Communications connector with multi-stage compensation

• US 20100055969A1
• Filed: 08/13/2009
• Published: 03/04/2010
• Est. Priority Date: 08/13/2008
• Status: Active Grant

• Current Assignee: Panduit Corporation
• Original Assignee: Panduit Corporation
• Inventors: Straka, Frank M., Yuan, Michael K.
• Granted Patent: US 7,927,153 B2
• Time in Patent Office: Days
• US Class Current: 439/404
• CPC Class Codes: H01R 13/6466 on substrates, e.g. printed circuit boards [PCB]
• CPC Class Codes: H01R 13/6625 with capacitive component
• CPC Class Codes: H01R 13/6658 on printed circuit board H01R13/6666 - H01R13/6691 take precedence
• CPC Class Codes: H01R 24/64 for high frequency, e.g. RJ 45
• CPC Class Codes: H05K 1/0228 Compensation of cross-talk by a mutually correlated lay-out of printed circuit traces, e.g. for compensation of cross-talk in mounted connectors balanced signal pairs H05K1/0245
• CPC Class Codes: H05K 1/162 incorporating printed capacitors
• CPC Class Codes: H05K 2201/10189 Non-printed connector
• CPC Class Codes: Y10S 439/941 Crosstalk suppression

Abstract

A communication connector uses compensation circuitry to compensate for crosstalk in a network connection. Capacitors are connected between specific conducive paths in said communication connector. Inductive stubs are utilized in the compensation circuitry to improve the overall compensation performance.

Claims

1. A communication jack for use in a communication network, said jack comprising:

a plurality of current-carrying paths through the communication jack, said current-carrying paths comprising at least first and second signal pairs of conductors, each of said signal pairs comprising a first and a second conductive pathway;

compensation circuitry adapted to decrease the overall crosstalk when said communication jack is connected to a plug, said compensation circuitry comprising;

a first pad capacitor connected between the second conductive pathway of the first signal pair and the first conductive pathway of the second signal pair;

a second pad capacitor connected between the first conductive pathway of the first signal pair and the second conductive pathway of the second signal pair;

a third pad capacitor connected between the first conductive pathway of the first signal pair and the first conductive pathway of the second signal pair, with first and second inductive stubs further being positioned between said first conductive pathway of said first signal pair and said first conductive pathway of said second signal pair on opposing sides of said third pad capacitor; and

a fourth pad capacitor connected between the second conductive pathway of the first signal pair and the second conductive pathway of the second signal pair, with third and fourth inductive stubs further being positioned between said second conductive pathway of said first signal pair and said second conductive pathway of said second signal pair.

2. The communication jack of claim 1 wherein said current-carrying paths comprise four pairs of conductive pathways numbered one through eight, and wherein said first signal pair comprises the fourth and fifth conductive pathways and said second signal pair comprises the third and sixth conductive pathways.

3. The communication jack of claim 1 wherein said compensation circuitry is provided on a rigid circuit board within said communication jack.

4. The communication jack of claim 1 further comprising a plurality of plug interface contacts adapted to make conductive contact with contacts of a plug, each of said plug interface contacts comprising a portion of one of said current-carrying paths.

5. The communication jack of claim 1 further comprising a plurality of insulation displacement contacts, each of said insulation displacement contacts comprising a portion of one of said current-carrying paths.