ELECTRONIC COMPONENT

• US 20100052838A1
• Filed: 08/31/2009
• Published: 03/04/2010
• Est. Priority Date: 09/01/2008
• Status: Active Grant

• Current Assignee: Murata Manufacturing Co Limited
• Original Assignee: Murata Manufacturing Co Limited
• Inventors: Matsuta, Katsuji, Kawaguchi, Masahiko
• Granted Patent: US 7,911,311 B2
• Time in Patent Office: Days
• US Class Current: 336/200
• CPC Class Codes: H01F 17/0013 with stacked layers
• CPC Class Codes: H01F 17/04 with magnetic core
• CPC Class Codes: H01F 27/292 Surface mounted devices

Abstract

An electronic component is configured to include a laminate disposed between first and second magnetic substrates. The laminate is formed by laminating resin insulating layers, a coil pattern, and a lead pattern. The coil pattern is connected to external electrodes disposed on end surfaces of the laminate by using internal electrodes. The electronic component further includes expansion relaxation portions disposed in the inside of the resin insulating layers and located in the vicinity of connection regions of the internal electrodes and the external electrodes. The expansion relaxation portions are formed by using a magnetic powder resin in which a ferrite powder and a resin material are mixed.

Claims

1. An electronic component comprising:

a ceramic substrate;

a laminate which is disposed on a surface of the ceramic substrate and in which an internal circuit formed from an electrode pattern is disposed in the inside of a plurality of laminated resin insulating layers;

internal electrodes electrically connected to the internal circuit and exposed at an end surfaces of the laminate; and

external electrodes disposed on the end surfaces of the laminate and electrically connected to the internal electrodes,

wherein the resin insulating layers are provided with expansion relaxation portions located in the vicinity where the internal electrodes and the external electrodes are connected to each other, the expansion relaxation portions being adapted to relax the expansion on the end surface sides.

2. The electronic component according to claim 1, wherein the expansion relaxation portions are configured to at least overlap the external electrodes when the laminate is viewed from the external electrode.

3. The electronic component according to claim 1, wherein the expansion relaxation portion comprises a mixed member in which a ceramic powder constituting the ceramic substrate and a resin material constituting the resin insulating layer are mixed.

4. The electronic component according to claim 1,

wherein the internal electrode is provided with an exposed end surface portion exposed at the end surface of the laminate, and

the expansion relaxation portion is configured to extend in the length direction of the exposed end surface portion in such a way as to overlap a region constituting 70% or more of the exposed end surface portion.

5. The electronic component according to claim 1,

wherein the ceramic substrate is formed from a magnetic substrate comprising a magnetic material,

the internal circuit is formed from a coil circuit composed of a spiral coil pattern serving as the electrode pattern, and

the expansion relaxation portion is formed from a magnetic powder resin which serves as the mixed member and in which a magnetic powder is mixed into a resin material.

6. The electronic component according to claim 1,

wherein the ceramic substrate is formed from a magnetic substrate comprising a magnetic material,

the internal circuit is formed from a common mode choke coil circuit in which two spiral coil patterns serving as the electrode patterns are disposed while being opposed to each other in the thickness direction, and

the expansion relaxation portion is formed by using a magnetic powder resin which serves as the mixed member and in which a magnetic powder is mixed into a resin material.

7. The electronic component according to claim 6,

wherein the resin insulating layers are provided with the expansion relaxation portions located on the outer perimeter side of the coil pattern, and a core portion located on the center side of the coil pattern and formed from the magnetic powder resin.

8. The electronic component according to claim 5,

wherein the resin insulating layers are provided with the expansion relaxation portions located on the outer perimeter side of the coil pattern, and a core portion located on the center side of the coil pattern and formed from the magnetic powder resin.

9. The electronic component according to claim 4,

wherein the ceramic substrate is formed from a magnetic substrate comprising a magnetic material,

the internal circuit is formed from a coil circuit composed of a spiral coil pattern serving as the electrode pattern, and

the expansion relaxation portion is formed from a magnetic powder resin which serves as the mixed member and in which a magnetic powder is mixed into a resin material.

10. The electronic component according to claim 3,

wherein the ceramic substrate is formed from a magnetic substrate comprising a magnetic material,

the internal circuit is formed from a coil circuit composed of a spiral coil pattern serving as the electrode pattern, and

the expansion relaxation portion is formed from a magnetic powder resin which serves as the mixed member and in which a magnetic powder is mixed into a resin material.

11. The electronic component according to claim 2,

wherein the ceramic substrate is formed from a magnetic substrate comprising a magnetic material,

the internal circuit is formed from a coil circuit composed of a spiral coil pattern serving as the electrode pattern, and

the expansion relaxation portion is formed from a magnetic powder resin which serves as the mixed member and in which a magnetic powder is mixed into a resin material.

12. The electronic component according to claim 2, wherein the expansion relaxation portion comprises a mixed member in which a ceramic powder constituting the ceramic substrate and a resin material constituting the resin insulating layer are mixed.

13. The electronic component according to claim 2,

wherein the internal electrode is provided with an exposed end surface portion exposed at the end surface of the laminate, and

the expansion relaxation portion is configured to extend in the length direction of the exposed end surface portion in such a way as to overlap a region constituting 70% or more of the exposed end surface portion.

14. The electronic component according to claim 3,

wherein the internal electrode is provided with an exposed end surface portion exposed at the end surface of the laminate, and

the expansion relaxation portion is configured to extend in the length direction of the exposed end surface portion in such a way as to overlap a region constituting 70% or more of the exposed end surface portion.

15. The electronic component according to claim 12,

wherein the internal electrode is provided with an exposed end surface portion exposed at the end surface of the laminate, and

the expansion relaxation portion is configured to extend in the length direction of the exposed end surface portion in such a way as to overlap a region constituting 70% or more of the exposed end surface portion.

16. The electronic component according to claim 5,

wherein the ceramic substrate is formed from a magnetic substrate comprising a magnetic material,

the internal circuit is formed from a common mode choke coil circuit in which two spiral coil patterns serving as the electrode patterns are disposed while being opposed to each other in the thickness direction, and

the expansion relaxation portion is formed by using a magnetic powder resin which serves as the mixed member and in which a magnetic powder is mixed into a resin material.

17. The electronic component according to claim 15,

wherein the ceramic substrate is formed from a magnetic substrate comprising a magnetic material,

the internal circuit is formed from a coil circuit composed of a spiral coil pattern serving as the electrode pattern, and

the expansion relaxation portion is formed from a magnetic powder resin which serves as the mixed member and in which a magnetic powder is mixed into a resin material.

18. The electronic component according to claim 14,

wherein the ceramic substrate is formed from a magnetic substrate comprising a magnetic material,

the internal circuit is formed from a coil circuit composed of a spiral coil pattern serving as the electrode pattern, and

the expansion relaxation portion is formed from a magnetic powder resin which serves as the mixed member and in which a magnetic powder is mixed into a resin material.

19. The electronic component according to claim 17,

wherein the ceramic substrate is formed from a magnetic substrate comprising a magnetic material,

the internal circuit is formed from a common mode choke coil circuit in which two spiral coil patterns serving as the electrode patterns are disposed while being opposed to each other in the thickness direction, and

the expansion relaxation portion is formed by using a magnetic powder resin which serves as the mixed member and in which a magnetic powder is mixed into a resin material.

20. The electronic component according to claim 18,

wherein the ceramic substrate is formed from a magnetic substrate comprising a magnetic material,

the internal circuit is formed from a common mode choke coil circuit in which two spiral coil patterns serving as the electrode patterns are disposed while being opposed to each other in the thickness direction, and

the expansion relaxation portion is formed by using a magnetic powder resin which serves as the mixed member and in which a magnetic powder is mixed into a resin material.