METHOD FOR MANUFACTURING A PLATE-TYPE HEAT PIPE AND A PLATE-TYPE HEAT PIPE OBTAINED THEREBY

• US 20100071879A1
• Filed: 09/19/2008
• Published: 03/25/2010
• Est. Priority Date: 09/19/2008
• Status: Abandoned Application

• Current Assignee: Foxconn Technology Co., Ltd.
• Original Assignee: Foxconn Technology Co., Ltd.
• Inventors: Hou, CHUEN-SHU
• Application Number:
  US12/233,602
• Publication Number:
  US 20100071879A1
• Time in Patent Office: Days
• US Class Current: 165/104.260
• CPC Class Codes: F28D 15/0233 the conduits having a particular shape, e.g. non-circular cross-section, annular F28D15/0241, F28D15/0266 take precedence
• CPC Class Codes: F28D 15/046 characterised by the material or the construction of the capillary structure
• CPC Class Codes: Y10T 29/49353 Heat pipe device making

Abstract

A method for manufacturing a plate-type heat pipe includes providing an elongated engaging plate and a base plate. A plurality of supporting members is secured on a top surface of the base plate. A second and third metal powders are filled onto the base plate, surrounding lower ends of the supporting members. The second and third metal powders are heated to obtain a first wick structure and a second wick structure. The first wick structure adheres to the top surface of the base plate and the second wick structure adheres to the top surface of the first wick structure. The base plate and the supporting members are secured to a bottom surface of the engaging plate to obtain a workpiece. A working fluid is injected into the workpiece and the workpiece is vacuumed to obtain the plate-type heat pipe.

Claims

1. A method for manufacturing a plate-type heat pipe comprising:

a) offering an elongated engaging plate and a base plate with a trough therein;

b) securing a plurality of supporting members formed by sintering a first metal powder on a top surface of the base plate;

c) filling a second metal powder and a third metal powder onto the base plate, the second and third powder enclosing bottom ends of the supporting members;

d) heating the base plate and the second and third metal powder at a high temperature to obtain a first wick structure by the second metal powder and a second wick structure by the third metal powder, wherein the first wick structure securely adheres to the top surface of the base plate and the second wick structure securely adheres to the top surface of the first wick structure;

e) securing the base plate and the supporting members to a bottom surface of the engaging plate to obtain a workpiece; and

f) injecting a work fluid into the workpiece, vacuuming the workpiece, and hermetically sealing the sintered workpiece to obtain the plate-type heat pipe.

2. The method for manufacturing a plate-type heat pipe as claimed in claim 1, wherein the supporting members tightly abut against the engaging plate and the base plate.

3. The method for manufacturing a plate-type heat pipe as claimed in claim 2, wherein at step c), a plurality of fourth metal powder is applied on a periphery of each supporting member, and at step d) the fourth metal powder is heated to form a third wick structure on the periphery of the each supporting member.

4. The method for manufacturing a plate-type heat pipe as claimed in claim 3, wherein the third wick structure abuts against the bottom surface of the engaging plate and connects with the second wick structure.

5. The method for manufacturing a plate-type heat pipe as claimed in claim 4, wherein the third wick structure has a plurality of pores communicating with those of the second wick structure.

6. The method for manufacturing a plate-type heat pipe as claimed in claim 5, wherein at step c), a plurality of fifth metal powder is applied on a bottom surface of the engaging plate and at step d), the fifth metal powder is heated to form a fourth wick structure, pores of the fourth wick structure communicating with the pores of the third wick structure.

7. The method for manufacturing a plate-type heat pipe as claimed in claim 1, wherein the supporting members are porous and abut against the engaging plate and the base plate.

8. The method for manufacturing a plate-type heat pipe as claimed in claim 7, wherein at step c), a plurality of sixth metal powder is applied on a bottom surface of the engaging plate and at step d), the sixth metal powder is heated to form a fifth wick structure, pores of the fifth wick structure communicating with the pores of the supporting members.

9. The method for manufacturing a plate-type heat pipe as claimed in claim 7, wherein the third metal powder comprises a particle size exceeding that of the second metal powder.

10. The method for manufacturing a plate-type heat pipe as in claim 1, wherein the supporting members are spaced from each other and perpendicular to the engaging plate and the base plate.

11. A plate-type heat pipe comprising:

a base plate defining a trough in a top surface thereof;

an engaging plate secured on the top surface of the base plate over the trough;

a plurality of supporting members interconnects the top surface of the base plate in the trough and a bottom surface of the engaging plate for reinforcing a strength of the plate-type heat pipe;

a first wick structure provided on the top surface of the base plate in the trough;

a second wick structure provided on a top surface of the first wick structure, wherein the second wick structure has a pore size larger than that of the first wick structure.

12. The plate-type heat pipe as in claim 11, wherein the supporting members each are a solid metal post.

13. The plate-type heat pipe as in claim 12, wherein a third wick structure is formed on a periphery of each of the supporting members.

14. The plate-type heat pipe as in claim 13, wherein a fourth wick structure is formed on the bottom surface of the engaging plate.

15. The plate-type heat pipe as in claim 11, wherein the supporting members each are made of sintered metal powder and have a plurality of pores therein.

16. The plate-type heat pipe as in claim 15, wherein a fifth wick structure is formed on the bottom surface of the engaging plate.