CONDUCTIVE MEMBER MANUFACTURING METHOD, AND ELECTRON SOURCE MANUFACTURING METHOD USING THE SAME
First Claim
1. A manufacturing method of manufacturing at least plural conductive members in a first direction, each of the plural conductive members having plural first lines parallelly extending in the first direction and a second line extending in a second direction perpendicular to the first direction and connecting the plural first lines, and a width of the first line taken along the second direction being larger than a width of the second line taken along the first direction, the manufacturing method comprising:
- a film forming step of forming a conductive film on a substrate;
a step of applying a negative photosensitive resin on the conductive film;
a first exposing step of exposing the negative photosensitive resin by using a first mask which has plural aperture portions, respectively extending in the first direction, at pitches same as those of the first lines;
a second exposing step of exposing the negative photosensitive resin by using a second mask which has aperture portions, each extending in the second direction in a width same as a maximum length of the conductive member taken along the first direction, at pitches same as those of the conductive members in the first direction;
a step of forming a first resist by developing the negative photosensitive resin double-exposed;
a step of forming a first conductive film pattern by etching the conductive film with use of the first resist as a mask;
a step of applying a negative photosensitive resin on the substrate after the etching;
a step of forming a second resist by exposing and developing the negative photosensitive resin in a state that the second mask is being shifted toward the first direction; and
a step of forming a second conductive film pattern by etching the first conductive film pattern with use of the second resist as a mask.
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Accused Products
Abstract
A constitution that conductive members respectively having micropatterns are arranged in high density is manufactured in high accuracy. A conductive film is formed on a substrate, a negative photosensitive resin is applied, the applied resin is exposed by using a first mask having plural fine-width apertures extending in Y direction, and the resin is then exposed and developed by using a second mask having plural apertures extending in X direction perpendicular to Y direction, thereby forming a first resist. After the conductive film is etched by using the first resist as a mask, a negative photosensitive resin is again applied, and exposure and development are performed as shifting the second mask in Y direction, thereby forming a second resist. The conductive film is etched by using the second resist as a mask to eliminate unnecessary areas, thereby forming the conductive film having minute-lines extending in Y direction.
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Citations
3 Claims
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1. A manufacturing method of manufacturing at least plural conductive members in a first direction, each of the plural conductive members having plural first lines parallelly extending in the first direction and a second line extending in a second direction perpendicular to the first direction and connecting the plural first lines, and a width of the first line taken along the second direction being larger than a width of the second line taken along the first direction, the manufacturing method comprising:
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a film forming step of forming a conductive film on a substrate; a step of applying a negative photosensitive resin on the conductive film; a first exposing step of exposing the negative photosensitive resin by using a first mask which has plural aperture portions, respectively extending in the first direction, at pitches same as those of the first lines; a second exposing step of exposing the negative photosensitive resin by using a second mask which has aperture portions, each extending in the second direction in a width same as a maximum length of the conductive member taken along the first direction, at pitches same as those of the conductive members in the first direction; a step of forming a first resist by developing the negative photosensitive resin double-exposed; a step of forming a first conductive film pattern by etching the conductive film with use of the first resist as a mask; a step of applying a negative photosensitive resin on the substrate after the etching; a step of forming a second resist by exposing and developing the negative photosensitive resin in a state that the second mask is being shifted toward the first direction; and a step of forming a second conductive film pattern by etching the first conductive film pattern with use of the second resist as a mask. - View Dependent Claims (2, 3)
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Specification