SEMICONDUCTOR DEVICE HAVING A SUSPENDED ISOLATING INTERCONNECT
First Claim
1. A semiconductor device configured to provide current and voltage isolation inside an integrated circuit package, the semiconductor device comprising:
- a first semiconductor die and a second semiconductor die;
a first isolating block positioned on the first semiconductor die;
a second isolating block positioned on the second semiconductor die;
a first interconnect coil having a plurality of wires connecting the first semiconductor die to the second isolating block, anda second interconnect coil having a plurality of wires connecting the second semiconductor die to the first isolating block.
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Accused Products
Abstract
A semiconductor device is configured to provide current and voltage isolation inside an integrated circuit package. The semiconductor device includes first and second semiconductor dies, a first isolating block positioned on the first semiconductor die, and a second isolating block positioned on the second semiconductor die. The semiconductor device also includes a first interconnect coil having a plurality of wires connecting the first semiconductor die to the second isolating block, and a second interconnect coil having a plurality of wires connecting the second semiconductor die to the first isolating block.
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Citations
34 Claims
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1. A semiconductor device configured to provide current and voltage isolation inside an integrated circuit package, the semiconductor device comprising:
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a first semiconductor die and a second semiconductor die; a first isolating block positioned on the first semiconductor die; a second isolating block positioned on the second semiconductor die; a first interconnect coil having a plurality of wires connecting the first semiconductor die to the second isolating block, and a second interconnect coil having a plurality of wires connecting the second semiconductor die to the first isolating block. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17)
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18. A semiconductor device configured to provide current and voltage isolation inside an integrated circuit package, the semiconductor device comprising:
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a lead frame including a first set of leads and a second set of leads, the first set of leads being isolated from the second set of leads; a semiconductor die positioned on the lead frame; an isolating block positioned on the semiconductor die; a first interconnect coil formed by a first set of wires, the semiconductor die, and the first set of leads; and a second interconnect coil isolated from the first interconnect coil and formed by a second set of wires, the isolating block, and the second set of leads. - View Dependent Claims (19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34)
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Specification