METHOD FOR ENCAPSULATING AN ELECTRONIC ARRANGEMENT

• US 20100068514A1
• Filed: 08/28/2009
• Published: 03/18/2010
• Est. Priority Date: 09/18/2008
• Status: Active Grant

• Current Assignee: Tesa SE (maxingvest GmbH & Co. KGaA)
• Original Assignee: Tesa SE (maxingvest GmbH & Co. KGaA)
• Inventors: Krawinkel, Thorsten, Ellinger, Jan, Staiger, Anja, Keite-Telgenbüscher, Klaus
• Granted Patent: US 9,627,646 B2
• Time in Patent Office: Days
• US Class Current: 428/351
• CPC Class Codes: C08L 2666/02 Organic macromolecular compounds, natural resins, waxes or and bituminous materials
• CPC Class Codes: C09J 153/02 Vinyl aromatic monomers and conjugated dienes
• CPC Class Codes: C09J 153/025 modified
• CPC Class Codes: H10K 50/8426 Peripheral sealing arrangements, e.g. adhesives, sealants
• CPC Class Codes: H10K 77/111 Flexible substrates
• CPC Class Codes: Y10T 428/2835 including moisture or waterproof component

Abstract

The present invention relates to a method for encapsulating an electronic arrangement against permeants, in which a pressure-sensitive adhesive composition based on vinylaromatic block copolymers is provided, and in which the pressure-sensitive adhesive composition is applied onto and/or around the regions of the electronic arrangement which are to be encapsulated.

Claims

1. Method for encapsulating an electronic arrangement against permeants, in which a pressure-sensitive adhesive composition comprised of vinylaromatic block copolymers is provided, and in which the pressure-sensitive adhesive composition is applied onto and/or around the regions of the electronic arrangement which are to be encapsulated.

2. Method according to claim 1, wherein the pressure-sensitive adhesive composition is provided in the form of an adhesive tape.

3. Method according to claim 1 wherein the pressure-sensitive adhesive composition is crosslinked after application on the electronic arrangement.

4. Method according to claim 1, wherein the application of the pressure-sensitive adhesive composition is effected without subsequent curing.

6. Method of claim 1, wherein the pressure-sensitive adhesive composition contains polymer blocks formed by polymerization of butadiene and/or isoprene, and/or partially or fully hydrogenated polymer blocks.

7. Method according to claim 6, wherein the block copolymers have a polyvinylaromatic fraction of 10% by weight to 35% by weight.

8. Method according to claim 6, wherein the pressure-sensitive adhesive composition has a fraction of the vinylaromatic block copolymers of at least 20% by weight, and/or the pressure-sensitive adhesive composition has a fraction of the vinylaromatic block copolymers of at most 80% by weight.

9. Method according to claim 6, wherein the pressure-sensitive adhesive composition contains a resin or a resin mixture.

10. Method according to claim 6, wherein the pressure-sensitive adhesive composition contains at least one resin which has a DACP value or more than 30°

C. and an MMAP value of more than 50°

C., and/or the pressure-sensitive adhesive composition contains at least one resin which has a softening point of more than 95°

C.

11. Method according to claim 6, wherein the pressure-sensitive adhesive composition contains one or more additives selected from the group consisting of plasticizers, primary antioxidants, secondary antioxidants, process stabilizers, light stabilizers, processing assistants, end block reinforcer resins and polymers.

12. Method according to claim 6, wherein the pressure-sensitive adhesive composition contains one or more nanoscale fillers, transparent fillers and/or getter and/or scavenger fillers.

13. Method according to claim 12, wherein the fillers are embodied in nanoscale fashion in at least one dimension.

14. Method according to claim 12, wherein the pressure-sensitive adhesive composition has a fraction of the fillers of at least 5% by weight and/or has a fraction of the fillers of at most 95% by weight.

15. Method claim 6, wherein the pressure-sensitive adhesive composition has an average transmittance of at least 75% in the wavelength range of 400 nm to 800 nm.

16. Method according to claim 6, wherein the pressure-sensitive adhesive composition is embodied in UV-blocking fashion in the wavelength range of 320 nm to 400 nm, where an average transmittance of at most 20% is designated as UV-blocking.

17. Method according to claim 6, wherein the pressure-sensitive adhesive composition, after crosslinking, has an elongation at break of at least 20%.

18. Method according to claim 6, wherein the pressure-sensitive adhesive composition has a WVTR of less than 100 g/m²·

d and/or an OTR of less than 10 000 g/m²·

d·

bar.

19. Method according to claim 6, wherein the pressure-sensitive adhesive composition is embodied as a carrier-free adhesive tape.

20. Method according to claim 6, wherein the layer thickness of the pressure-sensitive adhesive composition in the adhesive tape is at least 1 μ

m and/or the layer thickness of the pressure-sensitive adhesive composition in the adhesive tape is at most 150 μ

m.

5. (canceled)

21. Electronic arrangement comprising an an organic electronic structure, and a pressure-sensitive adhesive composition, wherein the electronic structure is at least partly encapsulated by the pressure-sensitive adhesive composition, and the pressure-sensitive adhesive is a pressure-sensitive adhesive composition containing polymer blocks formed by polymerization of butadiene and/or isoprene, and/or partially or fully hydrogenated polymer blocks.