Methods and Devices for Fabricating and Assembling Printable Semiconductor Elements
First Claim
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1. An electrical device comprising:
- a first electrode;
a second electrode; and
a printable semiconductor element positioned in electrical contact with said first and second electrodes, said printable semiconductor element comprising a unitary inorganic semiconductor structure and wherein said printable semiconductor element provides a fill factor between said first and second electrodes greater than or equal to about 20%.
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Abstract
The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.
239 Citations
19 Claims
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1. An electrical device comprising:
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a first electrode; a second electrode; and a printable semiconductor element positioned in electrical contact with said first and second electrodes, said printable semiconductor element comprising a unitary inorganic semiconductor structure and wherein said printable semiconductor element provides a fill factor between said first and second electrodes greater than or equal to about 20%. - View Dependent Claims (2, 3, 4, 5)
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6. An electrical device comprising:
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a first electrode; a second electrode; and a printable semiconductor element positioned in electrical contact with said first and second electrodes, said printable semiconductor element comprising a unitary inorganic semiconductor structure having at least one cross sectional dimension greater than or equal to about 500 nanometers. - View Dependent Claims (7, 8, 9, 10, 11, 12, 13, 14)
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15. An electrical device comprising:
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a first electrode; a second electrode; and a printable semiconductor element positioned in electrical contact with said first and second electrodes, said printable semiconductor element comprising a unitary inorganic semiconductor structure, wherein the concentration of heavy metal impurities in said inorganic semiconductor structure is less than or equal to 1 part per million atoms. - View Dependent Claims (16, 17, 18, 19)
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Specification