ELECTRONIC APPARATUS AND PRINTED WIRING BOARD

• US 20100059264A1
• Filed: 05/21/2009
• Published: 03/11/2010
• Est. Priority Date: 09/10/2008
• Status: Active Grant

• Current Assignee: Toshiba Client Solutions CO., Ltd. (Hon Hai Precision Industry Co., Ltd.)
• Original Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Inventors: KOZAI, Tsuyoshi, HASEGAWA, Kenji
• Granted Patent: US 8,193,453 B2
• Time in Patent Office: Days
• US Class Current: 174/262
• CPC Class Codes: H05K 1/0215 Grounding of printed circuits by connection to external grounding means
• CPC Class Codes: H05K 1/116 Lands, clearance holes or other lay-out details concerning the surrounding of a via
• CPC Class Codes: H05K 2201/09463 Partial lands, i.e. lands or conductive rings not completely surrounding the hole
• CPC Class Codes: H05K 2201/09909 Special local insulating pattern, e.g. as dam around component
• CPC Class Codes: H05K 2201/10409 Screws
• CPC Class Codes: H05K 2201/2036 Permanent spacer or stand-off in a printed circuit or printed circuit assembly
• CPC Class Codes: H05K 3/325 by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor adaptations of leads inserted in holes for press-fit connections H05K3/308
• CPC Class Codes: H05K 3/3452 Solder masks

Abstract

According to an aspect of the present invention, there is provided a printed wiring board including: a substrate including a pair of edges and a fixing hole adjacent to the pair of edges and configured to receive a bolt; a land provided in a vicinity of the fixing hole and extending in a direction from the fixing hole toward a center of the substrate and along the pair of edges; and an insulating height adjuster provided between the fixing hole and the pair of edges and configured to have substantially the same height as the land.

Claims

1. An electronic apparatus comprising:

a casing comprising a conductive ground layer on an inner surface;

a printed wiring board in the casing; and

a bolt configured to attach the printed wiring board to the casing and to ground the printed wiring board to the conductive ground layer,

wherein the printed wiring board comprises;

a substrate comprising a pair of edges and a fixing hole next to the pair of edges and configured to receive a bolt;

a land in a vicinity of the fixing hole and extending in a direction from the fixing hole toward a center of the substrate and along the pair of edges; and

an insulating height adjuster between the fixing hole and the pair of edges comprising substantially the same height as a height of the land.

2. The electronic apparatus of claim 1, wherein the land comprises a sector shape extending from the fixing hole toward the center of the substrate.

3. The electronic apparatus of claim 1, wherein the insulating height adjuster is at outside of a region between the pair of edges and a portion of the land opposite to the pair of edges, and at a corner of the pair of edges.

4. A printed wiring board comprising:

a substrate comprising an edge and a fixing hole next to the edge and configured to receive a bolt;

a land in a vicinity of the fixing hole and extending in a direction from the fixing hole toward a center of the substrate and along the edge; and

an insulating height adjuster between the fixing hole and the edge and comprising substantially the same height as a height of the land.

5. The printed wiring board of claim 4, wherein the land comprises a sector shape extending from the fixing hole toward the center of the substrate.

6. The printed wiring board of claim 4, wherein the insulating height adjuster is at outside a region between the edge and a portion of the land opposite to the edge.

7. A printed wiring board comprising:

a substrate comprising a pair of edges and a fixing hole next to the pair of edges and configured to receive a bolt;

a land in a vicinity of the fixing hole and extending in a direction from the fixing hole toward a center of the substrate and along the pair of edges; and

an insulating height adjuster between the fixing hole and the pair of edges comprising substantially the same height as a height of the land.

8. An electronic apparatus comprising:

a casing comprising a conductive ground layer on an inner surface;

a printed wiring board in the casing; and

a bolt configured to attach the printed wiring board to the casing and to ground the printed wiring board to the conductive ground layer,

wherein the printed wiring board comprises;

a substrate comprising an edge and a fixing hole next to the edge and configured to receive a bolt;

a land in a vicinity of the fixing hole and extending in a direction from the fixing hole toward a center of the substrate and along the edge; and

an insulating height adjuster between the fixing hole and the edge and comprising substantially the same height as a height of the land.