Bendable electronic device status information system and method

• US 20100053068A1
• Filed: 07/30/2009
• Published: 03/04/2010
• Est. Priority Date: 08/29/2008
• Status: Active Grant

• Current Assignee: The Invention Science Fund I, L.L.C. (Intellectual Ventures LLC)
• Original Assignee: Searete LLC (Intellectual Ventures LLC)
• Inventors: Cohen, Alexander J., Rinaldo, John D. JR., Lord, Richard T., Lord, Robert W., Jung, Edward K.Y., Levien, Royce A., Malamud, Mark A.
• Granted Patent: US 8,485,426 B2
• Time in Patent Office: Days
• US Class Current: 345/107
• CPC Class Codes: G09G 3/00 Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
• CPC Class Codes: G09G 3/035 for flexible display surfaces

Abstract

A method includes, but is not limited to: obtaining and sending one or more bendable electronic device physical status related information portions to the bendable electronic device based upon the obtaining of the first information. In addition to the foregoing, other related method/system aspects are described in the claims, drawings, and text forming a part of the present disclosure.

Claims

1. A method comprising:

obtaining first information regarding one or more positions of one or more portions of one or more regions of a bendable electronic device; and

sending one or more bendable electronic device physical status related information portions to the bendable electronic device based upon the obtaining of the first information.

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74. A system comprising:

circuitry for obtaining first information regarding one or more positions of one or more portions of one or more regions of a bendable electronic device; and

circuitry for sending one or more bendable electronic device physical status related information portions to the bendable electronic device based upon the obtaining of the first information.

75. The system of claim 74, wherein the circuitry for obtaining first information regarding one or more positions of one or more portions of one or more regions of a bendable electronic device comprises:

circuitry for obtaining detection information associated with one or more positions of one or more portions of one or more regions of the bendable electronic device.

77. The system of claim 74, wherein the circuitry for obtaining first information regarding one or more positions of one or more portions of one or more regions of a bendable electronic device comprises:

circuitry for obtaining stress information associated with one or more positions of one or more portions of one or more regions of the bendable electronic device.

80. The system of claim 74, wherein the circuitry for obtaining first information regarding one or more positions of one or more portions of one or more regions of a bendable electronic device comprises:

circuitry for obtaining surface contact information associated with one or more positions of one or more portions of one or more regions of the bendable electronic device.

82. The system of claim 74, wherein the circuitry for obtaining first information regarding one or more positions of one or more portions of one or more regions of a bendable electronic device comprises:

circuitry for obtaining geometrical information associated with one or more positions of one or more portions of one or more regions of the bendable electronic device.

85. The system of claim 74, wherein the circuitry for obtaining first information regarding one or more positions of one or more portions of one or more regions of a bendable electronic device comprises:

circuitry for obtaining information based on one or more associations between two or more of the positions of one or more portions of one or more regions of the bendable electronic device.

87. The system of claim 74, wherein the circuitry for obtaining first information regarding one or more positions of one or more portions of one or more regions of a bendable electronic device comprises:

circuitry for obtaining selection information associated with one or more positions of one or more portions of one or more regions of the bendable electronic device.

88. The system of claim 74, wherein the circuitry for obtaining first information regarding one or more positions of one or more portions of one or more regions of a bendable electronic device comprises:

circuitry for obtaining origami-like folding information associated with one or more positions of one or more portions of one or more regions of the bendable electronic device.

89. The system of claim 88, wherein obtaining origami-like folding information associated with one or more positions of one or more portions of one or more regions of the bendable electronic device comprises:

circuitry for obtaining information regarding one or more orders of folding sequences of one or more portions of one or more regions of the bendable electronic device associated with one or more positions of one or more portions of one or more regions of the bendable electronic device.

92. The system of claim 74, wherein the circuitry for obtaining first information regarding one or more positions of one or more portions of one or more regions of a bendable electronic device comprises:

circuitry for obtaining bend number information associated with one or more positions of one or more portions of one or more regions of the bendable electronic device.

95. The system of claim 74, wherein the circuitry for obtaining first information regarding one or more positions of one or more portions of one or more regions of a bendable electronic device comprises:

circuitry for obtaining substantially persistent information associated with one or more positions of one or more portions of one or more regions of the bendable electronic device.

97. The system of claim 74, wherein the circuitry for obtaining first information regarding one or more positions of one or more portions of one or more regions of a bendable electronic device comprises:

circuitry for obtaining connection sequence information of two or more connections between two or more of the portions of the one or more regions of the bendable electronic device associated with one or more positions of one or more portions of one or more regions of the bendable electronic device.

99. The system of claim 74, wherein the circuitry for obtaining first information regarding one or more positions of one or more portions of one or more regions of a bendable electronic device comprises:

circuitry for obtaining wrapping information associated with one or more positions of one or more portions of one or more regions of the bendable electronic device.

101. The system of claim 74, wherein the circuitry for obtaining first information regarding one or more positions of one or more portions of one or more regions of a bendable electronic device comprises:

circuitry for obtaining rolling information associated with one or more positions of one or more portions of one or more regions of the bendable electronic device.

104. The system of claim 74, wherein the circuitry for obtaining first information regarding one or more positions of one or more portions of one or more regions of a bendable electronic device comprises:

circuitry for obtaining folded to unfolded ratio information associated with one or more positions of one or more portions of one or more regions of the bendable electronic device.

105. The system of claim 74, wherein the circuitry for obtaining first information regarding one or more positions of one or more portions of one or more regions of a bendable electronic device comprises:

circuitry for obtaining bend location information associated with one or more positions of one or more portions of one or more regions of the bendable electronic device.

107. The system of claim 74, wherein the circuitry for obtaining first information regarding one or more positions of one or more portions of one or more regions of a bendable electronic device comprises:

circuitry for obtaining position information of the bendable electronic device relative to another bendable electronic device.

110. The system of claim 74, wherein the circuitry for obtaining first information regarding one or more positions of one or more portions of one or more regions of a bendable electronic device comprises:

circuitry for obtaining inclinometer information associated with one or more positions of the one or more portions of the one or more regions of the bendable electronic device.

112. The system of claim 74, wherein the circuitry for obtaining first information regarding one or more positions of one or more portions of one or more regions of a bendable electronic device comprises:

circuitry for obtaining gyroscopic information associated with one or more positions of the one or more portions of the one or more regions of the bendable electronic device.

114. The system of claim 74, wherein the circuitry for obtaining first information regarding one or more positions of one or more portions of one or more regions of a bendable electronic device comprises:

circuitry for obtaining geographical position information associated with one or more positions of the one or more portions of the one or more regions of the bendable electronic device.

117. The system of claim 74, wherein the circuitry for obtaining first information regarding one or more positions of one or more portions of one or more regions of a bendable electronic device comprises:

circuitry for obtaining position information relative to a table top reference grid associated with one or more positions of the one or more portions of the one or more regions of the bendable electronic device.

118. The system of claim 74, wherein the circuitry for obtaining first information regarding one or more positions of one or more portions of one or more regions of a bendable electronic device comprises:

circuitry for obtaining position information relative to other portions of the bendable electronic device associated with one or more positions of the one or more portions of the one or more regions of the bendable electronic device.

119. The system of claim 74, wherein the circuitry for obtaining first information regarding one or more positions of one or more portions of one or more regions of a bendable electronic device comprises:

circuitry for obtaining edge detection information relative to one or more edges of the bendable electronic device associated with one or more positions of the one or more portions of the one or more regions of the bendable electronic device.

121. The system of claim 74, wherein the circuitry for obtaining first information regarding one or more positions of one or more portions of one or more regions of a bendable electronic device comprises:

circuitry for obtaining position information relative to a light source associated with one or more positions of the one or more portions of the one or more regions of the bendable electronic device.

123. The system of claim 74, wherein the circuitry for obtaining first information regarding one or more positions of one or more portions of one or more regions of a bendable electronic device comprises:

circuitry for obtaining position information relative to an audio source associated with one or more positions of the one or more portions of the one or more regions of the bendable electronic device.

124. The system of claim 74, wherein the circuitry for obtaining first information regarding one or more positions of one or more portions of one or more regions of a bendable electronic device comprises:

circuitry for obtaining map location information associated with one or more positions of the one or more portions of the one or more regions of the bendable electronic device.

125. The system of claim 74, wherein the circuitry for obtaining first information regarding one or more positions of one or more portions of one or more regions of a bendable electronic device comprises:

circuitry for obtaining location information associated with one or more positions of the one or more portions of the one or more regions of the bendable electronic device.

127. The system of claim 74, wherein the circuitry for sending one or more bendable electronic device physical status related information portions to the bendable electronic device based upon the obtaining of the first information comprises:

circuitry for sending information associated with one or more conformations of one or more portions of one or more regions of the bendable electronic device.

128. The system of claim 74, wherein the circuitry for sending one or more bendable electronic device physical status related information portions to the bendable electronic device based upon the obtaining of the first information comprises:

circuitry for sending information associated with one or more changes in one or more conformations of one or more portions of one or more regions of the bendable electronic device.

129. The system of claim 74, wherein the circuitry for sending one or more bendable electronic device physical status related information portions to the bendable electronic device based upon the obtaining of the first information comprises:

circuitry for sending information associated with one or more sequences of two or more conformations of one or more portions of one or more regions of the bendable electronic device.

130. The system of claim 74, wherein the circuitry for sending one or more bendable electronic device physical status related information portions to the bendable electronic device based upon the obtaining of the first information comprises:

circuitry for sending information associated with one or more changes in one or more sequences of two or more conformations of one or more portions of one or more regions of the bendable electronic device.

131. The system of claim 74, wherein the circuitry for sending one or more bendable electronic device physical status related information portions to the bendable electronic device based upon the obtaining of the first information comprises:

circuitry for sending information associated with one or more orientations of one or more portions of one or more regions of the bendable electronic device.

132. The system of claim 74, wherein the circuitry for sending one or more bendable electronic device physical status related information portions to the bendable electronic device based upon the obtaining of the first information comprises:

circuitry for sending information associated with one or more changes in one or more orientations of one or more portions of one or more regions of the bendable electronic device.

133. The system of claim 74, wherein the circuitry for sending one or more bendable electronic device physical status related information portions to the bendable electronic device based upon the obtaining of the first information comprises:

circuitry for sending information associated with one or more sequences of two or more orientations of one or more portions of one or more regions of the bendable electronic device.

134. The system of claim 74, wherein the circuitry for sending one or more bendable electronic device physical status related information portions to the bendable electronic device based upon the obtaining of the first information comprises:

circuitry for sending information associated with one or more changes in one or more sequences of two or more orientations of one or more portions of one or more regions of the bendable electronic device.

135. The system of claim 74, wherein the circuitry for sending one or more bendable electronic device physical status related information portions to the bendable electronic device based upon the obtaining of the first information comprises:

circuitry for sending information associated with one or more orientations of one or more portions of one or more regions of the bendable electronic device with respect to another object.

136. The system of claim 74, wherein the circuitry for sending one or more bendable electronic device physical status related information portions to the bendable electronic device based upon the obtaining of the first information comprises:

circuitry for sending information associated with one or more changes in one or more orientations of one or more portions of one or more regions of the bendable electronic device with respect to another object.

137. The system of claim 74, wherein the circuitry for sending one or more bendable electronic device physical status related information portions to the bendable electronic device based upon the obtaining of the first information comprises:

circuitry for sending information associated with one or more sequences of two or more orientations of one or more portions of one or more regions of the bendable electronic device with respect to another object.

138. The system of claim 74, wherein the circuitry for sending one or more bendable electronic device physical status related information portions to the bendable electronic device based upon the obtaining of the first information comprises:

circuitry for sending information associated with one or more changes in one or more sequences of two or more orientations with respect to another object of one or more portions of one or more regions of the bendable electronic device with respect to another object.

139. The system of claim 74, wherein the circuitry for sending one or more bendable electronic device physical status related information portions to the bendable electronic device based upon the obtaining of the first information comprises:

circuitry for sending information associated with one or more locations of one or more portions of one or more regions of the bendable electronic device with respect to another object.

140. The system of claim 74, wherein the circuitry for sending one or more bendable electronic device physical status related information portions to the bendable electronic device based upon the obtaining of the first information comprises:

circuitry for sending information associated with one or more changes in one or more locations of one or more portions of one or more regions of the bendable electronic device with respect to another object.

141. The system of claim 74, wherein the circuitry for sending one or more bendable electronic device physical status related information portions to the bendable electronic device based upon the obtaining of the first information comprises:

circuitry for sending information associated with one or more sequences of two or more locations of one or more portions of one or more regions of the bendable electronic device with respect to another object.

142. The system of claim 74, wherein the circuitry for sending one or more bendable electronic device physical status related information portions to the bendable electronic device based upon the obtaining of the first information comprises:

circuitry for sending information associated with one or more changes in one or more sequences of two or more locations with respect to another object of one or more portions of one or more regions of the bendable electronic device with respect to another object.

143. The system of claim 74, wherein the circuitry for sending one or more bendable electronic device physical status related information portions to the bendable electronic device based upon the obtaining of the first information comprises:

circuitry for sending information associated with one or more GPS locations of one or more portions of one or more regions of the bendable electronic device with respect to another object.

144. The system of claim 74, wherein the circuitry for sending one or more bendable electronic device physical status related information portions to the bendable electronic device based upon the obtaining of the first information comprises:

circuitry for sending information associated with one or more changes in one or more GPS locations of one or more portions of one or more regions of the bendable electronic device with respect to another object.

145. The system of claim 74, wherein the circuitry for sending one or more bendable electronic device physical status related information portions to the bendable electronic device based upon the obtaining of the first information comprises:

circuitry for sending information associated with one or more sequences of two or more GPS locations of one or more portions of one or more regions of the bendable electronic device with respect to another object.

146. The system of claim 74, wherein the circuitry for sending one or more bendable electronic device physical status related information portions to the bendable electronic device based upon the obtaining of the first information comprises:

circuitry for sending information associated with one or more changes in one or more sequences of two or more GPS locations with respect to another object of one or more portions of one or more regions of the bendable electronic device with respect to another object.

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147. A system comprising:

means for obtaining first information regarding one or more positions of one or more portions of one or more regions of a bendable electronic device; and

means for sending one or more bendable electronic device physical status related information portions to the bendable electronic device based upon the obtaining of the first information.

148. A system comprising:

a signal-bearing medium bearing;

one or more instructions for obtaining first information regarding one or more positions of one or more portions of one or more regions of a bendable electronic device; and

one or more instructions for sending one or more bendable electronic device physical status related information portions to the bendable electronic device based upon the obtaining of the first information.