OPTICAL ELECTRICAL SYSTEM IN PACKAGE FOR LED BASED LIGHTING SYSTEMS

• US 20100060205A1
• Filed: 11/29/2007
• Published: 03/11/2010
• Est. Priority Date: 12/06/2006
• Status: Active Grant

• Current Assignee: NXP B.V. (NXP Semiconductors NV)
• Original Assignee: NXP B.V. (NXP Semiconductors NV)
• Inventors: Vaassen, Steven F.E., Deixler, Peter
• Granted Patent: US 8,120,289 B2
• Time in Patent Office: Days
• US Class Current: 315/320
• CPC Class Codes: F21K 9/00 Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
• CPC Class Codes: F21V 23/04 the elements being switches safety devices F21V25/00
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 25/167 comprising optoelectronic devices, e.g. LED, photodiodes
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/1305 Bipolar Junction Transistor [BJT]
• CPC Class Codes: H05B 45/40 Details of LED load circuits
• CPC Class Codes: H05B 45/48 having LEDs organised in strings and incorporating parallel shunting devices

Abstract

Packaged semiconductor electronic device to be individually positioned and coupled to peripheral electronic devices, the package comprising a light emitting semiconductor device (D1), and a switch (S1) for controlling the light emitting semiconductor device.

Claims

1. A packaged electronic device to be individually positioned and coupled to peripheral electronic devices, the package comprising:

a light emitting semiconductor device, and

a switch for controlling the light emitting semiconductor device.

2. The packaged electronic device according to claim 1, further comprising a plurality of light emitting diodes and a plurality of switches, wherein each switch is disposed on a separate semiconductor substrate being electrically decoupled from a semiconductor substrate of another switch to allow large voltage differences between the switches without damaging the semiconductor device.

3. The packaged electronic device according to claim 2, further comprising further a control unit (CNTL) for receiving commands for operating the switches, and an interface to be coupled to a network.

4. The packaged electronic device according to claim 3, further comprising further a non-volatile memory to store values for compensating characteristics of the light emitting semiconductor device.

5. The packaged electronic device according to claim 4, wherein the non-volatile memory is an OTP memory to store the time zero calibration values to compensate for initial differences in wave length or intensity of the-emitted light from the slight emitting semiconductor device.

6. The packaged electronic device according to claim 5, wherein packaging material is optically transparent, wherein the package is HVQFN or UTLP package to minimize the current loops between a switch controller and a bus interfaces, the switches, and the light emitting semiconductor devices.

7. The packaged electronic device according to claim 1, wherein the an integrated circuit arranged in a low power package is used to supply a voltage to a beam shaping LC lens.

8. (canceled)

9. An electronic device comprising:

a plurality of light emitting semiconductor devices,

switches for each of the light emitting semiconductor devices, wherein

each pair of switches and a light emitting semiconductor device is electrically decoupled from another pair of a switch and a light emitting semiconductor device to allow large voltage differences between the switches without damaging the electronic device.

10. The electronic device according to claim 9, wherein, the switches are arranged as bypass switches to provide a current path bypassing the light emitting semiconductor device.

11. The electronic device according to claim 9, wherein the switches are arranged in series with the light emitting semiconductor device.

12. The electronic device according to claim 9, comprising three pairs of light emitting diodes and switches, wherein the switches are implemented on one separate individual semiconductor substrate and three semiconductor devices are light emitting diodes of the colors red, blue, and green.

13. A method of manufacturing a packaged electronic device, comprising the steps of:

providing a carrier comprising a plurality of pads

assembling a switch and a light emitting semiconductor device to the at least one pad of the carrier and electrically coupling the switch and the light emitting semiconductor devices to contact pads;

providing an encapsulation;

patterning the carrier so as to mutually electrically isolate individual pads.