SEMICONDUCTOR CHIP ASSEMBLY WITH POST/BASE HEAT SPREADER AND CONDUCTIVE TRACE

• US 20100052005A1
• Filed: 11/11/2009
• Published: 03/04/2010
• Est. Priority Date: 03/25/2008
• Status: Abandoned Application

• Current Assignee: Bridge Semiconductor Corporation
• Original Assignee: Bridge Semiconductor Corporation
• Inventors: Lin, Charles W.C., Wang, Chia-Chung
• Application Number:
  US12/616,775
• Publication Number:
  US 20100052005A1
• Time in Patent Office: Days
• US Class Current: 257/99
• CPC Class Codes: H01L 2224/32188 the layer connector connecting to a bonding area protruding from the surface of the item
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/85205 Ultrasonic bonding
• CPC Class Codes: H01L 23/3677 Wire-like or pin-like cooling fins or heat sinks
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01012 Magnesium [Mg]
• CPC Class Codes: H01L 2924/01019 Potassium [K]
• CPC Class Codes: H01L 2924/01046 Palladium [Pd]
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/01087 Francium [Fr]
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 33/483 : Containers
• CPC Class Codes: H01L 33/62 : Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H01L 33/642 : characterized by the shape
• CPC Class Codes: H05K 1/0204 : using means for thermal conduction connection in the thickness direction of the substrate H05K1/0207 takes precedence
• CPC Class Codes: H05K 2201/09054 : Raised area or protrusion of metal substrate
• CPC Class Codes: H05K 2201/10106 : Light emitting diode [LED]
• CPC Class Codes: H05K 2203/0369 : Etching selective parts of a metal substrate through part of its thickness, e.g. using etch resist
• CPC Class Codes: H05K 3/0061 : onto a metallic substrate, e.g. a heat sink heat sinks for electric apparatus H05K7/20

Abstract

A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and an adhesive. The semiconductor device is electrically connected to the conductive trace and thermally connected to the heat spreader. The heat spreader includes a post and a base. The post extends upwardly from the base into an opening in the adhesive, and the base extends laterally from the post. The adhesive extends between the post and the conductive trace and between the base and the conductive trace. The conductive trace provides signal routing between a pad and a terminal.

Claims

1. A semiconductor chip assembly, comprising:

a semiconductor device;

an adhesive that includes an opening;

a heat spreader that includes a post and a base, wherein the post is adjacent to the base and extends above the base in an upward direction, and the base extends below the post in a downward direction opposite the upward direction and extends laterally from the post in lateral directions orthogonal to the upward and downward directions; and

a conductive trace that includes a pad and a terminal;

wherein the semiconductor device is above and overlaps the post, is electrically connected to the pad and thereby electrically connected to the terminal, and is thermally connected to the post and thereby thermally connected to the base;

wherein the adhesive is mounted on and extends above the base, extends into a gap between the post and the pad, extends laterally from the post to or beyond the terminal and is sandwiched between the base and the pad;

wherein the pad is mounted on the adhesive and extends above the base; and

wherein the post extends into the opening, and the base extends below the semiconductor device, the adhesive and the pad.

2. The assembly of claim 1, wherein the semiconductor device is an LED package that includes an LED chip.

3. The assembly of claim 2, wherein the LED package is electrically connected to the pad using a first solder joint and is thermally connected to the heat spreader using a second solder joint.

4. The assembly of claim 1, wherein the semiconductor device is a semiconductor chip.

5. The assembly of claim 4, wherein the chip is electrically connected to the pad using a wire bond and is thermally connected to the heat spreader using a die attach.

6. The assembly of claim 1, wherein the adhesive contacts the post in the gap and contacts the base, the pad and the terminal outside the gap.

7. The assembly of claim 1, wherein the adhesive covers and surrounds the post in the lateral directions.

8. The assembly of claim 1, wherein the adhesive conformally coats sidewalls of the post and a top surface of the base outside the post.

9. The assembly of claim 1, wherein the adhesive fills the space between the base and the conductive trace.

10. The assembly of claim 1, wherein the adhesive extends laterally from the post beyond and is overlapped by the terminal.

11. The assembly of claim 1, wherein the adhesive extends to peripheral edges of the assembly.

12. The assembly of claim 1, wherein the post is integral with the base.

13. The assembly of claim 1, wherein the post is coplanar with the adhesive above a bottom surface of the pad.

14. The assembly of claim 1, wherein the post has a cut-off conical shape in which its diameter decreases as it extends upwardly from the base to its flat top.

15. The assembly of claim 1, wherein the base covers the semiconductor device, the post, the adhesive and the conductive trace in the downward direction and extends to peripheral edges of the assembly.

16. The assembly of claim 1, wherein the conductive trace is spaced from the post and the base, and the pad and the terminal contact and overlap the adhesive.

17. The assembly of claim 1, wherein the heat spreader includes a cap that is above and adjacent to and covers in the upward direction and extends laterally in the lateral directions from a top of the post.

18. The assembly of claim 17, wherein the cap is coplanar with the pad and the terminal above the adhesive.

19. The assembly of claim 17, wherein the cap has a rectangular or square shape and the top of the post has a circular shape.

20. The assembly of claim 17, wherein the cap is sized and shaped to accommodate a thermal contact surface of the semiconductor device, and the top of the post is not sized and shaped to accommodate the thermal contact surface of the semiconductor device.

21. A semiconductor chip assembly, comprising:

a semiconductor device;

an adhesive that includes an opening;

a heat spreader that includes a post and a base, wherein the post is adjacent to and integral with the base and extends above the base in an upward direction, the base extends below the post in a downward direction opposite the upward direction and extends laterally from the post in lateral directions orthogonal to the upward and downward directions; and

a conductive trace that includes a pad, a terminal and a routing line, wherein an electrically conductive path between the pad and the terminal includes the routing line;

wherein the semiconductor device is mounted on the heat spreader, overlaps the post, is electrically connected to the pad and thereby electrically connected to the terminal, and is thermally connected to the post and thereby thermally connected to the base;

wherein the adhesive is mounted on and extends above the base, extends into a gap between the post and the pad, is sandwiched between the base and the conductive trace outside the gap, surrounds the post in the lateral directions and extends to peripheral edges of the assembly;

wherein the conductive trace is mounted on the adhesive and extends above the base, and the pad, the terminal and the routing line contact and overlap the adhesive; and

wherein the post extends into the opening, and the base extends below the semiconductor device, the adhesive and the conductive trace, covers the post, the adhesive and the conductive trace in the downward direction and extends to peripheral edges of the assembly.

22. The assembly of claim 21, wherein the semiconductor device is an LED package that includes an LED chip, is mounted on the pad using a first solder joint and on the heat spreader using a second solder joint, is electrically connected to the pad using the first solder joint and is thermally connected to the heat spreader using the second solder joint.

23. The assembly of claim 21, wherein the adhesive contacts the post in the gap, contacts the base, the pad, the terminal and the routing line outside the gap, covers and surrounds the post in the lateral directions, covers the conductive trace in the downward direction, covers the base outside the post in the upward direction and fills the space between the base and the conductive trace.

24. The assembly of claim 21, wherein the post has a cut-off conical shape in which its diameter decreases as it extends upwardly from the base to its flat top which has a circular shape, and a cap is mounted on and above and adjacent to and covers in the upward direction and extends laterally in the lateral directions from the top of the post and has a rectangular or square shape.

25. The assembly of claim 21, wherein the post is coplanar with the adhesive above a bottom of the conductive trace and the pad is coplanar with the terminal above the adhesive.