Conductor module and electromagnetic welding method

• US 20100059254A1
• Filed: 09/03/2009
• Published: 03/11/2010
• Est. Priority Date: 09/08/2008
• Status: Active Grant

• Current Assignee: Yazaki Corporation
• Original Assignee: Yazaki Corporation
• Inventors: Sugiyama, Yoshitaka, Aizawa, Tomokatsu, Hanazaki, Kenichi
• Granted Patent: US 8,383,947 B2
• Time in Patent Office: Days
• US Class Current: 174/254
• CPC Class Codes: B23K 13/01 by induction heating
• CPC Class Codes: B23K 20/06 by means of high energy impulses, e.g. magnetic energy
• CPC Class Codes: B23K 2101/38 Conductors
• CPC Class Codes: H01R 12/61 connecting to flexible printed circuits, flat or ribbon cables or like structures
• CPC Class Codes: H01R 43/02 for soldered or welded connections
• CPC Class Codes: H05K 2201/0382 Continuously deformed conductors
• CPC Class Codes: H05K 2201/058 Direct connection between two or more FPCs or between flexible parts of rigid PCBs
• CPC Class Codes: H05K 2203/101 Using electrical induction, e.g. for heating during soldering
• CPC Class Codes: H05K 3/28 Applying non-metallic protective coatings H05K3/0091 takes precedence; methods for intermediate insulating layers for build-up multilayer circuits H05K3/4673
• CPC Class Codes: H05K 3/328 by welding
• CPC Class Codes: H05K 3/3494 Heating methods for reflowing of solder using integral heating means H05K1/0212
• CPC Class Codes: H05K 3/361 Assembling flexible printed circuits with other printed circuits
• CPC Class Codes: H05K 3/4084 by deforming at least one of the conductive layers

Abstract

The present invention is intended to provide an enhanced conductor module capable of reducing a joint area between conductors, and a method for preparing the same. The conductor module has a pair of flattened circuits each of which comprises a rectangular shaped conductors, a pair of sheeted coverings disposed on both sides of the conductor, and at least one hole having a diameter smaller than a width of the conductor, and formed in the coverings so as to expose one surface of the conductor to outside the flattened circuit. The conductor of one flattened circuit is joined to the conductor of the other flattened circuit via the hole by application of electromagnetic welding.

Claims

1. A conductor module having a pair of flattened circuits, each of the flattened circuit comprising:

a rectangular shaped conductor,

a pair of sheeted coverings disposed on both sides of the conductor, and

at least one hole having a diameter smaller than a width of the conductor, and formed in the coverings so as to expose one surface of the conductor to outside the flattened circuit, wherein the conductor of one flattened circuit is joined to the conductor of the other flattened circuit via the hole by application of electromagnetic welding.

2. The conductor module according to claim 1, the conductors are magnetically welded together by disposing the flattened circuits over a coil such that the overlapping holes are situated in a position in which a vertical component of the flattened circuits reaches a maximum in a magnetic field, the magnetic field being generated from the coil and intersecting with the conductor;

and subsequently applying a current to the coil.

3. The conductor module according to claim 1, the conductors are magnetically welded together by disposing the flattened circuits over a coil such that the overlapping holes are situated in a position in which a vertical component of the flattened circuits reaches a maximum in a magnetic field generated from the coil and intersecting with a moving member, the moving member being disposed between the coil and the flattened circuits;

and subsequently applying a current to the coil.

4. The conductor module in accordance with claim 1, wherein a plurality of the conductors is disposed between a pair of the coverings, and the hole is configured to partly expose the conductors to outside the flattened circuits.

5. The conductor module in accordance with claim 1, wherein the covering is produced by a process, comprising the steps of:

applying molten material for the covering to one surface of the conductor;

forming a resist film layer on the covering except for a portion to be the hole; and

etching the covering so as to form the hole on the covering.

6. A method for joining conductors of a pair of flattened circuits together, each of the flattened circuit comprising a rectangular shaped conductor, a pair of sheeted coverings disposed on both sides of the conductor, and at least one hole having a diameter smaller than a width of the conductor, and being formed in the covering so as to expose one surface of the conductor to outside the flattened circuit, comprising the steps of:

disposing the flattened circuits over a coil such that the overlapping holes are situated in a position in which a vertical component of the flattened circuit reaches a maximum in a magnetic field, the magnetic field being generated from the coil and intersecting with the conductor; and

applying a current to the coil so as to magnetically weld the conductors together.

7. A method for joining conductors of a pair of flattened circuits together, each of the flattened circuit comprising a rectangular shaped conductor, a pair of sheeted coverings disposed on both sides of the conductor, and at least one hole having a diameter smaller than a width of the conductor, and being formed in the covering so as to expose one surface of the conductor to outside the flattened circuit, comprising the steps of:

disposing the flattened circuits over a coil such that the overlapping holes are situated at a position in which a vertical component of the flattened circuit reaches a maximum in a magnetic field generated from the coil and intersecting with a electrically conductive moving member, the moving member being thicker than the conductor and being disposed between the coil and the flattened circuits; and

applying a current to the coil so as to magnetically weld the conductors together.