Apparatus and Method of Wafer Bonding Using Compatible Alloy
First Claim
1. A method of bonding a MEMS device wafer to a second wafer, the method comprising:
- forming an aluminum layer on the MEMS device wafer;
forming a germanium layer on the second wafer;
bringing the aluminum layer on the device wafer into contact with the germanium layer on the second wafer;
heating the aluminum layer and the germanium layer,heating at least in part causing the aluminum layer and germanium layer to form a eutectic material, heating being initiated either before or after the aluminum layer is in contact with the germanium layer; and
cooling the wafers to form a plurality of hermetic seal rings between the wafers.
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Accused Products
Abstract
A method of forming an inertial sensor provides 1) a device wafer with a two-dimensional array of inertial sensors and 2) a second wafer, and deposits an alloy of aluminum/germanium onto one or both of the wafers. The alloy is deposited and patterned to form a plurality of closed loops. The method then aligns the device wafer and the second wafer, and then positions the alloy between the wafers. Next, the method melts the alloy, and then solidifies the alloy to form a plurality of conductive hermetic seal rings about the plurality of the inertial sensors. The seal rings bond the device wafer to the second wafer. Finally, the method dices the wafers to form a plurality of individual, hermetically sealed inertial sensors.
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Citations
25 Claims
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1. A method of bonding a MEMS device wafer to a second wafer, the method comprising:
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forming an aluminum layer on the MEMS device wafer; forming a germanium layer on the second wafer; bringing the aluminum layer on the device wafer into contact with the germanium layer on the second wafer; heating the aluminum layer and the germanium layer, heating at least in part causing the aluminum layer and germanium layer to form a eutectic material, heating being initiated either before or after the aluminum layer is in contact with the germanium layer; and cooling the wafers to form a plurality of hermetic seal rings between the wafers. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A method of forming an inertial sensor, the method comprising:
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providing a device wafer with a two-dimensional array of MEMS inertial sensors; providing a second wafer; depositing an alloy comprising aluminum/germanium onto one or both the device wafer and the second wafer; position the alloy between the device wafer and the second wafer; heating the alloy before, after, or substantially simultaneously with positioning the alloy; cooling the alloy after melting to form a plurality of conductive hermetic seal rings about the plurality of the inertial sensors, the seal rings bonding the device wafer to the second wafer; and dicing the wafers to form a plurality of individual, hermetically sealed inertial sensors. - View Dependent Claims (10, 11, 12)
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13. A method of bonding a device wafer to a second wafer, the method comprising:
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providing the device wafer with a two-dimensional array of MEMS devices; and providing the second wafer; depositing a metal alloy onto one or both the device wafer and the second wafer, the metal alloy being substantially CMOS fabrication compatible; aligning the device wafer and the second wafer; forming an intermediate apparatus having the metal alloy between the device wafer and the second wafer; heating the intermediate apparatus to within about 75 degrees C. of the metal alloy eutectic temperature between the device wafer and the second wafer; and cooling the wafers to form a plurality of conductive hermetic seal rings about the plurality of the MEMS devices on the device wafer, the seal rings bonding the device wafer to the second wafer. - View Dependent Claims (14, 15, 16, 17, 18, 19, 20, 21)
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22. A method of bonding a first wafer to a second wafer, the method comprising:
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forming a first metal layer on the first wafer, the first metal layer including one of aluminum-germanium or silicon-germanium; forming a second metal layer on the second wafer, the second metal layer including one of aluminum, germanium, or aluminum-germanium; bringing the first metal layer on the first wafer into contact with the second metal layer on the second wafer; heating the first and second metal layers to diffuse together the first and second metal layers to form a mechanical bond, heating being initiated either before or after bringing the first metal layer into contact with the second metal layer; and cooling the wafers to form a plurality of hermetic seal rings between the wafers. - View Dependent Claims (23, 24, 25)
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Specification