Semiconductor Device and Method for Manufacturing the Same

• US 20100072611A1
• Filed: 09/22/2009
• Published: 03/25/2010
• Est. Priority Date: 09/25/2008
• Status: Active Grant

• Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Original Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Inventors: Eguchi, Shingo, Oikawa, Yoshiaki
• Granted Patent: US 8,143,708 B2
• Time in Patent Office: Days
• US Class Current: 257/702
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device
• CPC Class Codes: H01L 23/295 containing a filler H01L23/296 takes precedence
• CPC Class Codes: H01L 23/3107 the device being completely enclosed
• CPC Class Codes: H01L 23/60 Protection against electrostatic charges or discharges, e.g. Faraday shields
• CPC Class Codes: H01L 23/645 Inductive arrangements H01L23/647, H01L23/66 take precedence
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/12044 OLED
• CPC Class Codes: H01L 2924/19041 being a capacitor
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding

Abstract

An object is to provide a thin and small semiconductor device that has high reliability and high resistance to external stress and electrostatic discharge. Another object is to manufacture a semiconductor device with high yield while shape defects and defective characteristics which are caused by external stress or electrostatic discharge are prevented in the manufacturing process. A conductive shield covering a semiconductor integrated circuit prevents electrostatic breakdown (malfunction of the circuit or damage to a semiconductor element) of the semiconductor integrated circuit due to electrostatic discharge. By providing an antenna on the external side of the conductive shield, a sufficient communication capability is secured. With the use of a pair of insulators which sandwich the semiconductor integrated circuit, a thin and small semiconductor device that has resistance properties and high reliability can be provided. Further, shape defects and defective characteristics which are caused by external stress or electrostatic discharge are prevented in the manufacturing process, so that a semiconductor device can be manufactured with high yield.

Claims

1. A semiconductor device comprising:

a first insulator and a second insulator provided so as to face each other;

a semiconductor integrated circuit sandwiched between the first insulator and the second insulator;

a conductive film provided so as to cover the first insulator and the second insulator; and

an antenna provided over the conductive film, the antenna being electrically connected to the semiconductor integrated circuit with the conductive film and the first insulator therebetween.

5. The semiconductor device according to any one of claims 1 to 4, wherein the antenna and the conductive film are formed in contact with each other.

6. The semiconductor device according to any one of claims 1 to 4, further comprising an insulating layer interposed between the antenna and the conductive film.

7. The semiconductor device according to any one of claims 1 to 4, wherein each of the first insulator and the second insulator has a structure in which a fibrous body is impregnated with an organic resin.

8. The semiconductor device according to any one of claims 1 to 4, wherein the conductive film includes a metal film.

9. The semiconductor device according to claim 8, wherein the metal film is a titanium film with a thickness of greater than or equal to 5 nm and less than or equal to 100 nm.

10. The semiconductor device according to any one of claims 1 to 4, wherein the conductive film includes a metal oxide film.

11. The semiconductor device according to claim 10, wherein the metal oxide film is an indium tin oxide film or an indium tin oxide film containing silicon oxide with a thickness of greater than or equal to 5 nm and less than or equal to 100 nm.

12. The semiconductor device according to any one of claims 1 to 4, wherein the conductive film includes a semiconductor film or a metal nitride film.

13. The semiconductor device according to any one of claims 1 to 4, wherein the conductive film has a structure in which island-shaped conductors are scattered.

14. The semiconductor device according to any one of claims 1 to 4, wherein the first insulator or the second insulator has a thickness of greater than or equal to 5 μ

m and less than or equal to 50 μ

m.

15. The semiconductor device according to any one of claims 1 to 4, wherein the semiconductor device is one selected from the group consisting of a microprocessor, an RFCPU, and an RFID tag.

2. A semiconductor device comprising:

a first insulator and a second insulator provided so as to face each other;

a semiconductor integrated circuit sandwiched between the first insulator and the second insulator;

a conductive film provided so as to cover the first insulator and the second insulator, wherein the conductive film covering a side surface of the first insulator or the second insulator is thicker than that covering a top surface of the first insulator or the second insulator; and

an antenna provided over the conductive film, the antenna being electrically connected to the semiconductor integrated circuit with the conductive film and the first insulator therebetween.

3. A semiconductor device comprising:

a first insulator and a second insulator provided so as to face each other;

a semiconductor integrated circuit sandwiched between the first insulator and the second insulator;

a conductive film provided so as to cover the first insulator and the second insulator;

an antenna provided over the conductive film, the antenna being electrically connected to the semiconductor integrated circuit with the conductive film and the first insulator therebetween; and

a flexible substrate provided so as to cover the conductive film.

4. A semiconductor device comprising:

a first insulator and a second insulator provided so as to face each other;

a semiconductor integrated circuit sandwiched between the first insulator and the second insulator;

a conductive film provided so as to cover the first insulator and the second insulator, wherein the conductive film covering a side surface of the first insulator or the second insulator is thicker than that covering a top surface of the first insulator or the second insulator;

an antenna provided over the conductive film, the antenna being electrically connected to the semiconductor integrated circuit with the conductive film and the first insulator therebetween; and

a flexible substrate provided so as to cover the conductive film.