MASK FOR THIN FILM DEPOSITION AND METHOD OF MANUFACTURING OLED USING THE SAME

• US 20100055810A1
• Filed: 01/23/2009
• Published: 03/04/2010
• Est. Priority Date: 09/01/2008
• Status: Active Grant

• Current Assignee: Samsung Display Company Limited (Samsung Electronics Co. Ltd.)
• Original Assignee: Samsung Mobile Display Company Limited (Samsung Electronics Co. Ltd.)
• Inventors: SUNG, Dong-Young, Kim, Hong-Ryul
• Granted Patent: US 9,441,288 B2
• Time in Patent Office: Days
• US Class Current: 438/22
• CPC Class Codes: B05B 12/20 Masking elements, i.e. elements defining uncoated areas on an object to be coated
• CPC Class Codes: C23C 14/042 using masks
• CPC Class Codes: C23C 16/042 using masks
• CPC Class Codes: C23C 18/1605 by masking
• CPC Class Codes: C30B 25/04 Pattern deposit, e.g. by using masks
• CPC Class Codes: H10K 50/11 characterised by the electroluminescent [EL] layers
• CPC Class Codes: H10K 71/166 using selective deposition, e.g. using a mask

Abstract

A mask for thin film deposition used in forming an organic thin film or a conductive layer in an organic light emitting device is disclosed. In one embodiment, the mask includes i) a base member, ii) a plurality of slits configured to penetrate through the base member, wherein the plurality of slits have a predetermined length and extend in a first direction, wherein the plurality of slits comprise an outermost slit positioned in an outermost in a second direction having a predetermined angle with respect to the first direction, and wherein the outermost slit comprises two sub-slits separated from each other and iii) a rib supporting part formed between and contacting the two sub-slits, wherein the rib supporting part extends from a rib which is adjacent to the outermost slit.

Claims

1. A mask for thin film deposition, comprising:

a base member; and

a plurality of slits penetrating through the base member, wherein the plurality of slits have a predetermined length and extend in a first direction, wherein the plurality of slits comprise an outermost slit positioned in an outermost location in a second direction having a predetermined angle with respect to the first direction, and wherein the outermost slit comprises two sub-slits separated from each other by a rib supporting part.

2. The mask for thin film deposition as claimed in claim 1, wherein the rib supporting part is integrally formed with the base member.

3. The mask for thin film deposition as claimed in claim 2, wherein the width of the rib supporting part is about 10 μ

m to about 100 μ

m.

4. The mask for thin film deposition as claimed in claim 3, wherein the length of the slits is about 2 cm.

5. The mask for thin film deposition as claimed in claim 1, wherein the base member is formed of a metal material.

6. The mask for thin film deposition as claimed in claim 1, further comprising:

a frame comprising a pair of first sides and second sides opposed to each other, wherein an opening is defined in the frame by the inner perimeter of the first and second sides,

wherein at least one of the first sides and second sides is connected to an edge of the base member.

7. The mask for thin film deposition as claimed in claim 1, further comprising:

a mask strip comprising the base member, the plurality of slits, and the rib supporting part;

a second mask strip comprising a second base member and a plurality of silts defined in the second base member, wherein the second mask strip does not include a rib supporting part; and

a frame comprising a pair of first sides and second sides opposed to each other, wherein an opening is defined in the frame by the inner perimeter of the first and second sides,

wherein both longitudinal ends of the first mask strip and both longitudinal ends of the second mask strip are bonded to the first sides, and wherein an outermost slit of the first mask strip is arranged most adjacent to the second sides.

8. The mask for thin film deposition as claimed in claim 1, wherein the rib supporting part extends from a rib which is adjacent to the outermost slit.

9. A method of manufacturing an organic light emitting device, comprising:

providing a mask which comprises i) a base member, ii) a plurality of slits defined in and passing through the base member, wherein the plurality of slits comprise an outermost slit separated into two sub-slits and iii) a rib supporting part formed between the two sub-slits, and wherein the rib supporting part extends from a rib which is adjacent to the outermost slit; and

depositing an organic light emitting film, through the slits of the mask, between first and second electrodes of the organic light emitting device, wherein the first and second electrodes are formed over a substrate.

10. The method of manufacturing the organic light emitting device as claimed in claim 9, further comprising:

applying, with the use of a magnet array, magnetic force to the mask so that the mask is closely adhered to the substrate, wherein the substrate is disposed between the mask and the magnet array, wherein the magnet array comprises a plurality of magnets in a stripe shape, and wherein an extended direction of the magnets have a predetermined angle with the length direction of the plurality of slits of the mask.

11. The method of manufacturing the organic light emitting device as claimed in claim 9, wherein the width of the rib supporting part is about 10 μ

m to about 100 μ

m.

12. The method of manufacturing the organic light emitting device as claimed in claim 9, wherein the length of the slits is at least about 2 cm.

20. The mask for thin film deposition as claimed in claim 12, wherein the rib support is integrally formed with the base member.

13. A mask for thin film deposition, comprising:

a base member;

a plurality of through-slits defined in the base member, wherein the plurality of through-slits have a predetermined length and extend in a first direction, and wherein the plurality of through-slits comprise an outermost slit separated into two sub-slits;

a plurality of ribs each being formed between two adjacent ones of the plurality of through-slits, wherein the plurality of ribs comprise an outermost rib adjacent to the outermost slit; and

a rib support extending from the outermost rib and between the two sub-slits.

14. The mask for thin film deposition as claimed in claim 13, wherein the plurality of through-slits are substantially parallel with each other.

15. The mask for thin film deposition as claimed in claim 13, wherein the width of the outermost slit is about 50 μ

m.

16. The mask for thin film deposition as claimed in claim 13, wherein the width of the outermost rib is about 10 μ

m to about 100 μ

m.

17. The mask for thin film deposition as claimed in claim 13, further comprising:

a frame comprising a pair of first sides and second sides opposing each other, wherein an opening is defined in the frame by the inner perimeter of the first and second sides,

wherein at least one of the first sides and second sides is connected to an edge of the base member.

18. The mask for thin film deposition as claimed in claim 13, further comprising:

a mask strip comprising the base member, the plurality of through-slits, a plurality of ribs and the rib support; and

a second mask strip comprising i) a second base member, ii) a plurality of through-silts defined in the second base member and iii) a plurality of ribs.

19. The mask for thin film deposition as claimed in claim 18, further comprising:

a frame comprising a pair of first sides and second sides opposing each other, wherein an opening is defined in the frame by the inner perimeter of the first and second sides,

wherein both longitudinal ends of the first mask strip and both longitudinal ends of the second mask strip are bonded to the first sides, and wherein an outermost slit of the first mask strip is arranged adjacent to the second sides.