Printable, Flexible and Stretchable Diamond for Thermal Management

• US 20100052112A1
• Filed: 04/03/2009
• Published: 03/04/2010
• Est. Priority Date: 04/03/2008
• Status: Active Grant

• Current Assignee: Board of Trustees of The University of Illinois, X Display Company Technology Limited (Sensinnovat BVBA), John Crane Incorporated (Smiths Group International Holdings Ltd.)
• Original Assignee: Advanced Diamond Technologies, Inc.
• Inventors: KIM, Dae Hyeong, CHOI, Won Mook, CARLISLE, John, KIM, Tae Ho, MENARD, Etienne, ROGERS, John A., MEITL, Matthew
• Granted Patent: US 8,470,701 B2
• Time in Patent Office: Days
• US Class Current: 257/625
• CPC Class Codes: B81B 7/0093 by cooling
• CPC Class Codes: B81C 1/0038 Processes for creating layers of materials not provided for in groups B81C1/00357 - B81C1/00373
• CPC Class Codes: B81C 2201/0191 Transfer of a layer from a carrier wafer to a device wafer
• CPC Class Codes: H01L 21/02381 Silicon, silicon germanium, germanium
• CPC Class Codes: H01L 21/02488 Insulating materials
• CPC Class Codes: H01L 21/02527 Carbon, e.g. diamond-like carbon
• CPC Class Codes: H01L 21/02595 polycrystalline
• CPC Class Codes: H01L 21/0262 Reduction or decomposition of gaseous compounds, e.g. CVD
• CPC Class Codes: H01L 21/02664 Aftertreatments planarisation in general H01L21/304
• CPC Class Codes: H01L 21/20 Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy
• CPC Class Codes: H01L 23/3732 Diamonds
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

Various heat-sinked components and methods of making heat-sinked components are disclosed where diamond in thermal contact with one or more heat-generating components are capable of dissipating heat, thereby providing thermally-regulated components. Thermally conductive diamond is provided in patterns capable of providing efficient and maximum heat transfer away from components that may be susceptible to damage by elevated temperatures. The devices and methods are used to cool flexible electronics, integrated circuits and other complex electronics that tend to generate significant heat. Also provided are methods of making printable diamond patterns that can be used in a range of devices and device components.

Claims

1. A method of making printable diamond patterns, the method comprising:

a. growing a diamond layer on a supporting substrate; and

b. patterning the diamond layer to form a plurality of diamond microstructures capable of printing to a receiving substrate.

2. The method of claim 1, wherein the diamond layer has a thickness that is less than or equal to 2 μ

m.

3. The method of claim 1, further comprising a bridge connected to an end of the diamond microstructure to provide registered transfer of the diamond microstructure from the supporting substrate to the receiving substrate.

4. The method of claim 1, further comprising printing the plurality of diamond microstructures to said receiving substrate.

5. The method of claim 4, wherein the substrate is part of a device or a device component.

6. The method of claim 5, wherein the diamond provides a performance characteristic to the device or device component, the performance characteristic selected from the group consisting of:

a. thermal dissipation;

b. hardness;

c. high modulus;

d. index of refraction;

e. bendability;

f. chemical inertness;

g. biocompatibility; and

h. wear resistance.

7. A method of manufacturing an electronic device capable of thermal regulation, said method comprising:

a. providing a substrate capable of supporting a device or a component thereof that generates heat;

b. printing a micropattern of diamond comprising a plurality of diamond features on at least a portion of a surface of the substrate, the device, or both;

wherein, the diamond is in thermal contact with the substrate, the device, or both, so that a change in substrate or device temperature from the generated heat results in a change in diamond temperature, thereby providing thermal regulation of the electronic device.

8. The method of claim 7, wherein the micropattern of diamond is thermally connected to a heat sink.

9. The method of claim 7, wherein the micropattern of diamond is printed by contact printing, and said printing step comprises:

a. providing a diamond layer supported by a supporting substrate;

b. patterning the diamond layer;

c. contacting at least a portion of the patterned diamond layer with an elastomer stamp receiving surface;

d. removing the patterned diamond layer by lifting the stamp in a direction that is away from the supporting substrate, thereby transferring at least a portion of the patterned diamond layer to the elastomer stamp receiving surface;

e. contacting the patterned diamond layer on the elastomer stamp receiving surface with the substrate; and

f. removing the stamp in a direction that is away from the substrate, thereby transferring the patterned diamond layer to the substrate surface.

10. The method of claim 9, wherein the diamond layer comprises ultrananocrystalline diamond or single crystal diamond.

11. The method of claim 9, wherein the patterned diamond layer further comprises tether or anchor regions for registered transfer of a plurality of diamond structures to the device by controlled transfer of a portion of the patterned diamond layer from the supporting substrate to the elastomer stamp surface.

12. The method of claim 9 further comprising:

a. providing the elastomer stamp receiving surface with a first level of strain;

b. bonding at least a portion of the patterned diamond layer to the stamp receiving surface; and

c. applying a force to the elastomer stamp that generates a change in the level of strain of the receiving surface from the first level to a second level of strain different than the first level of strain, wherein the change in the level of strain in the stamp causes the patterned diamond layer to bend, thereby generating a buckled micropattern of diamond.

13. A heat-sinked electronic component, comprising:

a. a micropattern of diamond comprising a plurality of microstructures capable of heat dissipation; and

b. a substrate capable of supporting a functional component of the electronic component, wherein the substrate or functional component is in thermal contact with at least a portion of the micropattern of diamond.

14. The electronic component of claim 13, wherein the diamond comprises a CVD diamond material, ultrananocrystalline diamond, or single crystal diamond.

15. The electronic component of claim 13, wherein the heat-sinked electronic component is flexible.

16. The electronic component of claim 13, wherein the substrate has a top surface and a bottom surface, and the electronic component is connected to the substrate top surface and the micropattern of diamond is bonded to the substrate bottom surface.

17. The electronic component of claim 13, wherein the electronic component is part of a device that is flexible, and said device is selected from the group consisting of:

a flexible display;

a flexible solar cell; and

a flexible electronic fabric.

18. The electronic component of claim 13, further comprising a heat sink that is connected to at least a portion of the diamond micropattern.

19. The electronic component of claim 13, wherein the micropattern comprises a plurality of substantially parallel ribbons, wherein the ribbons have a width that is less than 100 μ

m.

20. The electronic component of claim 19, wherein the ribbons are buckled.

21. The heat-sinked electronic component of claim 13, wherein said electronic component is incorporated into a high powered RF device and said device comprises:

a conductive substrate; and

a diamond layer between said electronic component and said conductive substrate;

wherein said diamond layer provides electrical insulation between said electronic component and said conductive substrate.