×

HIGH DENSITY INTERCONNECT SYSTEM FOR IC PACKAGES AND INTERCONNECT ASSEMBLIES

  • US 20100066393A1
  • Filed: 08/24/2009
  • Published: 03/18/2010
  • Est. Priority Date: 07/28/2000
  • Status: Active Grant
First Claim
Patent Images

1. An apparatus, comprising:

  • a structural element having a first surface for affixing at least one contactor scale package;

    a connector structure comprisinga connector substrate having a connector surface and a second surface opposite the connector surface,an array of at least one electrical connection located on the connector surface,an array of electrical contacts located on the second surface, andan array of at least one electrically conductive path extending from each of the electrical connections on the connector surface to a corresponding electrical contact of the array of electrical contacts on the second surface; and

    a latchable interface for mechanically affixing the structural element to the connector structure;

    wherein one or more contactor scale packages are locatable in a space defined between the first surface of the structural element and the connector surfaceof the connector structure, wherein the contactor scale packages comprise a contactor substrate having a contact surface and a mounting surface opposite the contact surface, and an array of at least one electrically conductive spring contact located on and extending from the contact surface, wherein the bonding surface of the contactor scale packages are affixable to the first surface of the structural element; and

    wherein the array of electrical connections located on the connector surface correspond to the array of electrically conductive spring contacts.

View all claims
  • 3 Assignments
Timeline View
Assignment View
    ×
    ×