Formation of Deep Hollow Areas and use Thereof in the Production of an Optical Recording Medium
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Accused Products
Abstract
At least one hollow zone is formed in a stack of at least one upper layer and one lower layer. The upper layer is patterned to form at least a first hollow region passing through said upper layer. The first hollow region is extended by a second hollow region formed in the lower layer by etching through an etching mask formed on the patterned upper layer. The etching mask is formed by a resin layer, positively photosensitive to an optic radiation of a predetermined wavelength, exposed to the said optic radiation through the stack and developed. The lower and upper layers of the stack are respectively transparent and opaque to said predetermined wavelength so that the patterned upper layer acts as exposure mask for the resin layer.
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Citations
26 Claims
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1-13. -13. (canceled)
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14. A method for forming at least one hollow zone in a stack of at least one upper layer and one lower layer, comprising the following successive steps:
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patterning of the upper layer to form at least a first hollow region passing through said upper layer, formation of an etching mask on the patterned upper layer, consisting; in depositing a resin layer, positively photosensitive to an optic radiation of a predetermined first wavelength, on the patterned upper layer, the lower and upper layers of the stack being respectively transparent and opaque to the predetermined first wavelength, in exposing said resin layer to said optic radiation through the stack, and in developing the resin layer, etching the lower layer through the said etching mask to form at least a second hollow region extending the first hollow region, and removing the said etching mask. - View Dependent Claims (15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25)
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26. Method for manufacturing an optic recording medium in which at least one hollow zone is formed in a stack of at least one upper layer and one lower layer, wherein it comprises the following successive steps:
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patterning of the upper layer to form at least a first hollow region passing through said upper layer, formation of an etching mask on the patterned upper layer, consisting; in depositing a resin layer, positively photosensitive to an optic radiation of a predetermined first wavelength, on the patterned upper layer, the lower and upper layers of the stack being respectively transparent and opaque to the predetermined first wavelength, in exposing said resin layer to said optic radiation through the stack, and in developing the resin layer, etching the lower layer through the said etching mask to form at least a second hollow region extending the first hollow region, and removing the said etching mask.
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Specification