Upgradable Memory System with Reconfigurable Interconnect

• US 20100061047A1
• Filed: 08/10/2009
• Published: 03/11/2010
• Est. Priority Date: 02/28/2001
• Status: Active Grant

• Current Assignee: Rambus Inc.
• Original Assignee: Rambus Inc.
• Inventors: Perego, Richard E., Tsern, Ely K., Hampel, Craig E., Ware, Frederick A.
• Granted Patent: US 8,380,927 B2
• Time in Patent Office: Days
• US Class Current: 361/679.20
• CPC Class Codes: G06F 13/409 Mechanical coupling back panels H05K7/1438
• CPC Class Codes: G11C 2207/105 Aspects related to pads, pins or terminals
• CPC Class Codes: G11C 5/04 Supports for storage elements , e.g. memory modules; Mounting or fixing of storage elements on such supports
• CPC Class Codes: H05K 1/117 Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
• CPC Class Codes: H05K 1/14 Structural association of two or more printed circuits providing electric connection to or between printed circuits H05K1/11, H01R12/00
• CPC Class Codes: H05K 2201/09954 More mounting possibilities, e.g. on same place of PCB, or by using different sets of edge pads
• CPC Class Codes: H05K 2201/10189 Non-printed connector
• CPC Class Codes: Y02D 10/00 Energy efficient computing, e.g. low power processors, power management or thermal management

Abstract

Described are systems that employ configurable on-die termination elements that allow users to select from two or more termination topologies. One topology is programmable to support rail-to-rail or half-supply termination. Another topology selectively includes fixed or variable filter elements, thereby allowing the termination characteristics to be tuned for different levels of speed performance and power consumption. Termination voltages and impedances might also be adjusted.

Claims

1. A system comprising:

a. a motherboard including;

i. a first electrical receptacle;

ii. a first set of signal lines coupled to the first electrical receptacle;

iii. a second electrical receptacle;

iv. a second set of signal lines coupled to the second electrical receptacle; and

b. at least one of a first module and a second module;

c. the motherboard supporting two configurations, including;

i. a single-module configuration in which the first module is inserted into the first electrical receptacle and the second electrical receptacle lacks the second module, wherein the first module is coupled, via the first electrical receptacle, to the first and second sets of signal lines and is receiving first data of a first width transferred to the first electrical receptacle via the first and second sets of signal lines; and

ii. a dual-module configuration in which the first module is inserted into the first electrical receptacle and the second module is inserted into the second electrical receptacle, wherein the first module is coupled, via the first electrical receptacle, to the first set of signal lines and is receiving second data of a second width transferred to the first electrical receptacle via the first set of signal lines and the second module is coupled, via the second electrical receptacle, to the second set of signal lines and is receiving third data transferred to the second electrical receptacle via the second set of signal lines.