MICRO-ELECTRO-MECHANICAL SYSTEMS (MEMS) PACKAGE AND METHOD FOR FORMING THE MEMS PACKAGE

• US 20100052082A1
• Filed: 09/03/2008
• Published: 03/04/2010
• Est. Priority Date: 09/03/2008
• Status: Active Grant

• Current Assignee: Solid State System Co., Ltd.
• Original Assignee: Solid State System Co., Ltd.
• Inventors: Lin, Chih-Hsiang, Lee, Chien-Hsing, Hsieh, Tsung-Min
• Granted Patent: US 8,193,596 B2
• Time in Patent Office: Days
• US Class Current: 257/416
• CPC Class Codes: B81B 2201/0257 Microphones or microspeakers
• CPC Class Codes: B81B 2207/095 through the lid
• CPC Class Codes: B81B 2207/096 through the substrate
• CPC Class Codes: B81B 7/0061 suitable for fluid transfer from the MEMS out of the package or vice versa, e.g. transfer of liquid, gas, sound
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/10253 Silicon [Si]
• CPC Class Codes: H01L 2924/1461 MEMS
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding

Abstract

A micro-electro-mechanical systems (MEMS) package includes a MEMS microphone device. The MEMS microphone device has a first substrate and at least a sensing element on the first substrate wherein a first chamber in the MEMS microphone device is connected to the sensing element. A second substrate is disposed over the MEMS microphone device to provide a second chamber in the second substrate over the sensing element opposite to the first chamber.

Claims

1. A micro-electro-mechanical systems (MEMS) package, comprising:

a MEMS device, having a first substrate and at least a MEMS sensing element, wherein a first chamber in the MEMS device is connected to the MEMS sensing element; and

a second substrate, disposed over the MEMS device to provide a second chamber in the second substrate over the MEMS sensing element opposite to the first chamber.

2. The MEMS package of claim 1, wherein the MEMS sensing element includes at least a portion of the first substrate.

3. The MEMS package of claim 1, wherein the MEMS sensing element includes an acoustical sensor, wherein the acoustical sensor includes a moveable sensing diaphragm, a perforated rigid back plate and a gap formed between the diaphragm and back plate, wherein the gap is connected to the first chamber via the perforated back plate.

4. The MEMS package of claim 1, wherein the first chamber includes an opening to connect to an environment.

5. The MEMS package of claim 1, wherein the MEMS device further comprises an integrated circuit on first substrate and the second substrate has an interconnect structure for electrical coupling an I/O terminal of the integrated circuit out

6. The MEMS package of claim 5, wherein an electrical coupling structure between the interconnect structure of the second substrate and the 10 terminals of the integrated circuit of the MEMS device includes a metal bump or a conductive paste.

7. The MEMS package of claim 6, wherein the metal bump includes a stud bump.

8. The MEMS package of claim 6, wherein the conductive paste includes a B-stage conductive epoxy or solder paste.

9. The MEMS package of claim 1, wherein the MEMS device comprises a structural dielectric layer on the first substrate, wherein the structural dielectric layer includes patterned conductive layers for the coupling between an integrated circuit on the first substrate and the MEMS sensing element.

10. The MEMS package of claim 1, wherein the second substrate diposed over the MEMS device includes an adhesive layer to adhere the second substrate to the surface of the MEMS device.

11. The MEMS package of claim 10, wherein the adhesive layer includes an conductive material.

12. The MEMS package of claim 1, wherein the MEMS device does not include a first chamber and the MEMS sensing element is coupled to an environment directly.

13. The MEMS package of claim 1, wherein the second substrate has an aperture for coupling the second chamber to an environment.

14. The MEMS package of claim 1, further comprising a covering layer on the first substrate of the MEMS device to cover the first chamber,

15. The MEMS package of claim 14, wherein the covering layer has an aperture for coupling the second chamber to an environment.

16. The MEMS package of claim 1, further comprising a third substrate over the second substrate layer, wherein the third substrate has a third chamber over the second chamber of the second substrate in which the second substrate has an aperture for coupling the second chamber and the third chamber.

17. The MEMS package of claim 1, further comprising a covering layer on the first substrate of the MEMS device to cover the first chamber, wherein the covering layer has a side gap for coupling the second chamber to an environment.

18. The MEMS package of claim 1, further comprising a third substrate disposed on the surface of the MEMS device over the second chamber of the substrate, wherein the third substrate has an indent space for adapting the second substrate and the third substrate has an interconnect structure for coupling I/O terminals of the integrated circuit of the MEMS device out.

19. The MEMS package of claim 18, a filling material is filled in the gap formed between the first substrate, second substrate and third substrate.

20. The MEMS package of claim 18, further comprising a covering layer on the first substrate to cover the first chamber of the MEMS device, wherein the covering layer has an aperture for coupling the first chamber to an environment.

21. The MEMS package of claim 1, wherein the first substrate also comprises an interconnect structure for coupling an I/O terminal of the integrated circuit from one side to another side of first substrate, wherein the interconnect structure includes interconnections through the first substrate.

22. The MEMS package of claim 1, further comprising a covering layer to cover first chamber hermetically, wherein the first chamber and the second chamber of the second substrate are not connected to environment.

23. The MEMS package of claim 22, further comprising a hermetic MEMS package, the sensing element of MEMS device includes an inertial sensor or MEMS actuator.

24. The MEMS package of claim 1, wherein the second substrate is a cap structure without interconnect structure.

25. The MEMS package of claim 24, wherein the first substrate also comprises an interconnect structure for coupling an I/O terminal of the integrated circuit from one side to another side of the first substrate, wherein the interconnect structure includes interconnection plugs through the first substrate.

26. The MEMS package of claim 24, wherein the cap structure has an aperture for coupling the second chamber to an environment.

27. The MEMS package of claim 24, further comprising a covering layer to cover the first chamber of the MEMS device, wherein the covering layer also has an interconnect structure for coupling to the integrated circuit and an aperture for coupling the first chamber to an environment.

28. The MEMS package of claim 25, further comprising a covering layer to cover the first chamber of the MEMS device, wherein the covering layer also has an interconnect structure for coupling to the integrated circuit and the covering layer has a side aperture for coupling the first chamber to an environment.

29. The MEMS package of claim 28, wherein the covering layer has an indent region to expand the first chamber.

30. The MEMS package of claim 25, further comprising a covering layer to cover the first chamber of the MEMS device, wherein the covering layer also has an interconnect structure for coupling to the integrated circuit and the second substrate has an aperture for coupling the second chamber to an environment.

31. The MEMS package of claim 30, wherein the covering layer has an indent region to expand the first chamber.

32. A micro-electro-mechanical systems (MEMS) package comprising:

a MEMS device, having a first substrate and at least a MEMS sensing element, wherein a first chamber in the MEMS device is connected to the MEMS sensing element; and

a cap structure without any interconnection structure, disposed over the MEMS device to provide a second chamber in the cap structure over the MEMS sensing element opposite to the first chamber; and

a bonding structure at an outside region of the cap structure on the MEMS device.

33. The MEMS package of claim 32, wherein the MEMS sensing element includes at least a portion of the first substrate.

34. The MEMS package of claim 32, wherein the MEMS device further comprises an integrated circuit on the first substrate, wherein the bonding structure is electrically coupled to an I/O terminal of the integrated circuit.

35. The MEMS package of claim 32, wherein the MEMS device comprises a structural dielectric layer on the first substrate, wherein the structural dielectric layer includes patterned conductive layers for the coupling between an integrated circuit on the first substrate and the MEMS sensing element.

36. The MEMS package of claim 32, wherein a bonding structure includes a metal bump.

37. The MEMS package of claim 36, wherein the metal bump includes a stud bump.

38. The MEMS package of claim 32, wherein a bonding structure includes a conductive paste.

39. The MEMS package of claim 38, wherein the conductive paste includes B-stage conductive epoxy or solder paste.

40. The MEMS package of claim 32, wherein the cap structure has an aperture for coupling the second chamber to environment or fully seals over the sensing element of the MEMS device.

41. The MEMS package of claim 32, further comprising a covering layer on the first substrate to cover the first chamber.

42. The MEMS package of claim 41, wherein the covering layer has an aperture for coupling the first chamber to an environment.

43. The MEMS package of claim 32, further comprising a cap covering layer on the first substrate to fully cover the first chamber and expands a volume of the first chamber.

44. The MEMS package of claim 32, further comprising:

a third substrate with an interconnect structure disposed on the first substrate to cover the first chamber, wherein the third substrate has an aperture for coupling the first chamber to an environment;

a bonding wire, coupling the interconnect structure to the integrated circuit of the MEMS device; and

a protection structure, over the bonding wire for protection.

45. The MEMS package of claim 44, wherein the third substrate comprises semiconductor substrate or printed circuit board.

46. The MEMS package of claim 32, further comprising:

a third substrate with an interconnect structure disposed on the first substrate to fully cover the first chamber;

a bonding wire, coupling the interconnect structure of the third substrate to the bonding structure of the first substrate; and

a protection structure, over the bonding wire for protection.

47. The MEMS package of claim 46, wherein the third substrate has an indent region to expand a volume of the first chamber.

48. The MEMS package of claim 46, wherein the third substrate comprises semiconductor substrate or printed circuit board.

49. The MEMS package of claim 32, wherein the first chamber is sealed from an environment by a covering layer in the MEMS device and the second chamber is sealed from an environment by a cap structure hermetically.

50. The MEMS package of claim 49, further comprising a hermetic MEMS package, the sensing element of MEMS device includes an inertial sensor or MEMS actuator.

51. A micro-electro-mechanical systems (MEMS) package comprising:

a MEMS device, having a first substrate and at least a MEMS sensing element, wherein a first chamber in the MEMS device is connected to the MEMS sensing element;

a second substrate, serving as a cap, disposed over the MEMS device to cover the first chamber;

a third substrate, having an interconnect structure in coupling with the MEMS device at opposite side to the second substrate; and

an adhesive layer, disposed between the MEMS device and the third substrate,

wherein a second chamber is formed under the MEMS sensing element between the MEMS device and the third substrate.

52. The MEMS package of claim 51, wherein the MEMS sensing element includes at least a portion of first substrate.

53. The MEMS package of claim 51, wherein the MEMS device comprises an integrated circuit.

54. The MEMS package of claim 51, wherein the MEMS device comprises a structural dielectric layer on the first substrate, wherein the structural dielectric layer includes patterned conductive layers for the coupling between integrated circuit and MEMS sensing element

55. The MEMS package of claim 51, wherein the third substrate has a ditch under the sensing element to expand the second chamber and is for coupling the second chamber to an environment.

56. The MEMS package of claim 51, wherein the second chamber is coupled to an environment by a gap between the MEMS device and the third substrate.

57. The MEMS package of claim 51, wherein the third substrate has an aperture for coupling the second chamber to an environment.

58. The MEMS package of claim 57, wherein the third substrate has an indent region to expand the second chamber.

59. The MEMS package of claim 51, wherein the second substrate has an aperture for coupling the first chamber to an environment.

60. A micro-electro-mechanical systems (MEMS) package, comprising:

a MEMS device, having a first substrate and at least a MEMS sensing element, wherein a first chamber in the MEMS device is connected to the MEMS sensing element;

a second substrate, disposed over the MEMS device, wherein the second substrate has a second chamber over the sensing element opposite to the first chamber; and

a circuit board, for supporting and electric coupling the MEMS device, wherein the circuit board has an indent region for adapting the second substrate without significantly adding thickness.

61. The MEMS package of claim of 60, further comprising a cap structure over the first chamber of the MEMS device for expanding a containing space.

62. The MEMS package of claim of 60, wherein the second substrate has a first aperture and the circuit board has a second aperture, so as to couple the second chamber to an environment through the first and second apertures.

63. The MEMS package of claim 60, wherein the filling material is filled in the gap between the circuit board and the MEMS device.

64. A method for forming a micro-electro-mechanical systems (MEMS) package, comprising:

forming a plurality of MEMS units on a substrate, wherein each of the MEMS units comprises at least a MEMS sensing element and a first chamber over a MEMS sensing element, wherein the MEMS units includes electric connection pads;

forming a plurality of covering units correspondingly over the MEMS units, wherein each of covering units provides a second chamber over the MEMS sensing element opposite to the first chamber;

adhering the covering units to the MEMS units by the adhesive material; and

dicing the MEMS units into singulated units.

65. The method of claim 64, wherein the covering units include an adhesive material on the surface of covering units facing the MEMS units.

66. The method of claim 65, wherein the adhesive material includes conductive material or conductive epoxy.

67. The method of claim 64, wherein the covering units includes an interconnection structure, wherein the interconnection structure includes a conductive paste.

68. The method of claim 67, wherein the conductive paste is B-stage conductive epoxy or solder paste.

69. The method of claim 67, wherein forming the adhesive material and the conductive paste as a bonding structure in a ring to surround the MEMS sensing element.

70. The method of claim 64, wherein the MEMS units includes a metal bump on the connection pad.

71. The method of claim 70, wherein forming the metal bump uses a stud bump.

72. The method of claim 64, wherein forming the covering units on the substrate in joining together as a portion of the substrate.

73. The method of claim 64, further forming the adhesive material as a ring to surround the MEMS sensing element and further forming a bonding structure at outside of the ring.

74. The method of claim 64, further forming the adhesive material as a ring to surround the MEMS sensing element and forming a bonding structure included in the ring.

75. The method of claim 64, forming the covering units on a continuous substrate with a joining portion, wherein the step of dicing the MEMS units comprising:

removing the joining portion by etching; and

dicing the continuous substrate of the MEMS units.

76. The method of claim 64, before dicing the MEMS units, further comprising forming a supporting layer under the substrate of the MEMS units covering the first chamber to protect the MEMS sensing element from water jet during dicing.

77. The method of claim 76, before dicing the MEMS units, further comprising forming a protection layer over the covering units at an opposite side to the supporting layer to protect the MEMS sensing element from water jet during dicing.

78. The method of claim 64, wherein the covering units are formed on a continuous substrate with a joining portion, and the step of dicing the MEMS units comprising:

performing a first dicing to remove the joining portion; and

dicing the continuous substrate of the MEMS units.