Method to Fabricate a Molding Inductor Structure and a Molding Inductor Structure

• US 20100060398A1
• Filed: 09/22/2008
• Published: 03/11/2010
• Est. Priority Date: 09/08/2008
• Status: Abandoned Application

• Current Assignee: Trico Technologies Corporation (Crowne Group LLC)
• Original Assignee: Trico Technologies Corporation (Crowne Group LLC)
• Inventors: LIN, Huo-Li
• Application Number:
  US12/235,576
• Publication Number:
  US 20100060398A1
• Time in Patent Office: Days
• US Class Current: 336/65
• CPC Class Codes: H01F 17/043 with two, usually identical or nearly identical parts enclosing completely the coil (pot cores)
• CPC Class Codes: H01F 27/027 specially adapted for combination of signal type inductors or transformers with electronic circuits, e.g. mounting on printed circuit boards
• CPC Class Codes: H01F 3/10 Composite arrangements of magnetic circuits
• CPC Class Codes: H01F 41/0246 Manufacturing of magnetic circuits by moulding or by pressing powder magnetic cores made by moulding or by pressing powder H01F27/255; soft magnetic particles H01F1/20, H01F1/36
• CPC Class Codes: Y10T 29/49075 including permanent magnet or core

Abstract

A method to fabricate a molding inductor structure and a molding inductor structure are provided. The method comprises the steps of: performing a high pressure process on a first magnetic material to form a baseboard, wherein a central area of the baseboard comprises a pillar; providing a metal coil, wherein the metal coil comprises an open coil center; connecting the metal coil and the baseboard such that the pillar lodges in the open coil center; placing the connected metal coil and the baseboard into a mold; and forming a covering structure by stuffing a second magnetic material with a high pressure process to cover the connected metal coil and the baseboard to form the molding inductor structure.

Claims

1. A method to fabricate a molding inductor structure comprising the steps of:

performing a high pressure process on a first magnetic material to form a baseboard, wherein a central area of the baseboard comprises a pillar;

providing a metal coil, wherein the metal coil comprises an open coil center;

connecting the metal coil and the baseboard such that the pillar lodges in the open coil center;

placing the connected metal coil and the baseboard into a mold; and

forming a covering structure by stuffing a second magnetic material with a high pressure process to cover the connected metal coil and the baseboard to form the molding inductor structure.

2. The method of claim 1, wherein the step of forming the baseboard further comprises the steps of placing the first magnetic material in to a baseboard mold to perform the high pressure process on the first magnetic material.

3. The method of claim 1, wherein the metal coil comprises two ends exposed outside of the covering structure to electrically connect to an outward circuit respectively.

4. The method of claim 3, wherein two conductive plates are formed on the two ends of the metal coil, the two ends of the metal coil substantially connect to the outward circuit through the two conductive plates.

5. The method of claim 1, wherein the metal coil comprises two ends and the baseboard comprises two openings, the two ends of the metal coil are exposed outside of the covering structure through the two openings to electrically connect to an outward circuit respectively.

6. The method of claim 5, wherein two conductive plates are formed on the two ends of the metal coil, the two ends of the metal coil substantially connect to the outward circuit through the two conductive plates.

7. The method of claim 1, wherein the first magnetic material is a blend of a metal powders and a non-metal powders.

8. A molding inductor structure comprising:

a baseboard comprising a first magnetic material, wherein a pillar is formed in a central area of the baseboard;

a metal coil comprising an open coil center and two ends, wherein the pillar of the baseboard lodges in the open coil center; and

a covering structure comprising a second magnetic material covering the connected metal coil and the baseboard, wherein the two ends of the metal coil electrically connect to an outward circuit respectively.

9. The molding inductor structure of claim 8, wherein the baseboard is formed by performing a high pressure process on the first magnetic material.

10. The molding inductor structure of claim 8, wherein the two ends of the metal coil are exposed outside of the covering structure to electrically connect to an outward circuit respectively.

11. The molding inductor structure of claim 10, wherein two conductive plates are formed on the two ends of the metal coil, the two ends of the metal coil substantially connect to the outward circuit through the two conductive plates.

12. The molding inductor structure of claim 8, wherein the baseboard comprises two openings, the two ends of the metal coil are exposed outside of the covering structure through the two openings to electrically connect to an outward circuit respectively.

13. The molding inductor structure of claim 8, wherein the first magnetic material is a blend of a metal powders and a non-metal powders.