Display control based on bendable interface containing electronic device conformation sequence status

• US 20100053076A1
• Filed: 07/29/2009
• Published: 03/04/2010
• Est. Priority Date: 08/29/2008
• Status: Active Grant

• Current Assignee: The Invention Science Fund I, L.L.C. (Intellectual Ventures LLC)
• Original Assignee: Searete LLC (Intellectual Ventures LLC)
• Inventors: Cohen, Alexander J., Rinaldo, John D. JR., Lord, Richard T., Lord, Robert W., Jung, Edward K.Y., Levien, Royce A., Malamud, Mark A.
• Granted Patent: US 9,176,637 B2
• Time in Patent Office: Days
• US Class Current: 345/156
• CPC Class Codes: G06F 3/048 Interaction techniques based on graphical user interfaces [GUI]
• CPC Class Codes: H04M 1/0268 including a flexible display panel

Abstract

A system includes, but is not limited to: one and one or more display control modules configured to direct controlling display of one or more portions of the bendable interface containing electronic device regarding display of second information in response to the information associated with the one or more changes in one or more sequences of two or more conformations of the one or more portions of the one or more regions of the bendable interface containing electronic device. In addition to the foregoing, other related system/system aspects are described in the claims, drawings, and text forming a part of the present disclosure.

Claims

1. A system comprising:

one or more conformation sensor modules configured to direct obtaining information associated with one or more changes in one or more sequences of two or more conformations of one or more portions of one or more regions of a bendable interface containing electronic device; and

one or more display control modules configured to direct controlling display of one or more portions of the bendable interface containing electronic device regarding display of second information in response to the information associated with the one or more changes in one or more sequences of two or more conformations of the one or more portions of the one or more regions of the bendable interface containing electronic device.

2. The system of claim 1, wherein the one or more conformation sensor modules configured to direct obtaining information associated with one or more changes in one or more sequences of two or more conformations of one or more portions of one or more regions of a bendable interface containing electronic device comprises:

one or more conformation detection modules configured to direct detecting one or more changes in one or more sequences of two or more conformations of one or more portions of one or more regions of the bendable interface containing electronic device.

3. The system of claim 1, wherein the one or more conformation sensor modules configured to direct obtaining information associated with one or more changes in one or more sequences of two or more conformations of one or more portions of one or more regions of a bendable interface containing electronic device comprises:

one or more conformation strain modules configured to direct obtaining strain information associated with one or more changes in one or more sequences of two or more conformations of one or more portions of one or more regions of the bendable interface containing electronic device.

4. The system of claim 1, wherein the one or more conformation sensor modules configured to direct obtaining information associated with one or more changes in one or more sequences of two or more conformations of one or more portions of one or more regions of a bendable interface containing electronic device comprises:

one or more conformation stress modules configured to direct obtaining stress information associated with one or more changes in one or more sequences of two or more conformations of one or more portions of one or more regions of the bendable interface containing electronic device.

5. The system of claim 1, wherein the one or more conformation sensor modules configured to direct obtaining information associated with one or more changes in one or more sequences of two or more conformations of one or more portions of one or more regions of a bendable interface containing electronic device comprises:

one or more conformation calibration modules configured to direct obtaining calibration related information associated with one or more changes in one or more sequences of two or more conformations of one or more portions of one or more regions of the bendable interface containing electronic device.

6. The system of claim 1, wherein the one or more conformation sensor modules configured to direct obtaining information associated with one or more changes in one or more sequences of two or more conformations of one or more portions of one or more regions of a bendable interface containing electronic device comprises:

one or more conformation pattern modules configured to direct obtaining pattern information associated with one or more changes in one or more sequences of two or more conformations of one or more portions of one or more regions of the bendable interface containing electronic device.

7. The system of claim 1, wherein the one or more conformation sensor modules configured to direct obtaining information associated with one or more changes in one or more sequences of two or more conformations of one or more portions of one or more regions of a bendable interface containing electronic device comprises:

one or more surface contact modules configured to direct obtaining surface contact information associated with one or more changes in one or more sequences of two or more conformations of one or more portions of one or more regions of the bendable interface containing electronic device.

8. The system of claim 1, wherein the one or more conformation sensor modules configured to direct obtaining information associated with one or more changes in one or more sequences of two or more conformations of one or more portions of one or more regions of a bendable interface containing electronic device comprises:

one or more conformation sequence modules configured to direct obtaining sequence information associated with one or more changes in two or more sequences of two or more conformations of one or more portions of one or more regions of the bendable interface containing electronic device.

9. The system of claim 1, wherein the one or more conformation sensor modules configured to direct obtaining information associated with one or more changes in one or more sequences of two or more conformations of one or more portions of one or more regions of a bendable interface containing electronic device comprises:

one or more conformation geometry modules configured to direct obtaining geometrical information associated with one or more changes in one or more sequences of two or more conformations of one or more portions of one or more regions of the bendable interface containing electronic device.

10. The system of claim 1, wherein the one or more conformation sensor modules configured to direct obtaining information associated with one or more changes in one or more sequences of two or more conformations of one or more portions of one or more regions of a bendable interface containing electronic device comprises:

one or more conformation indicia modules configured to direct obtaining information related to predetermined indicia associated with one or more changes in one or more sequences of two or more conformations of one or more portions of one or more regions of the bendable interface containing electronic device.

11. The system of claim 1, wherein the one or more conformation sensor modules configured to direct obtaining information associated with one or more changes in one or more sequences of two or more conformations of one or more portions of one or more regions of a bendable interface containing electronic device comprises:

one or more optical fiber modules configured to direct obtaining optical fiber derived information associated with one or more changes in one or more sequences of two or more conformations of one or more portions of one or more regions of the bendable interface containing electronic device.

12. The system of claim 1, wherein the one or more conformation sensor modules configured to direct obtaining information associated with one or more changes in one or more sequences of two or more conformations of one or more portions of one or more regions of a bendable interface containing electronic device comprises:

one or more conformation association modules configured to direct obtaining information based on one or more changes in one or more sequences of one or more associations between two or more of the portions of the one or more regions of the bendable interface containing electronic device associated with the two or more conformations of the one or more portions of the one or more regions of the bendable interface containing electronic device.

13. The system of claim 1, wherein the one or more conformation sensor modules configured to direct obtaining information associated with one or more changes in one or more sequences of two or more conformations of one or more portions of one or more regions of a bendable interface containing electronic device comprises:

one or more conformation signal modules configured to direct receiving signals from embedded sensors.

14. The system of claim 1, wherein the one or more conformation sensor modules configured to direct obtaining information associated with one or more changes in one or more sequences of two or more conformations of one or more portions of one or more regions of a bendable interface containing electronic device comprises:

one or more conformation selection modules configured to direct obtaining selection information associated with one or more changes in one or more sequences of two or more conformations of one or more portions of one or more regions of the bendable interface containing electronic device.

15. The system of claim 1, wherein the one or more conformation sensor modules configured to direct obtaining information associated with one or more changes in one or more sequences of two or more conformations of one or more portions of one or more regions of a bendable interface containing electronic device comprises:

one or more origami-like folding modules configured to direct obtaining origami-like folding information associated with one or more changes in one or more sequences of two or more conformations of one or more portions of one or more regions of the bendable interface containing electronic device.

16. The system of claim 15, wherein one or more origami-like folding modules configured to direct obtaining origami-like folding information associated with one or more changes in one or more sequences of two or more conformations of one or more portions of one or more regions of the bendable interface containing electronic device comprises:

one or more folding sequence modules configured to direct obtaining one or more orders of folding sequences of one or more portions of one or more regions of the bendable interface containing electronic device.

17. The system of claim 15, wherein one or more origami-like folding modules configured to direct obtaining origami-like folding information associated with one or more changes in one or more sequences of two or more conformations of one or more portions of one or more regions of the bendable interface containing electronic device comprises:

one or more origami-like shape modules configured to direct obtaining one or more changes in one or more sequences of two or more origami-like shapes resultant from one or more folding sequences of one or more portions of one or more regions of the bendable interface containing electronic device.

18. The system of claim 1, wherein the one or more conformation sensor modules configured to direct obtaining information associated with one or more changes in one or more sequences of two or more conformations of one or more portions of one or more regions of a bendable interface containing electronic device comprises:

one or more bend angle modules configured to direct obtaining angle of bend information associated with one or more changes in one or more sequences of two or more conformations of one or more portions of one or more regions of the bendable interface containing electronic device.

19. The system of claim 1, wherein the one or more conformation sensor modules configured to direct obtaining information associated with one or more changes in one or more sequences of two or more conformations of one or more portions of one or more regions of a bendable interface containing electronic device comprises:

one or more bend number modules configured to direct obtaining bend number information associated with one or more changes in one or more sequences of two or more conformations of one or more portions of one or more regions of the bendable interface containing electronic device.

20. The system of claim 1, wherein the one or more conformation sensor modules configured to direct obtaining information associated with one or more changes in one or more sequences of two or more conformations of one or more portions of one or more regions of a bendable interface containing electronic device comprises:

one or more conformation force modules configured to direct obtaining force information associated with one or more changes in one or more sequences of two or more conformations of one or more portions of one or more regions of the bendable interface containing electronic device.

21. The system of claim 1, wherein the one or more conformation sensor modules configured to direct obtaining information associated with one or more changes in one or more sequences of two or more conformations of one or more portions of one or more regions of a bendable interface containing electronic device comprises:

one or more conformation transient modules configured to direct obtaining substantially transient information associated with one or more changes in one or more sequences of two or more conformations of one or more portions of one or more regions of the bendable interface containing electronic device.

22. The system of claim 1, wherein the one or more conformation sensor modules configured to direct obtaining information associated with one or more changes in one or more sequences of two or more conformations of one or more portions of one or more regions of a bendable interface containing electronic device comprises:

one or more conformation persistent modules configured to direct obtaining substantially persistent information associated with one or more changes in one or more sequences of two or more conformations of one or more portions of one or more regions of the bendable interface containing electronic device.

23. The system of claim 1, wherein the one or more conformation sensor modules configured to direct obtaining information associated with one or more changes in one or more sequences of two or more conformations of one or more portions of one or more regions of a bendable interface containing electronic device comprises:

one or more conformation gesture modules configured to direct obtaining gestured information associated with one or more changes in one or more sequences of two or more conformations of one or more portions of one or more regions of the bendable interface containing electronic device.

24. The system of claim 1, wherein the one or more conformation sensor modules configured to direct obtaining information associated with one or more changes in one or more sequences of two or more conformations of one or more portions of one or more regions of a bendable interface containing electronic device comprises:

one or more conformation connection modules configured to direct obtaining connection sequence information of one or more changes in one or more sequences of two or more connections between two or more of the portions of the one or more regions of the electronic paper associated with one or more changes in one or more sequences of two or more conformations of one or more portions of one or more regions of the bendable interface containing electronic device.

25. The system of claim 1, wherein the one or more conformation sensor modules configured to direct obtaining information associated with one or more changes in one or more sequences of two or more conformations of one or more portions of one or more regions of a bendable interface containing electronic device comprises:

one or more conformation draping modules configured to direct obtaining draping information associated with one or more changes in one or more sequences of two or more conformations of one or more portions of one or more regions of the bendable interface containing electronic device.

26. The system of claim 1, wherein the one or more conformation sensor modules configured to direct obtaining information associated with one or more changes in one or more sequences of two or more conformations of one or more portions of one or more regions of a bendable interface containing electronic device comprises:

one or more conformation wrapping modules configured to direct obtaining wrapping information associated with one or more changes in one or more sequences of two or more conformations of one or more portions of one or more regions of the bendable interface containing electronic device.

27. The system of claim 1, wherein the one or more conformation sensor modules configured to direct obtaining information associated with one or more changes in one or more sequences of two or more conformations of one or more portions of one or more regions of a bendable interface containing electronic device comprises:

one or more conformation curvilinear modules configured to direct obtaining information derived through sensing one or more changes in one or more sequences of two or more curvilinear patterns of force imparted upon one or more portions of one or more regions of the bendable interface containing electronic device.

28. The system of claim 1, wherein the one or more conformation sensor modules configured to direct obtaining information associated with one or more changes in one or more sequences of two or more conformations of one or more portions of one or more regions of a bendable interface containing electronic device comprises:

one or more conformation rolling modules configured to direct obtaining rolling information associated with one or more changes in one or more sequences of two or more conformations of one or more portions of one or more regions of the bendable interface containing electronic device.

29. The system of claim 1, wherein the one or more conformation sensor modules configured to direct obtaining information associated with one or more changes in one or more sequences of two or more conformations of one or more portions of one or more regions of a bendable interface containing electronic device comprises:

one or more conformation hinge modules configured to direct obtaining hinge status information associated with one or more changes in one or more sequences of two or more conformations of one or more portions of one or more regions of the bendable interface containing electronic device.

30. The system of claim 1, wherein the one or more conformation sensor modules configured to direct obtaining information associated with one or more changes in one or more sequences of two or more conformations of one or more portions of one or more regions of a bendable interface containing electronic device comprises:

one or more bend radius modules configured to direct filtering information based upon radius of bend associated with one or more changes in one or more sequences of two or more conformations of one or more portions of one or more regions of the bendable interface containing electronic device.

31. The system of claim 1, wherein the one or more conformation sensor modules configured to direct obtaining information associated with one or more changes in one or more sequences of two or more conformations of one or more portions of one or more regions of a bendable interface containing electronic device comprises:

one or more conformation fold ratio modules configured to direct obtaining folded to unfolded ratio information associated with one or more changes in one or more sequences of two or more conformations of one or more portions of one or more regions of the bendable interface containing electronic device.

32. The system of claim 1, wherein the one or more conformation sensor modules configured to direct obtaining information associated with one or more changes in one or more sequences of two or more conformations of one or more portions of one or more regions of a bendable interface containing electronic device comprises:

one or more bend location modules configured to direct obtaining bend location information associated with one or more changes in one or more sequences of two or more conformations of one or more portions of one or more regions of the bendable interface containing electronic device.

33. The system of claim 1, wherein the one or more display control modules configured to direct controlling display of one or more portions of the bendable interface containing electronic device regarding display of second information in response to the information associated with the one or more changes in one or more sequences of two or more conformations of the one or more portions of the one or more regions of the bendable interface containing electronic device comprises:

one or more second information display modules configured to direct displaying the second information as having one or more classifications.

34. The system of claim 1, wherein the one or more display control modules configured to direct controlling display of one or more portions of the bendable interface containing electronic device regarding display of second information in response to the information associated with the one or more changes in one or more sequences of two or more conformations of the one or more portions of the one or more regions of the bendable interface containing electronic device comprises:

one or more private content blocking modules configured to direct displaying public content on one or more portions of a surface display portion viewable from a display surface and to block an internal display portion from displaying private content that would otherwise be viewed from the display surface from being viewed from the display surface.

35. The system of claim 1, wherein the one or more display control modules configured to direct controlling display of one or more portions of the bendable interface containing electronic device regarding display of second information in response to the information associated with the one or more changes in one or more sequences of two or more conformations of the one or more portions of the one or more regions of the bendable interface containing electronic device comprises:

one or more public content modules configured to direct displaying public content on one or more portions of the bendable interface containing electronic device.

36. The system of claim 1, wherein the one or more display control modules configured to direct controlling display of one or more portions of the bendable interface containing electronic device regarding display of second information in response to the information associated with the one or more changes in one or more sequences of two or more conformations of the one or more portions of the one or more regions of the bendable interface containing electronic device comprises:

one or more private content modules configured to direct displaying private content on one or more portions of the bendable interface containing electronic device.

37. The system of claim 1, wherein the one or more display control modules configured to direct controlling display of one or more portions of the bendable interface containing electronic device regarding display of second information in response to the information associated with the one or more changes in one or more sequences of two or more conformations of the one or more portions of the one or more regions of the bendable interface containing electronic device comprises:

one or more non-private content modules configured to direct displaying other than private content on one or more portions of the bendable interface containing electronic device.

38. The system of claim 1, wherein the one or more display control modules configured to direct controlling display of one or more portions of the bendable interface containing electronic device regarding display of second information in response to the information associated with the one or more changes in one or more sequences of two or more conformations of the one or more portions of the one or more regions of the bendable interface containing electronic device comprises:

one or more non-public content modules configured to direct displaying other than public content on one or more portions of the bendable interface containing electronic device.

39. The system of claim 1, wherein the one or more display control modules configured to direct controlling display of one or more portions of the bendable interface containing electronic device regarding display of second information in response to the information associated with the one or more changes in one or more sequences of two or more conformations of the one or more portions of the one or more regions of the bendable interface containing electronic device comprises:

one or more conformation comparison modules configured to direct comparing stored data with the first information associated with one or more conformations of one or more portions of one or more regions of the bendable interface containing electronic device; and

one or more comparison display modules configured to direct displaying on one or more portions of the bendable interface containing electronic device in response to the one or more conformation comparison modules configured to direct comparing stored data with the first information associated with one or more conformations of one or more portions of one or more regions of the bendable interface containing electronic device.

40. The system of claim 1, wherein the one or more display control modules configured to direct controlling display of one or more portions of the bendable interface containing electronic device regarding display of second information in response to the information associated with the one or more changes in one or more sequences of two or more conformations of the one or more portions of the one or more regions of the bendable interface containing electronic device comprises:

one or more classification selection modules configured to direct selecting one or more of the classifications of the second information having one or more classifications; and

one or more selection display modules configured to direct displaying on one or more portions of the bendable interface containing electronic device in response to the selected one or more of the classifications of the second information having one or more classifications.

41. The system of claim 1, wherein the one or more display control modules configured to direct controlling display of one or more portions of the bendable interface containing electronic device regarding display of second information in response to the information associated with the one or more changes in one or more sequences of two or more conformations of the one or more portions of the one or more regions of the bendable interface containing electronic device comprises:

one or more non-classification selection modules configured to direct selecting other than one or more of the classifications of the second information having one or more classifications; and

one or more other selection display modules configured to direct displaying on one or more portions of the bendable interface containing electronic device in response to the selected other than one or more of the classifications of the second information having one or more classifications.