METHOD OF MANUFACTURING SEMICONDUCTOR CHIP AND SEMICONDUCTOR MODULE
First Claim
1. A method of manufacturing a semiconductor chip, comprising:
- a comparison step that calculates, based on an equation of an FOM (figure of merit) of a semiconductor chip defined as a product of a term represented by electrical performance of a substrate and a term represented by a manufacturing cost of a semiconductor chip, FOMs of semiconductor chips on substrates of different type, to thereby compare magnitudes of calculation results;
a selection step that selects a desired substrate from the substrates of different type, based on the magnitudes of the calculation results through the comparison step; and
an element formation step that forms a semiconductor element on the desired substrate selected in the selection step.
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Accused Products
Abstract
An FOM (figure of merit) enabling evaluation from a cost aspect, as well as evaluation of electrical performance, is newly proposed to provide a method of manufacturing based on the FOM a semiconductor chip intended for a lower cost production in addition to satisfying electrical performance. An FOMC of a semiconductor chip is defined as the product of a term represented by electrical performance of a substrate S and a term represented by a semiconductor chip cost CC; the FOMC of each of the semiconductor chips on substrates SS, SC of different type is determined by calculation of the product thereof. Based on the magnitudes of the calculation results, a desired substrate is selected from the substrates SS, SC and then a semiconductor chip is fabricated by forming a semiconductor element on the desired substrate selected.
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Citations
6 Claims
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1. A method of manufacturing a semiconductor chip, comprising:
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a comparison step that calculates, based on an equation of an FOM (figure of merit) of a semiconductor chip defined as a product of a term represented by electrical performance of a substrate and a term represented by a manufacturing cost of a semiconductor chip, FOMs of semiconductor chips on substrates of different type, to thereby compare magnitudes of calculation results; a selection step that selects a desired substrate from the substrates of different type, based on the magnitudes of the calculation results through the comparison step; and an element formation step that forms a semiconductor element on the desired substrate selected in the selection step. - View Dependent Claims (2, 3)
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4. A method of manufacturing a semiconductor module, comprising:
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a comparison step that calculates, based on an equation of an FOM (figure of merit) of a semiconductor module defined as a product of a term represented by electrical performance of a substrate and a term represented by a manufacturing cost of a semiconductor chip, FOMs of semiconductor modules on substrates of different type, to thereby compare magnitudes of calculation results; a selection step that selects a desired substrate based on the magnitudes of the calculation results through the comparison step; an element formation step that forms a semiconductor element on the desired substrate selected in the selection step; and a packaging step that interconnects a plurality of semiconductor chips fabricated in the element formation step, to house the plurality thereof in a package. - View Dependent Claims (5, 6)
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Specification