CONDUCTIVE MEMBER MANUFACTURING METHOD, AND ELECTRON SOURCE MANUFACTURING METHOD USING THE SAME

• US 20100062674A1
• Filed: 08/20/2009
• Published: 03/11/2010
• Est. Priority Date: 09/09/2008
• Status: Active Grant

• Current Assignee: Canon Kabushiki Kaisha (Canon Inc.)
• Original Assignee: Canon Kabushiki Kaisha (Canon Inc.)
• Inventors: Muraki, Masato
• Granted Patent: US 8,075,361 B2
• Time in Patent Office: Days
• US Class Current: 445/46
• CPC Class Codes: H01J 1/3046 Edge emitters
• CPC Class Codes: H01J 9/025 of field emission cathodes

Abstract

A constitution that conductive members respectively having micropatterns are arranged in high density is manufactured in high accuracy. A conductive film is formed on a substrate, a negative photosensitive resin is applied, the applied resin is exposed by using a first mask having plural fine-width apertures extending in Y direction, and the resin is then exposed and developed by using a second mask having plural apertures extending in X direction perpendicular to Y direction, thereby forming a first resist. After the conductive film is etched by using the first resist as a mask, a negative photosensitive resin is again applied, and exposure and development are performed as shifting the second mask in Y direction, thereby forming a second resist. The conductive film is etched by using the second resist as a mask to eliminate unnecessary areas, thereby forming the conductive film having minute-lines extending in Y direction.

Claims

1. A manufacturing method of manufacturing at least plural conductive members in a first direction, each of the plural conductive members having plural first lines parallelly extending in the first direction and a second line extending in a second direction perpendicular to the first direction and connecting the plural first lines, and a width of the first line taken along the second direction being larger than a width of the second line taken along the first direction, the manufacturing method comprising:

a film forming step of forming a conductive film on a substrate;

a step of applying a negative photosensitive resin on the conductive film;

a first exposing step of exposing the negative photosensitive resin by using a first mask which has plural aperture portions, respectively extending in the first direction, at pitches same as those of the first lines;

a second exposing step of exposing the negative photosensitive resin by using a second mask which has aperture portions, each extending in the second direction in a width same as a maximum length of the conductive member taken along the first direction, at pitches same as those of the conductive members in the first direction;

a step of forming a first resist by developing the negative photosensitive resin double-exposed;

a step of forming a first conductive film pattern by etching the conductive film with use of the first resist as a mask;

a step of applying a negative photosensitive resin on the substrate after the etching;

a step of forming a second resist by exposing and developing the negative photosensitive resin in a state that the second mask is being shifted toward the first direction; and

a step of forming a second conductive film pattern by etching the first conductive film pattern with use of the second resist as a mask.

2. A manufacturing method of manufacturing an electron source in which plural electron-emitting devices, each of which has conductive members each having an electron-emitting portion between a pair of electrodes, are arranged on a substrate, wherein

the conductive members are formed in a manufacturing method as described in claim 1.

3. A manufacturing method according to claim 2, wherein the one electron-emitting device has the plural conductive members.