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ELECTRONIC COMPONENT MOUNTING STRUCTURE

  • US 20100071946A1
  • Filed: 09/17/2009
  • Published: 03/25/2010
  • Est. Priority Date: 09/24/2008
  • Status: Active Grant
First Claim
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1. An electronic component mounting structure, comprising:

  • an electronic component including a plurality of bump electrodes, the plurality of the bump electrodes including;

    a base resin provided on an active face of the electronic component; and

    a plurality of conductive films that cover a part of a surface of the base resin, expose an area excluding the part of the surface, and are electrically coupled to a plurality of electrode terminals provided on the active face; and

    a substrate including a plurality of terminals,wherein the electronic component is mounted on the substrate, andwherein the base resin includes;

    a first opening surrounding the plurality of the electrode terminals;

    a connection portion in which a part of one ends of the plurality of the conductive films that are drawn out on the surface of the base resin is disposed, the other ends of the conductive films being coupled to the electrode terminals; and

    a bonding portion that is bonded to the substrate, and is formed in an area excluding the first opening and the connection portion, and an elastic deformation of the base resin at the connection portion allows the bonding portion to bond the substrate so as to maintain the conductive films and the plurality of the terminals on the substrate in a bonded state.

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