METHOD OF MANUFACTURING IMPLANTABLE WIRELESS SENSOR FOR IN VIVO PRESSURE MEASUREMENT
First Claim
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1. A method of manufacturing a sensor for in vivo applications, comprising the steps of:
- providing first and second wafers of an electrically insulating material;
forming a recess in said first wafer;
forming a first capacitor plate in said recess of said first wafer;
forming a second capacitor plate in a corresponding region of said second wafer;
mutually imposing said first and second wafers such that said first and second capacitor plates are arranged in parallel, spaced-apart relation; and
affixing said first and second wafers to one another in said mutually imposed position.
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Abstract
A method of manufacturing a sensor for in vivo applications includes the steps of providing two wafers of an electrically insulating material. A recess is formed in the first wafer, and a capacitor plate is formed in the recess of the first wafer. A second capacitor plate is formed in a corresponding region of the second wafer, and the two wafers are affixed to one another such that the first and second capacitor plates are arranged in parallel, spaced-apart relation.
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Citations
30 Claims
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1. A method of manufacturing a sensor for in vivo applications, comprising the steps of:
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providing first and second wafers of an electrically insulating material; forming a recess in said first wafer; forming a first capacitor plate in said recess of said first wafer;
forming a second capacitor plate in a corresponding region of said second wafer;mutually imposing said first and second wafers such that said first and second capacitor plates are arranged in parallel, spaced-apart relation; and affixing said first and second wafers to one another in said mutually imposed position. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23)
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24. A method of manufacturing a sensor for in vivo applications, comprising the steps of:
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providing three wafers of an electrically non-conductive material; forming first and second capacitor plates on an upper surface of a first of said three wafers; forming a third capacitor plate on a lower surface of a second of said three wafers; mutually imposing said first and second wafers such that said third capacitor plate is positioned in generally parallel, spaced-apart relation from said first and second capacitor plates; positioning an inductor coil having first and second leads on top of an upper surface of said second wafer; electrically connecting a first one of said inductor coil leads to said first capacitor plate; electrically connecting a second one of said inductor coil leads to said second capacitor plate; forming a cavity in a third of said three wafers sufficient to receive said inductor coil; positioning said third wafer on top of said second wafer with said inductor coil being received within said cavity of said third wafer; and bonding said second wafer to said first and third wafers. - View Dependent Claims (25)
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26. A method of manufacturing a sensor for in vivo applications, comprising the steps of:
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forming a bottom plate on a wafer of electrically insulating material; forming a sacrificial layer over said bottom plate; forming a top plate on top of said sacrificial layer; and removing said sacrificial layer to leave said bottom and top plates in spaced-apart relation. - View Dependent Claims (27)
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28. A method of manufacturing a sensor for in vivo applications, comprising the steps of:
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providing first and second wafers; forming a recess in said first wafer; forming a first plate in said recess of said first wafer; forming a coil-receiving trench in an upper surface of said second wafer; forming second and third plates on said upper surface of said second wafer within the perimeter of said coil-receiving trench; providing an inductor coil having first and second leads; positioning said inductor coil within said coil-receiving trench in said upper surface of said second wafer; electrically connecting said first and second leads of said inductor coil to said second and third plates on said upper surface of said second wafer; mutually imposing said first and second wafers such that said first plate in said recess of said first wafer is in parallel, spaced apart relation to said second and third plates on said upper surface of said second wafer; and affixing said first and second wafers to one another in said mutually imposed position. - View Dependent Claims (29, 30)
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Specification