Semiconductor Device and Method for Manufacturing the Same
First Claim
1. A semiconductor device comprising:
- a first insulator and a second insulator provided so as to face each other;
a semiconductor integrated circuit sandwiched between the first insulator and the second insulator;
a conductive film provided so as to cover the first insulator and the second insulator; and
an antenna provided over the conductive film, the antenna being electrically connected to the semiconductor integrated circuit with the conductive film and the first insulator therebetween.
1 Assignment
0 Petitions
Accused Products
Abstract
An object is to provide a thin and small semiconductor device that has high reliability and high resistance to external stress and electrostatic discharge. Another object is to manufacture a semiconductor device with high yield while shape defects and defective characteristics which are caused by external stress or electrostatic discharge are prevented in the manufacturing process. A conductive shield covering a semiconductor integrated circuit prevents electrostatic breakdown (malfunction of the circuit or damage to a semiconductor element) of the semiconductor integrated circuit due to electrostatic discharge. By providing an antenna on the external side of the conductive shield, a sufficient communication capability is secured. With the use of a pair of insulators which sandwich the semiconductor integrated circuit, a thin and small semiconductor device that has resistance properties and high reliability can be provided. Further, shape defects and defective characteristics which are caused by external stress or electrostatic discharge are prevented in the manufacturing process, so that a semiconductor device can be manufactured with high yield.
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Citations
15 Claims
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1. A semiconductor device comprising:
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a first insulator and a second insulator provided so as to face each other; a semiconductor integrated circuit sandwiched between the first insulator and the second insulator; a conductive film provided so as to cover the first insulator and the second insulator; and an antenna provided over the conductive film, the antenna being electrically connected to the semiconductor integrated circuit with the conductive film and the first insulator therebetween. - View Dependent Claims (5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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2. A semiconductor device comprising:
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a first insulator and a second insulator provided so as to face each other; a semiconductor integrated circuit sandwiched between the first insulator and the second insulator; a conductive film provided so as to cover the first insulator and the second insulator, wherein the conductive film covering a side surface of the first insulator or the second insulator is thicker than that covering a top surface of the first insulator or the second insulator; and an antenna provided over the conductive film, the antenna being electrically connected to the semiconductor integrated circuit with the conductive film and the first insulator therebetween.
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3. A semiconductor device comprising:
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a first insulator and a second insulator provided so as to face each other; a semiconductor integrated circuit sandwiched between the first insulator and the second insulator; a conductive film provided so as to cover the first insulator and the second insulator; an antenna provided over the conductive film, the antenna being electrically connected to the semiconductor integrated circuit with the conductive film and the first insulator therebetween; and a flexible substrate provided so as to cover the conductive film.
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4. A semiconductor device comprising:
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a first insulator and a second insulator provided so as to face each other; a semiconductor integrated circuit sandwiched between the first insulator and the second insulator; a conductive film provided so as to cover the first insulator and the second insulator, wherein the conductive film covering a side surface of the first insulator or the second insulator is thicker than that covering a top surface of the first insulator or the second insulator; an antenna provided over the conductive film, the antenna being electrically connected to the semiconductor integrated circuit with the conductive film and the first insulator therebetween; and a flexible substrate provided so as to cover the conductive film.
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Specification