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Substrate Bonding with Bonding Material Having Rare Earth Metal

  • US 20100062565A1
  • Filed: 05/04/2009
  • Published: 03/11/2010
  • Est. Priority Date: 09/10/2008
  • Status: Active Grant
First Claim
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1. A microchip comprising:

  • a first substrate;

    a second substrate; and

    a bonding material bonding the first and second substrates, the bonding material comprising a rare earth metal and other material.

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