Patent Office: Days
• US Class Current: 257/98
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 33/50 Wavelength conversion elements

Abstract

A light emitting diode packaging structure includes a package body, a red LED chip, a blue LED chip, a green LED chip, a package material and a yellow phosphor. Three LED chips are disposed within an accommodating room of the body package and covered by the package material. The yellow phosphor is uniformly mixed with the package material. A white light is formed by a mix of three types of light from the LED chips. Additionally, a yellow light which is generated from the excitement of the yellow phosphor with the blue light is mixed with a part of the blue light to further form the white light.

Claims

1. A light emitting diode (LED) packaging structure, comprising:

a substrate;

an LED chipset disposed on the substrate, the LED chipset at least having a first LED chip to generate a green light and having a second LED chip to generate a blue light; and

a phosphor disposed on the LED chipset, converting a portion of the blue light to a yellow light,

wherein the yellow light and the remaining blue light are mixed to form a white light, and wherein the green light and the remaining blue light are substantially equivalent in brightness.

2. The light emitting diode (LED) packaging structure of claim 1, wherein the LED chipset further comprises a third LED chip to generate a red light.

3. The light emitting diode (LED) packaging structure of claim 2, wherein the yellow light has a wavelength range about from 560 nm to 600 nm.

4. The light emitting diode (LED) packaging structure of claim 3, wherein the blue light has a wavelength range about from 440 nm to 480 nm, the green light has a wavelength range about from 510 nm to 550 nm and the red light has a wavelength range about from 600 nm to 630 nm.

5. The light emitting diode (LED) packaging structure of claim 1, wherein the yellow light has a wavelength range about from 560 nm to 600 nm.

6. The light emitting diode (LED) packaging structure of claim 5, wherein the LED chipset further comprises a third LED chip to generate a red light.

7. The light emitting diode (LED) packaging structure of claim 1, wherein the blue light has a wavelength range about from 440 nm to 480 nm and the green light has a wavelength range about from 510 nm to 550 nm.

8. The light emitting diode (LED) packaging structure of claim 7, wherein the LED chipset further comprises a third LED chip to generate a red light.

9. The light emitting diode (LED) packaging structure of claim 8, wherein the yellow light has a wavelength range about from 560 nm to 600 nm.

10. The light emitting diode (LED) packaging structure of claim 8, wherein the three LED chips are arranged in a linear sequence or in triangle.

11. The light emitting diode (LED) packaging structure of claim 2, wherein the three LED chips are arranged in a linear sequence or in triangle.

12. The light emitting diode (LED) packaging structure of claim 6, wherein the three LED chips are arranged in a linear sequence or in triangle.

13. The light emitting diode (LED) packaging structure of claim 2, wherein the blue LED chip is in the middle as three LED chips are arranged linearly.

14. The light emitting diode (LED) packaging structure of claim 6, wherein the blue LED chip is in the middle as three LED chips are arranged linearly.

15. The light emitting diode (LED) packaging structure of claim 8, wherein the blue LED chip is in the middle as three LED chips are arranged linearly.

16. The light emitting diode (LED) packaging structure of claim 1, further comprising a package material covering the LED chipset.

17. The light emitting diode (LED) packaging structure of claim 16, wherein the package material is epoxy resin, acrylic resin, silicone or combinations thereof.

18. The light emitting diode (LED) packaging structure of claim 1, further comprising a package material mixed with the phosphor to cover the LED chipset.

19. The light emitting diode (LED) packaging structure, comprising:

a substrate;

an LED chipset disposed on the substrate, the LED chipset at least having a first LED chip to generate a green light, a second LED chip to generate a blue light and a third LED chip to generate a red light;

a phosphor disposed on the LED chipset, converting a portion of the blue light to a yellow light having a wavelength range about from 560 nm to 600 nm, and

a package material disposed on the substrate encapsulating the LED chipset and the phosphor,

wherein the yellow light and the remaining blue light are mixed to form a white light, and wherein the green light and the remaining blue light are substantially equivalent in brightness.

20. The light emitting diode (LED) packaging structure, comprising:

a substrate;

an LED chipset disposed on the substrate, the LED chipset at least having a first LED chip to generate a green light in a wavelength range about from 510 nm to 550 nm and having a second LED chip in a wavelength range about from 440 nm to 480 nm to generate a blue light; and

a phosphor disposed on the LED chipset, converting a portion of the blue light to a yellow light in a wavelength range about from 560 nm to 600 nm,

wherein the yellow light and the remaining blue light are mixed to form a white light, and wherein the green light and the remaining blue light are substantially equivalent in brightness.