Electromagnetic Interference Shields with Piezos

• US 20100061577A1
• Filed: 09/23/2008
• Published: 03/11/2010
• Est. Priority Date: 09/05/2008
• Status: Active Grant

• Current Assignee: Apple Inc.
• Original Assignee: Apple Inc.
• Inventors: Lynch, Stephen Brian, Yeates, Kyle, Dabov, Teodor
• Granted Patent: US 8,126,170 B2
• Time in Patent Office: Days
• US Class Current: 381/337
• CPC Class Codes: H04R 17/00 Piezoelectric transducers; Electrostrictive transducers piezoelectric or electrostrictive elements in general H10N30/00; details of piezoelectric or electrostrictive motors, generators or positioners H10N30/00
• CPC Class Codes: H04R 17/10 Resonant transducers, i.e. adapted to produce maximum output at a predetermined frequency
• CPC Class Codes: H04R 2499/11 Transducers incorporated or for use in hand-held devices, e.g. mobile phones, PDA's, camera's
• CPC Class Codes: Y10T 29/53174 Means to fasten electrical component to wiring board, base, or substrate

Abstract

Methods and apparatus for improving the acoustical performance associated with a speaker, such as a piezoelectric speaker, are disclosed. According to one aspect, an apparatus includes a substrate, a can mounted on the substrate, and a piezoelectric speaker arrangement. The piezoelectric speaker arrangement is at least partially mounted on the can. In one embodiment, the substrate is a printed circuit board (PCB) and the can is an electromagnetic interference (EMI) shielding can.

Claims

1. An electronic apparatus comprising:

a substrate configured to support one or more electronic components coupled thereto;

a can secured to the substrate over and around the one or more electronic components; and

a speaker at least partially mounted on the can.

2. The electronic apparatus of claim 1 wherein the can is an electromagnetic interference (EMI) shielding can.

3. The electronic apparatus of claim 1 wherein the speaker is a piezoelectric speaker.

4. The electronic apparatus of claim 3 wherein the can is arranged to vibrate when a component of the piezoelectric speaker vibrates.

5. The electronic apparatus of claim 1 wherein the can has at least one opening in a surface of the can over which the speaker is mounted.

6. The electronic apparatus of claim 5 wherein the speaker is mounted on the can so as to substantially seal with the surface over the at least one opening.

7. The electronic apparatus of claim 6 wherein the can is substantially sealed with the substrate to provide an enclosed volume of air, and wherein the enclosed volume of air serves as a back volume for enhancing sound waves produced by the speaker.

8. The electronic apparatus of claim 1 wherein the can is substantially sealed with the substrate to provide an enclosed volume of air, and wherein the enclosed volume of air serves as a back volume for enhancing sound waves produced by the speaker.

9. An apparatus comprising:

a substrate;

a can, the can being mounted on the substrate; and

a piezoelectric speaker arrangement, the piezoelectric speaker arrangement being at least partially mounted on the can.

10. The apparatus of claim 9 wherein the substrate is a printed circuit board (PCB) and wherein the can is an electromagnetic interference (EMI) shielding can.

11. The apparatus of claim 10 wherein the piezoelectric speaker arrangement includes a membrane held by a support member, the support member being at least partially mounted on the EMI shielding can.

12. The apparatus of claim 10 wherein the piezoelectric speaker arrangement is arranged to induce the can to vibrate.

13. The apparatus of claim 10 wherein the EMI shielding can includes a top surface, the piezoelectric speaker arrangement being at least partially mounted on the top surface.

14. The apparatus of claim 13 wherein the top surface includes at least one opening, and wherein the piezoelectric speaker arrangement is at least partially mounted on the top surface over the at least one opening.

15. The apparatus of claim 14 wherein the piezoelectric speaker arrangement is mounted on the top surface at a distance from the opening.

16. The apparatus of claim 13 wherein the apparatus is associated with a speaker and wherein the EMI shielding can defines a back volume for the speaker.

17. The apparatus of claim 10 wherein the piezoelectric speaker arrangement is mounted to the EMI shielding can through a gasket interface.

18. An electronic device comprising:

a printed circuit board (PCB);

at least one electrical component, the at least one electrical component being mounted on the PCB;

an electromagnetic interference (EMI) shield, the EMI shield being mounted on the PCB over and around the at least one electrical component; and

a piezoelectric speaker mounted on a surface of the EMI shield.

19. An electronic device of claim 18 wherein the electronic device is a handheld mobile electronic device.

20. An electronic device of claim 18 wherein the piezoelectric speaker includes at least a diaphragm element arranged to vibrate when producing sound.

21. An electronic device of claim 20 wherein at least a portion of the EMI shield is arranged to vibrate when the diaphragm element vibrates.

22. An electronic device of claim 18 wherein a volume of air within the EMI shield is substantially sealed such that the volume of air is confined within the EMI shield.

23. The electronic device of claim 18 wherein at least one opening is defined in the surface of the EMI shield, and wherein the diaphragm element is mounted on the surface of the EMI shield such that the diaphragm element is positioned over the at least one opening.

24. The electronic device of claim 18 wherein the EMI shield is arranged to amplify sound associated with the piezoelectric speaker.

25. The electronic device of claim 18 wherein the electronic device includes a driver element that is arranged to cause the diaphragm element to vibrate.

26. A method of assembling an electronic device comprising:

attaching at least a portion of a piezoelectric speaker arrangement to an electromagnetic interference (EMI) can; and

attaching the EMI can to a printed circuit board (PCB), the PCB having at least one electrical component mounted thereon, wherein the EMI can is attached to the PCB over and around the at least one electrical component.

27. The method of claim 26 wherein the piezoelectric speaker arrangement includes a diaphragm element and a driver element, and wherein attaching at least a portion of the piezoelectric speaker arrangement to the EMI can includes attaching at least the diaphragm element to the EMI can.

28. The method of claim 26 wherein when the EMI can is attached to the PCB, at least one gap is defined.

29. The method of claim 28 further including performing at least one selected from the group including covering or filling the at least one gap.

30. The method of claim 26 wherein the EMI can includes a top surface in which at least one opening is defined, and wherein attaching the portion of the piezoelectric speaker arrangement to the EMI can includes attaching the portion of the piezoelectric speaker arrangement such that the portion overlies the at least one opening.