SEMICONDUCTOR CHIP ASSEMBLY WITH POST/BASE HEAT SPREADER AND SUBSTRATE

• US 20100059786A1
• Filed: 11/11/2009
• Published: 03/11/2010
• Est. Priority Date: 03/25/2008
• Status: Active Grant

• Current Assignee: Bridge Semiconductor Corporation
• Original Assignee: Bridge Semiconductor Corporation
• Inventors: Lin, Charles W.C., Wang, Chia-Chung
• Granted Patent: US 8,067,784 B2
• Time in Patent Office: Days
• US Class Current: 257/99
• CPC Class Codes: F21K 9/00 Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
• CPC Class Codes: H01L 21/486 Via connections through the substrate with or without pins
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/32188 the layer connector connecting to a bonding area protruding from the surface of the item
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/49171 Fan-out arrangements
• CPC Class Codes: H01L 2224/85205 Ultrasonic bonding
• CPC Class Codes: H01L 23/3677 Wire-like or pin-like cooling fins or heat sinks
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01012 Magnesium [Mg]
• CPC Class Codes: H01L 2924/01019 Potassium [K]
• CPC Class Codes: H01L 2924/01046 Palladium [Pd]
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01087 : Francium [Fr]
• CPC Class Codes: H01L 2924/12041 : LED
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 33/483 : Containers
• CPC Class Codes: H01L 33/642 : characterized by the shape
• CPC Class Codes: H05K 1/0204 : using means for thermal conduction connection in the thickness direction of the substrate H05K1/0207 takes precedence
• CPC Class Codes: H05K 2201/09054 : Raised area or protrusion of metal substrate
• CPC Class Codes: H05K 2201/10106 : Light emitting diode [LED]
• CPC Class Codes: H05K 2203/0369 : Etching selective parts of a metal substrate through part of its thickness, e.g. using etch resist
• CPC Class Codes: H05K 3/0061 : onto a metallic substrate, e.g. a heat sink heat sinks for electric apparatus H05K7/20
• CPC Class Codes: H05K 3/386 : by the use of an organic polymeric bonding layer, e.g. adhesive

Abstract

A semiconductor chip assembly includes a semiconductor device, a heat spreader, a substrate and an adhesive. The semiconductor device is electrically connected to the substrate and thermally connected to the heat spreader. The heat spreader includes a post and a base. The post extends upwardly from the base into an opening in the adhesive and an aperture in the substrate, and the base extends laterally from the post. The adhesive extends between the post and the substrate and between the base and the substrate. The assembly provides signal routing between a pad and a terminal.

Claims

1. A semiconductor chip assembly, comprising:

a semiconductor device;

an adhesive that includes an opening;

a heat spreader that includes a post and a base, wherein the post is adjacent to the base and extends above the base in an upward direction, and the base extends below the post in a downward direction opposite the upward direction and extends laterally from the post in lateral directions orthogonal to the upward and downward directions;

a substrate that includes a pad and a dielectric layer, wherein an aperture extends through the substrate; and

a terminal;

wherein the semiconductor device is above and overlaps the post, is electrically connected to the pad and thereby electrically connected to the terminal, and is thermally connected to the post and thereby thermally connected to the base;

wherein the adhesive is mounted on and extends above the base, extends into a gap in the aperture between the post and the substrate, extends across the dielectric layer in the gap, extends laterally from the post to or beyond the terminal and is sandwiched between the post and the dielectric layer and between the base and the substrate;

wherein the substrate is mounted on the adhesive and extends above the base; and

wherein the post extends into the opening and the aperture, and the base extends below the semiconductor device, the adhesive and the substrate.

2. The assembly of claim 1, wherein the semiconductor device is an LED package that includes an LED chip, the substrate includes the terminal, the terminal extends above the dielectric layer and the adhesive extends laterally from the post beyond and is overlapped by the terminal.

3. The assembly of claim 2, wherein the LED package is electrically connected to the pad using a first solder joint and is thermally connected to the heat spreader using a second solder joint.

4. The assembly of claim 1, wherein the semiconductor device is a semiconductor

chip, the substrate excludes the terminal, the terminal extends below the adhesive and the adhesive extends laterally from the post beyond and overlaps the terminal.

5. The assembly of claim 4, wherein the chip is electrically connected to the pad using a wire bond and is thermally connected to the heat spreader using a die attach.

6. The assembly of claim 1, wherein the adhesive contacts the post and the dielectric

layer in the gap and contacts the base and the dielectric layer outside the gap.

7. The assembly of claim 1, wherein the adhesive covers and surrounds the post in the lateral directions.

8. The assembly of claim 1, wherein the adhesive fills the space between the post and the dielectric layer.

9. The assembly of claim 1, wherein the adhesive fills the space between the base and the substrate.

10. The assembly of claim 1, wherein the adhesive is contained in the space between the heat spreader and the substrate.

11. The assembly of claim 1, wherein the adhesive extends to peripheral edges of the assembly.

12. The assembly of claim 1, wherein the post is integral with the base.

13. The assembly of claim 1, wherein the post is coplanar with the adhesive above the dielectric layer.

14. The assembly of claim 1, wherein the post has a cut-off conical shape in which its diameter decreases as it extends upwardly from the base to its flat top.

15. The assembly of claim 1, wherein the base covers the semiconductor device, the post, the substrate and the adhesive in the downward direction and extends to peripheral edges of the assembly.

16. The assembly of claim 1, wherein the substrate is spaced from the post and the base and is a laminated structure.

17. The assembly of claim 1, wherein the heat spreader includes a cap that is above and adjacent to and covers in the upward direction and extends laterally in the lateral directions from a top of the post.

18. The assembly of claim 17, wherein the cap is coplanar with the pad above the dielectric layer.

19. The assembly of claim 17, wherein the cap has a rectangular or square shape and the top of the post has a circular shape.

20. The assembly of claim 17, wherein the cap is sized and shaped to accommodate a thermal contact surface of the semiconductor device, and the top of the post is not sized and shaped to accommodate the thermal contact surface of the semiconductor device.

21. A semiconductor chip assembly, comprising:

a semiconductor device;

an adhesive that includes an opening;

a heat spreader that includes a post, a base and a cap, wherein the post is adjacent to and integral with the base, extends above the base in an upward direction and thermally connects the base and the cap, the base extends below the post in a downward direction opposite the upward direction and extends laterally from the post in lateral directions orthogonal to the upward and downward directions, and the cap is above and adjacent to and covers in the upward direction and extends laterally in the lateral directions from a top of the post; and

a substrate that includes a pad, a terminal, a routing line and a dielectric layer, wherein the pad, the terminal and the routing line contact and extend above the dielectric layer, an electrically conductive path between the pad and the terminal includes the routing line, and an aperture extends through the substrate;

wherein the semiconductor device is mounted on the cap, overlaps the post, is electrically connected to the pad and thereby electrically connected to the terminal, and is thermally connected to the cap and thereby thermally connected to the base;

wherein the adhesive is mounted on and extends above the base, extends into a gap in the aperture between the post and the substrate, extends across the dielectric layer in the gap, is sandwiched between the post and the dielectric layer in the gap, is sandwiched between the base and the substrate outside the gap, surrounds the post in the lateral directions, is overlapped by the pad, the terminal and the routing line and extends to peripheral edges of the assembly;

wherein the substrate is mounted on the adhesive and extends above the base; and

wherein the post extends into the opening and the aperture and above the dielectric layer, and the base extends below the semiconductor device, the adhesive and the substrate, covers the post, the cap, the adhesive and the substrate in the downward direction and extends to peripheral edges of the assembly.

22. The assembly of claim 21, wherein the semiconductor device is an LED package that includes an LED chip, is mounted on the pad using a first solder joint and on the cap using a second solder joint, is electrically connected to the pad using the first solder joint and is thermally connected to the cap using the second solder joint.

23. The assembly of claim 21, wherein the substrate is spaced from the post and the base, the adhesive contacts the post and the dielectric layer in the gap and contacts the base and the dielectric layer outside the gap, and the cap and the top of the post are copper.

24. The assembly of claim 21, wherein the post has a cut-off conical shape in which its diameter decreases as it extends upwardly from the base to the cap, the top of the post has a circular shape and the cap has a rectangular or square shape.

25. The assembly of claim 21, wherein the post is coplanar with the adhesive above the dielectric layer and the cap is coplanar with the pad and the terminal above the dielectric layer.