Method of Packaging Light Emitting Diode on Through-Hole Substrate

• US 20100055813A1
• Filed: 09/08/2008
• Published: 03/04/2010
• Est. Priority Date: 08/27/2008
• Status: Abandoned Application

• Current Assignee: National Central University
• Original Assignee: National Central University
• Inventors: Lee, Tsung-Xian, SUN, Ching-cherng
• Application Number:
  US12/206,710
• Publication Number:
  US 20100055813A1
• Time in Patent Office: Days
• US Class Current: 438/27
• CPC Class Codes: H01L 2933/0041 relating to wavelength conversion elements
• CPC Class Codes: H01L 33/505 characterised by the shape, e.g. plate or foil
• CPC Class Codes: H01L 33/56 Materials, e.g. epoxy or silicone resin
• CPC Class Codes: H01L 33/58 Optical field-shaping elements

Abstract

In a method of packaging a light emitting diode on a through-hole substrate, through holes are created and a wire bonded light emitting diode (LED) chip is set on the substrate, and a lens is set on the through holes and the wire bonded LED chip. The through holes are provided for filling a phosphor into the lens and extracting air in the lens, so that the phosphor can be coated uniformly on the wire bonded LED chip. After the phosphor is solidified, the packaging of the LED is completed. The method can produce a desired shape of the phosphor while the cost is being taken into consideration, and thus the invention can help manufacturers to produce an accurate shape of the phosphor to provide an LED light source of a better quality without involving a complicated procedure.

Claims

1. A method of packaging a light emitting diode on a through-hole substrate, comprising the steps of:

providing a substrate, and the substrate comprising a plurality of through holes and a wire bonded LED chip;

providing a lens having at least one phosphor containing groove, for combining the lens onto the substrate, and containing the wire bonded LED chip and the through holes;

filling an appropriate amount of phosphor into the phosphor containing groove from the through holes, and extracting air in the phosphor containing groove; and

solidifying the phosphor to complete packaging a light emitting diode.

2. The method of packaging a light emitting diode on a through-hole substrate as recited in claim 1, wherein the at least one phosphor containing groove comes with a size and a shape including a horizontal shape, a wavy shape, an arc shape and an irregular shape.

3. The method of packaging a light emitting diode on a through-hole substrate as recited in claim 1, wherein the lens is made of a transparent optical material.

4. The method of packaging a light emitting diode on a through-hole substrate as recited in claim 1, wherein the phosphor comes with a required quantity including a multilayer, an uneven thickness and an unequal thickness.

5. The method of packaging a light emitting diode on a through-hole substrate as recited in claim 1, wherein the phosphor comprises a fluorescent powder and a glue.

6. The method of packaging a light emitting diode on a through-hole substrate as recited in claim 1, wherein the phosphor is solidified by a baking method.