Packaged device and method of fabricating packaged-device
First Claim
1. A method of fabricating a packaged-device comprising:
- forming grooves in a plurality of first-packaging-member forming regions included in a first packaging wafer so as to form a plurality of wiring regions defined by the grooves;
forming insulating portions in the grooves;
joining a surface of the first packaging wafer on which the wiring regions are formed, to a first surface of a device wafer including a plurality of device forming regions after forming the insulating portions in the grooves;
forming through holes in the wiring regions of the first packaging wafer after joining the first packaging wafer to the device wafer, the through holes extending through the first packaging wafer;
filling the through holes with a conductive material;
joining a second packaging wafer to a second surface of the device wafer opposite the first surface, the second packaging wafer including a plurality of second-packaging-member forming regions;
exposing the wiring regions by thinning the first packaging wafer after joining the first packaging wafer to the device wafer; and
forming a plurality of laminated structure bodies including the first-packaging-member forming regions, the device forming regions, and the second-packaging-member forming regions by cutting the device wafer, the first packaging wafer, and the second packaging wafer after thinning the first packaging wafer.
2 Assignments
0 Petitions
Accused Products
Abstract
A method includes forming grooves in first regions included in a first wafer to form wiring regions defined by the grooves; forming insulating portions in the grooves; joining a surface of the first wafer on which the wiring regions are formed to a first surface of a device wafer including device forming regions after forming the insulating portions; forming through holes in the wiring regions of the first wafer after joining the first wafer to the device wafer, the holes extending through the first wafer; filling the holes with a conductive material; joining a second wafer to a second surface of the device wafer opposite the first surface, the second wafer including second regions; exposing the wiring regions by thinning the first wafer after joining the first wafer to the device wafer; and cutting the device wafer, the first wafer, and the second wafer after thinning the first wafer.
8 Citations
16 Claims
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1. A method of fabricating a packaged-device comprising:
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forming grooves in a plurality of first-packaging-member forming regions included in a first packaging wafer so as to form a plurality of wiring regions defined by the grooves; forming insulating portions in the grooves; joining a surface of the first packaging wafer on which the wiring regions are formed, to a first surface of a device wafer including a plurality of device forming regions after forming the insulating portions in the grooves; forming through holes in the wiring regions of the first packaging wafer after joining the first packaging wafer to the device wafer, the through holes extending through the first packaging wafer; filling the through holes with a conductive material; joining a second packaging wafer to a second surface of the device wafer opposite the first surface, the second packaging wafer including a plurality of second-packaging-member forming regions; exposing the wiring regions by thinning the first packaging wafer after joining the first packaging wafer to the device wafer; and forming a plurality of laminated structure bodies including the first-packaging-member forming regions, the device forming regions, and the second-packaging-member forming regions by cutting the device wafer, the first packaging wafer, and the second packaging wafer after thinning the first packaging wafer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A packaged device comprising:
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a device layer section in which a movable microdevice including a movable part and a terminal part is formed; a first packaging member joined to the device layer section, and including a wiring region provided at a position corresponding to the terminal part and a conductive plug extending through the wiring region; and a second packaging member joined to a side of the device layer section opposite the first packaging member. - View Dependent Claims (11, 12, 13, 14, 15, 16)
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Specification