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SEMICONDUCTOR CHIP ASSEMBLY WITH POST/BASE HEAT SPREADER AND CONDUCTIVE TRACE

  • US 20100052005A1
  • Filed: 11/11/2009
  • Published: 03/04/2010
  • Est. Priority Date: 03/25/2008
  • Status: Abandoned Application
First Claim
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1. A semiconductor chip assembly, comprising:

  • a semiconductor device;

    an adhesive that includes an opening;

    a heat spreader that includes a post and a base, wherein the post is adjacent to the base and extends above the base in an upward direction, and the base extends below the post in a downward direction opposite the upward direction and extends laterally from the post in lateral directions orthogonal to the upward and downward directions; and

    a conductive trace that includes a pad and a terminal;

    wherein the semiconductor device is above and overlaps the post, is electrically connected to the pad and thereby electrically connected to the terminal, and is thermally connected to the post and thereby thermally connected to the base;

    wherein the adhesive is mounted on and extends above the base, extends into a gap between the post and the pad, extends laterally from the post to or beyond the terminal and is sandwiched between the base and the pad;

    wherein the pad is mounted on the adhesive and extends above the base; and

    wherein the post extends into the opening, and the base extends below the semiconductor device, the adhesive and the pad.

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