×

High-density patch-panel assemblies for optical fiber telecommunications

  • US 20100054681A1
  • Filed: 09/02/2008
  • Published: 03/04/2010
  • Est. Priority Date: 09/02/2008
  • Status: Active Grant
First Claim
Patent Images

1. A patch panel assembly for a telecommunication data center for providing optical connections using bend-insensitive optical fiber cables, comprising:

  • a rectangular, box-like housing having an interior region, a front side and a back side and that is sized to be operably supported by a standard telecommunications rack; and

    a front mounting frame and at least one interior mounting frame, wherein the mounting frames are configured to support at least one reduced-form-factor patch panel module, wherein the at least one reduced-form-factor patch panel module has an interior and a plurality of jacks, each jack defining a front side port and a backside port.

View all claims
  • 2 Assignments
Timeline View
Assignment View
    ×
    ×