Thin-Film Light Emitting Diode Chip and Method for Producing a Thin-Film Light Emitting Diode Chip
First Claim
1. A thin-film light-emitting diode chip comprising a layer stack having a first main emission surface and an opposite second main emission surface, so that the thin-film light-emitting diode chip has at least two main emission directions, wherein measures for improving the outcoupling of the light generated in the layer sequence are provided on both the first and the second main emission surface.
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Abstract
A thin-film light-emitting diode chip with a layer stack having a first emission surface and an opposite second emission surface, so that the thin-film light-emitting diode chip has at least two main emission directions. Measures for improving the outcoupling of the light generated in the layer sequence are provided on both the first and the second main emission surface. A method is disclosed for manufacturing a thin-film light-emitting diode chip.
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Citations
20 Claims
- 1. A thin-film light-emitting diode chip comprising a layer stack having a first main emission surface and an opposite second main emission surface, so that the thin-film light-emitting diode chip has at least two main emission directions, wherein measures for improving the outcoupling of the light generated in the layer sequence are provided on both the first and the second main emission surface.
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13. A method for manufacturing a thin-film light-emitting diode chip comprising the steps of:
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forming a layer sequence suitable for emitting light from a semiconductor material, on a growth substrate; forming an electrically conductive first contact material layer on a first side of the layer sequence; structuring the first contact material layer to form a contact area; connecting the structured first contact material layer to a carrier; removing the growth substrate; forming an electrically conductive second contact material layer on a second side of the layer sequence on the opposite side from the first side of the layer sequence; structuring the second contact material layer to form a contact area; and separating the first contact material layer from the carrier. - View Dependent Claims (14, 15, 16, 17, 19, 20)
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Specification