SHUTTER DISK HAVING A TUNED COEFFICIENT OF THERMAL EXPANSION

• US 20100071625A1
• Filed: 08/17/2009
• Published: 03/25/2010
• Est. Priority Date: 09/22/2008
• Status: Active Grant

• Current Assignee: Applied Materials Incorporated
• Original Assignee: Applied Materials Incorporated
• Inventors: BROWN, KARL
• Granted Patent: US 8,807,075 B2
• Time in Patent Office: Days
• US Class Current: 118/729
• CPC Class Codes: C23C 14/564 Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
• CPC Class Codes: H01J 37/3408 Planar magnetron sputtering
• CPC Class Codes: H01J 37/3447 Collimators, shutters, apertures

Abstract

A shutter disk having a tuned coefficient of thermal expansion is provided herein. In some embodiments, a shutter disk having a tuned coefficient of thermal expansion may include a body formed from a first material comprising at least two components, wherein a ratio of each of the at least two components to one another is selected to provide a coefficient of thermal expansion of the body that is substantially similar to a coefficient of thermal expansion of a second material to be deposited atop the body.

Claims

1. A shutter disk having a tuned coefficient of thermal expansion, comprising:

a body formed from a first material comprising at least two components, wherein a ratio of each of the at least two components to one another is selected to provide a coefficient of thermal expansion of the body that is substantially similar to a coefficient of thermal expansion of a second material to be deposited atop the body.

2. The shutter disk of claim 1, wherein the coefficient of thermal expansion of the first material is about 5 to about 17 ppm/°

C.

3. The shutter disk of claim 1, wherein the first material comprises aluminum and silicon.

4. The shutter disk of claim 3, wherein a ratio of aluminum to silicon is between about 1:

4 to about 7;

3.

5. The shutter disk of claim 4, wherein the coefficient of thermal expansion of the first material is between about 5 to about 17 ppm/°

C.

6. The shutter disk of claim 1, wherein the body comprises a top surface, bottom surface and peripheral surface coupling the top surface to the bottom surface.

7. The shutter disk of claim 6, wherein at least one of the top surface, bottom surface or peripheral surface is textured.

8. The shutter disk of claim 7, wherein at least one of the top surface, bottom surface or peripheral surface is textured to a roughness average of up to between about 600 to about 800 R_a.

9. The shutter disk of claim 1, wherein the first material comprising at least two components is a spray formed composite material.

10. A process chamber, comprising:

a chamber body defining an inner volume having a target comprising materials to be deposited atop a substrate disposed therein;

a substrate support disposed within the chamber body for supporting the substrate;

a shutter disk for protecting the substrate support, the shutter disk comprising a body formed from a composite material having at least two components, wherein a ratio of each of the at least two components to one another is selected to provide a coefficient of thermal expansion of the body that is substantially similar to a coefficient of thermal expansion of materials to be deposited on the shutter disk; and

a transfer robot movably coupled to the chamber body for transferring the shutter disk to the substrate support.

11. The shutter disk of claim 10, wherein the coefficient of thermal expansion of the composite material is between about 5 to about 17 ppm/°

C.

12. The shutter disk of claim 10, wherein the composite material is a spray formed composite material.

13. The shutter disk of claim 10, wherein the composite material comprises aluminum and silicon.

14. The shutter disk of claim 13, wherein a ratio of aluminum to silicon is between about 1:

4 to about 7;

3.

15. The shutter disk of claim 14, wherein the coefficient of thermal expansion of the composite material is about 5 to about 17 ppm/°

C.

16. The shutter disk of claim 10, wherein the body further comprises:

a top surface;

a bottom surface; and

a peripheral surface coupling the top surface to the bottom surface.

17. The shutter disk of claim 16, wherein at least one of the top surface, bottom surface or peripheral surface is textured.

18. The shutter disk of claim 17, wherein at least one of the top surface, bottom surface or peripheral surface is textured to a roughness average of up to between about 600 to about 800 R_a.

19. The process chamber of claim 10, wherein the materials to be deposited atop the substrate comprise one of titanium (Ti) or titanium nitride (TiN).

20. The process chamber of claim 10, wherein the coefficient of thermal expansion of the materials to be deposited atop the substrate is between about 9 to about 11 ppm/°

C.

21. A shutter disk having a tuned coefficient of thermal expansion, comprising:

a body having a top surface, bottom surface and a peripheral surface coupling the top surface to the bottom surface, wherein the body comprises aluminum and silicon provided in a ratio of aluminum to silicon of about 1;

4 to about 7;

3 and wherein the body has a coefficient of thermal expansion that is substantially similar to a coefficient of thermal expansion of a material to be deposited atop the body.

22. The shutter disk of claim 21, wherein the coefficient of thermal expansion of the body is between about 5 to about 17 ppm/°

C.