HEAT DISSIPATING STRUCTURE OF LED CIRCUIT BOARD AND LED LAMP TUBE COMPRISED THEREOF

• US 20100066230A1
• Filed: 09/17/2008
• Published: 03/18/2010
• Est. Priority Date: 08/22/2008
• Status: Active Grant

• Current Assignee: Kitagawa Holdings LLC (Intellectual Ventures LLC)
• Original Assignee: Kitagawa Holdings LLC (Intellectual Ventures LLC)
• Inventors: Lin, Chen-Hsiang, Hsu, Ken, LIN, Kuo-Len, Cheng, Chih-Hung, Wang, Hwai-Ming
• Granted Patent: US 8,344,600 B2
• Time in Patent Office: Days
• US Class Current: 313/11
• CPC Class Codes: B82Y 30/00 Nanotechnology for materials or surface science, e.g. nanocomposites
• CPC Class Codes: B82Y 99/00 Subject matter not provided for in other groups of this subclass
• CPC Class Codes: F21K 9/27 Retrofit light sources for lighting devices with two fittings for each light source, e.g. for substitution of fluorescent tubes
• CPC Class Codes: F21S 8/031 the device consisting essentially only of a light source holder with an exposed light source, e.g. a fluorescent tube
• CPC Class Codes: F21V 29/506 of globes, bowls or cover glasses
• CPC Class Codes: F21V 29/83 the elements having apertures, ducts or channels, e.g. heat radiation holes
• CPC Class Codes: F21V 29/85 characterised by the material liquid coolants F21V29/56
• CPC Class Codes: F21V 3/02 characterised by the shape
• CPC Class Codes: F21V 5/04 of lens shape
• CPC Class Codes: F21Y 2105/10 comprising a two-dimensional array of point-like light-generating elements
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H05K 1/0209 External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
• CPC Class Codes: H05K 2201/0209 Inorganic, non-metallic particles
• CPC Class Codes: H05K 2201/0257 Nanoparticles
• CPC Class Codes: H05K 2201/10106 Light emitting diode [LED]
• CPC Class Codes: H05K 2201/10977 Encapsulated connections
• CPC Class Codes: H05K 3/285 Permanent coating compositions
• CPC Class Codes: H05K 3/3447 Lead-in-hole components H05K3/3415 takes precedence

Abstract

A heat dissipating structure of an LED circuit board and a device applied in an LED tube which comprises an LED circuit board having a plurality of soldering points. The soldering points of the LED circuit board are covered a coating layer including Nanoparticles and a bonding agent. Accommodating the LED circuit board covering the coating layer in an LED lamp tube to accelerate dissipating the heat of the LED circuit board by the coating layer having the characters of high emitting rate, temperature resistance, and conductivity insulation. On the other hand, for the coating layer can increase the contacting areas of the soldering points with the air to enlarge the heat dissipation area of the LED circuit board to accelerate dissipating the heat.

Claims

1. A heat dissipating structure of an LED circuit board, comprising:

an LED circuit board having a plurality of soldering points; and

a coating layer covering the soldering points of the LED circuit board, wherein the coating layer is composed of Nanoparticles and a bonding agent.

2. The heat dissipating structure of an LED circuit board according to claim 1, wherein the Nanoparticles are heat radiative Nanoparticles, which comprise clay, Nano-SiO2, and far infrared ceramic particles or their combinations.

3. The heat dissipating structure of an LED circuit board according to claim 1, wherein the coating layer comprises 70%˜

80% weight of Nanoparticles, 10%˜

20% weight of he bonding agent and further comprising 10%˜

15% weight of solvent.

4. The heat dissipating structure of an LED circuit board according to claim 2, wherein the thickness of coating layer is 10 micron to 30 micron.

5. The heat dissipating structure of an LED circuit board according to claim 1, wherein the Nanoparticles are Boron Nitride particles.

6. The heat dissipating structure of an LED circuit board according to claim 4, wherein the coating layer comprises 70%˜

80% weight of Nanoparticles, 10%˜

20% weight of he bonding agent and further comprising 10%˜

20% weight of parting agent.

7. The heat dissipating structure of an LED circuit board according to claim 4, wherein the thickness of coating layer is 10 micron to 25 micron.

8. The heat dissipating structure of an LED circuit board according to claim 1, wherein the bonding agent is polyimid resin.

9. The heat dissipating structure of an LED circuit board according to claim 1, wherein the bonding agent is acrylic resin.

10. The heat dissipating structure of an LED circuit board according to claim 1, wherein the bonding agent is poly-ester resin.

11. An LED tube including a heat dissipating structure of an LED circuit board, comprising:

an LED circuit board having a light radiating surface and a heat dissipating surface, and the heat dissipating surface disposed a plurality of soldering points and the light radiating surface disposed a plurality of LEDs;

a coating layer covered on the soldering points of the LED circuit board, wherein the coating layer is composed of Nanoparticles and a bonding agent; and

a lamp tube containing the LED circuit board and having a plurality of heat dissipation holes disposed on the left and right sides of the tube, which face toward the heat dissipating surface of the LED circuit board.

12. The LED tube including a heat dissipating structure of an LED circuit board according to claim 11, wherein the Nanoparticles are heat radiative Nanoparticles, which comprise clay, Nano-SiO2, and far infrared ceramic particles or theirs combinations.

13. The LED tube including a heat dissipating structure of an LED circuit board according to claim 12, wherein the coating layer comprises 70%˜

80% weight of Nanoparticles, 10%˜

20% weight of he bonding agent and further comprising 10%˜

15% weight of solvent.

14. The LED tube including a heat dissipating structure of an LED circuit board according to claim 12, wherein the thickness of coating layer is 10 micron to 30 micron.

15. The LED tube including a heat dissipating structure of an LED circuit board according to claim 11, wherein the Nanoparticles are Boron Nitride particles.

16. The LED tube including a heat dissipating structure of an LED circuit board according to claim 15, wherein the coating layer comprises 70%˜

80% weight of Nanoparticles, 10%˜

20% weight of he bonding agent and further comprising 10%˜

20% weight of parting agent.

17. The LED tube including a heat dissipating structure of an LED circuit board according to claim 15, wherein the thickness of coating layer is 10 micron to 25 micron.

18. The LED tube including a heat dissipating structure of an LED circuit board according to claim 11, wherein the bonding agent is polyimid resin.

19. The LED tube including a heat dissipating structure of an LED circuit board according to claim 11, wherein the bonding agent is acrylic resin.

20. The LED tube including a heat dissipating structure of an LED circuit board according to claim 11, wherein the bonding agent is poly-ester resin.