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SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

  • US 20100072172A1
  • Filed: 09/18/2009
  • Published: 03/25/2010
  • Est. Priority Date: 09/24/2008
  • Status: Abandoned Application
First Claim
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1. A substrate processing apparatus, comprising:

  • a chamber;

    a first electrode disposed in the chamber and holding a substrate on a main surface of the first electrode;

    a second electrode disposed in the chamber to face the first electrode;

    a RF power source applying to the first electrode a RF voltage whose frequency is equal to or higher than 40 MHz; and

    a pulse voltage applying unit applying to the first electrode a pulse voltage decreasing in accordance with a lapse of time, by superimposing the pulse voltage on the RF voltage.

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