METHOD OF MAKING A SEMICONDUCTOR CHIP ASSEMBLY WITH A POST/BASE/CAP HEAT SPREADER

• US 20100075448A1
• Filed: 11/30/2009
• Published: 03/25/2010
• Est. Priority Date: 03/25/2008
• Status: Active Grant

• Current Assignee: Bridge Semiconductor Corporation
• Original Assignee: Bridge Semiconductor Corporation
• Inventors: Sigmond, David M., Lin, Charles W.C., Wang, Chia-Chung
• Granted Patent: US 8,148,207 B2
• Time in Patent Office: Days
• US Class Current: 438/26
• CPC Class Codes: H01L 21/486 Via connections through the substrate with or without pins
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/32188 the layer connector connecting to a bonding area protruding from the surface of the item
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/85205 Ultrasonic bonding
• CPC Class Codes: H01L 23/3677 Wire-like or pin-like cooling fins or heat sinks
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01012 Magnesium [Mg]
• CPC Class Codes: H01L 2924/01019 Potassium [K]
• CPC Class Codes: H01L 2924/01046 Palladium [Pd]
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/01087 Francium [Fr]
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/3011 : Impedance
• CPC Class Codes: H01L 33/483 : Containers
• CPC Class Codes: H01L 33/642 : characterized by the shape
• CPC Class Codes: H05K 1/0204 : using means for thermal conduction connection in the thickness direction of the substrate H05K1/0207 takes precedence
• CPC Class Codes: H05K 2201/09054 : Raised area or protrusion of metal substrate
• CPC Class Codes: H05K 2201/10106 : Light emitting diode [LED]
• CPC Class Codes: H05K 2203/0369 : Etching selective parts of a metal substrate through part of its thickness, e.g. using etch resist
• CPC Class Codes: H05K 3/0061 : onto a metallic substrate, e.g. a heat sink heat sinks for electric apparatus H05K7/20

Abstract

A method of making a semiconductor chip assembly includes providing a post and a base, mounting an adhesive on the base including inserting the post into an opening in the adhesive, mounting a conductive layer on the adhesive including aligning the post with an aperture in the conductive layer, then flowing the adhesive into and upward in a gap located in the aperture between the post and the conductive layer, solidifying the adhesive, then providing a conductive trace that includes a pad, a terminal and a selected portion of the conductive layer, providing a cap on the post, mounting a semiconductor device on a heat spreader that includes the post, the base and the cap, electrically connecting the semiconductor device to the conductive trace and thermally connecting the semiconductor device to the heat spreader.

Claims

1-50. -50. (canceled)

51. A method of making a semiconductor chip assembly, comprising:

providing a post, a base, an adhesive and a conductive layer, wherein

the post is adjacent to the base, extends above the base in an upward direction, extends into an opening in the adhesive and is aligned with an aperture in the conductive layer,

the base extends below the post in a downward direction opposite the upward direction and extends laterally from the post in lateral directions orthogonal to the upward and downward directions,

the adhesive is mounted on and extends above the base, is sandwiched between the base and the conductive layer and is non-solidified, and

the conductive layer is mounted on and extends above the adhesive;

then

flowing the adhesive into and upward in a gap located in the aperture between the post and the conductive layer;

solidifying the adhesive;

then

providing a conductive trace that includes a pad, a terminal and a selected portion of the conductive layer;

providing a cap on the post that is above and adjacent to and covers in the upward direction and extends laterally in the lateral directions from a top of the post;

then

mounting a semiconductor device on the cap, wherein a heat spreader includes the post, the base and the cap and the semiconductor device overlaps the post;

electrically connecting the semiconductor device to the pad, thereby electrically connecting the semiconductor device to the terminal; and

thermally connecting the semiconductor device to the cap, thereby thermally connecting the semiconductor device to the base.

52. The method of claim 51, wherein providing the post and the base includes:

providing a metal plate;

forming an etch mask on the metal plate that selectively exposes the metal plate;

etching the metal plate in a pattern defined by the etch mask, thereby forming a recess in the metal plate that extends into but not through the metal plate; and

then

removing the etch mask, wherein the post includes an unetched portion of the metal plate that protrudes above the base and is laterally surrounded by the recess, and the base includes an unetched portion of the metal plate below the post and the recess.

53. The method of claim 51, wherein:

providing the adhesive includes providing a prepreg with uncured epoxy;

flowing the adhesive includes melting the uncured epoxy and compressing the uncured epoxy between the base and the conductive layer; and

solidifying the adhesive includes curing the uncured epoxy.

54. The method of claim 51, wherein flowing the adhesive includes filling the gap with the adhesive.

55. The method of claim 51, wherein mounting the conductive layer includes mounting the conductive layer alone on the adhesive.

56. The method of claim 51, wherein:

mounting the conductive layer includes mounting the conductive layer and a carrier on the adhesive, wherein the carrier is attached to and overlaps the conductive layer and the conductive layer contacts the adhesive and is sandwiched between the adhesive and the carrier;

then

solidifying the adhesive;

then

removing the carrier; and

then

providing the conductive trace.

57. The method of claim 51, wherein providing the pad and the terminal includes removing selected portions of the conductive layer after solidifying the adhesive.

58. The method of claim 51, wherein providing the cap includes providing an etch mask that defines the cap.

59. The method of claim 51, wherein mounting the semiconductor device includes providing a first solder joint between the semiconductor device and the pad and a second solder joint between the semiconductor device and the cap, electrically connecting the semiconductor device includes providing the first solder joint between the semiconductor device and the pad, and thermally connecting the semiconductor device includes providing the second solder joint between the semiconductor device and the cap.

60. The method of claim 51, wherein mounting the semiconductor device includes providing a die attach between the semiconductor device and the cap, electrically connecting the semiconductor device includes providing a wire bond between the semiconductor device and the pad, and thermally connecting the semiconductor device includes providing the die attach between the semiconductor device and the cap.

61. A method of making a semiconductor chip assembly, comprising:

providing a post and a base, wherein the post is adjacent to and integral with the base and extends above the base in an upward direction, and the base extends below the post in a downward direction opposite the upward direction and extends laterally from the post in lateral directions orthogonal to the upward and downward directions;

providing an adhesive, wherein an opening extends through the adhesive;

providing a conductive layer, wherein an aperture extends through the conductive layer;

mounting the adhesive on the base, including inserting the post into the opening, wherein the adhesive extends above the base and the post extends into the opening;

mounting the conductive layer on the adhesive, including aligning the post with the aperture, wherein the conductive layer extends above the adhesive and the adhesive is sandwiched between the base and the conductive layer and is non-solidified;

then

applying heat to melt the adhesive;

moving the base and the conductive layer towards one another, thereby moving the post upward in the aperture and applying pressure to the molten adhesive between the base and the conductive layer, wherein the pressure forces the molten adhesive to flow into and upward in a gap located in the aperture between the post and the conductive layer;

applying heat to solidify the molten adhesive, thereby mechanically attaching the post and the base to the conductive layer;

then

providing a conductive trace that includes a pad, a terminal and a routing line, wherein the pad, the terminal and the routing line include selected portions of the conductive layer and an electrically conductive path between the pad and the terminal includes the routing line;

providing a cap that is above and adjacent to and covers in the upward direction and extends laterally in the lateral directions from a top of the post;

then

mounting a semiconductor device on the cap, wherein a heat spreader includes the post, the base and the cap and the semiconductor device overlaps the post;

electrically connecting the semiconductor device to the pad, thereby electrically connecting the semiconductor device to the terminal; and

thermally connecting the semiconductor device to the cap, thereby thermally connecting the semiconductor device to the base.

62. The method of claim 61, wherein providing the post and the base includes:

providing a metal plate;

forming an etch mask on the metal plate that selectively exposes the metal plate;

etching the metal plate in a pattern defined by the etch mask, thereby forming a recess in the metal plate that extends into but not through the metal plate; and

then

removing the etch mask, wherein the post includes an unetched portion of the metal plate that protrudes above the base and is laterally surrounded by the recess, and the base includes an unetched portion of the metal plate below the post and the recess.

63. The method of claim 61, wherein:

providing the adhesive includes providing a prepreg with uncured epoxy;

flowing the adhesive includes melting the uncured epoxy and compressing the uncured epoxy between the base and the conductive layer; and

solidifying the adhesive includes curing the uncured epoxy.

64. The method of claim 61, wherein mounting the conductive layer includes mounting the conductive layer alone on the adhesive.

65. The method of claim 61, wherein providing the pad, the terminal, the routing line and the cap includes removing selected portions of the conductive layer using an etch mask that defines the pad, the terminal, the routing line and the cap.

66. The method of claim 61, wherein providing the pad, the terminal, the routing line and the cap includes:

grinding the post, the adhesive and the conductive layer such that the post, the adhesive and the conductive layer are laterally aligned with one another at a top lateral surface that faces in the upward direction; and

then

removing selected portions of the conductive layer using an etch mask that defines the pad, the terminal, the routing line and the cap.

67. The method of claim 61, wherein providing the pad, the terminal, the routing line and the cap includes:

depositing a second conductive layer on the post, the adhesive and the conductive layer; and

then

removing selected portions of the second conductive layer using an etch mask that defines the pad, the terminal, the routing line and the cap.

68. The method of claim 61, wherein providing the pad, the terminal, the routing line and the cap includes:

grinding the post, the adhesive and the conductive layer such that the post, the adhesive and the conductive layer are laterally aligned with one another at a top lateral surface that faces in the upward direction;

then

depositing a second conductive layer on the post, the adhesive and the conductive layer;

forming an etch mask on the second conductive layer;

etching the conductive layers using the etch mask to define the pad, the terminal and the routing line;

etching the second conductive layer using the etch mask to define the cap; and

then

removing the etch mask.

69. The method of claim 61, wherein mounting the semiconductor device includes mounting an LED package that includes an LED chip on the pad using a first solder joint and on the cap using a second solder joint, electrically connecting the semiconductor device includes providing the first solder joint between the LED package and the pad, and thermally connecting the semiconductor device includes providing the second solder joint between the LED package and the cap.

70. The method of claim 61, wherein mounting the semiconductor device includes providing a die attach between the semiconductor device and the cap, electrically connecting the semiconductor device includes providing a wire bond between the semiconductor device and the pad, and thermally connecting the semiconductor device includes providing the die attach between the semiconductor device and the cap.

71. A method of making a semiconductor chip assembly, comprising:

providing a post and a base, wherein the post is adjacent to and integral with the base and extends above the base in an upward direction, and the base extends below the post in a downward direction opposite the upward direction and extends laterally from the post in lateral directions orthogonal to the upward and downward directions;

providing an adhesive, wherein an opening extends through the adhesive;

providing a first conductive layer, wherein an aperture extends through the first conductive layer;

mounting the adhesive on the base, including inserting the post through the opening, wherein the adhesive extends above the base and the post extends through the opening;

mounting the first conductive layer alone on the adhesive, including inserting the post into the aperture, wherein the first conductive layer extends above the adhesive, the post extends through the opening into the aperture, the post extends through the opening into the aperture, the adhesive is sandwiched between the base and the first conductive layer and is non-solidified, and a gap is located in the aperture between the post and the first conductive layer;

then

applying heat to melt the adhesive;

moving the base and the first conductive layer towards one another, thereby moving the post upward in the aperture and applying pressure to the molten adhesive between the base and the first conductive layer, wherein the pressure forces the molten adhesive to flow into and upward in the gap;

applying heat to solidify the molten adhesive, thereby mechanically attaching the post and the base to the first conductive layer;

then

depositing a second conductive layer on the post, the adhesive and the first conductive layer;

then

providing a conductive trace that includes a pad, a terminal and a routing line, wherein the pad, the terminal and the routing line include selected portions of the first conductive layer and an electrically conductive path between the pad and the terminal includes the routing line;

providing a cap on the post that includes a selected portion of the second conductive layer, including removing selected portions of the second conductive layer, wherein the cap is above and adjacent to and covers in the upward direction and extends laterally in the lateral directions from a top of the post;

then

mounting a semiconductor device on the cap, wherein a heat spreader includes the post, the base and the cap, the semiconductor device overlaps the post and includes a thermal contact surface that faces towards the cap, the cap is shaped and sized to accommodate the thermal contact surface and the top of the post is not shaped and sized to accommodate the thermal contact surface;

electrically connecting the semiconductor device to the pad, thereby electrically connecting the semiconductor device to the terminal; and

thermally connecting the semiconductor device to the cap, thereby thermally connecting the semiconductor device to the base.

72. The method of claim 71, wherein:

providing the adhesive includes providing a prepreg with uncured epoxy;

flowing the adhesive includes melting the uncured epoxy and compressing the uncured epoxy between the base and the first conductive layer; and

solidifying the adhesive includes curing the uncured epoxy.

73. The method of claim 71, wherein providing the pad, the terminal, the routing line and the cap includes:

grinding the post, the adhesive and the first conductive layer such that the post, the adhesive and the first conductive layer are laterally aligned with one another at a top lateral surface that faces in the upward direction;

then

depositing the second conductive layer on the post, the adhesive and the first conductive layer;

then

forming an etch mask on the second conductive layer;

etching the conductive layers using the etch mask to define the pad, the terminal and the routing line;

etching the second conductive layer using the etch mask to define the cap; and

then

removing the etch mask.

74. The method of claim 71, wherein mounting the semiconductor device includes mounting an LED package that includes an LED chip on the pad using a first solder joint and on the cap using a second solder joint, electrically connecting the semiconductor device includes providing the first solder joint between the LED package and the pad, and thermally connecting the semiconductor device includes providing the second solder joint between the LED package and the cap.

75. The method of claim 71, wherein mounting the semiconductor device includes providing a die attach between the semiconductor device and the cap, electrically connecting the semiconductor device includes providing a wire bond between the semiconductor device and the pad, and thermally connecting the semiconductor device includes providing the die attach between the semiconductor device and the cap.

76. A method of making a semiconductor chip assembly, comprising:

providing a post, a base, an adhesive and a substrate, wherein

the substrate includes a conductive layer and a dielectric layer,

the post is adjacent to the base, extends above the base in an upward direction, extends through an opening in the adhesive and extends into an aperture in the substrate,

the base extends below the post in a downward direction opposite the upward direction and extends laterally from the post in lateral directions orthogonal to the upward and downward directions,

the adhesive is mounted on and extends above the base, is sandwiched between the base and the substrate and is non-solidified,

the substrate is mounted on and extends above the adhesive, and the conductive layer extends above the dielectric layer, and

a gap is located in the aperture between the post and the substrate;

then

flowing the adhesive into and upward in the gap;

solidifying the adhesive;

then

providing a cap on the post that is above and adjacent to and covers in the upward direction and extends laterally in the lateral directions from a top of the post;

then

mounting a semiconductor device on the cap, wherein a heat spreader includes the post, the base and the cap, the semiconductor device overlaps the post, a conductive trace includes a pad, a terminal and a selected portion of the conductive layer and the pad is electrically connected to the terminal;

electrically connecting the semiconductor device to the pad, thereby electrically connecting the semiconductor device to the terminal; and

thermally connecting the semiconductor device to the cap, thereby thermally connecting the semiconductor device to the base.

77. The method of claim 76, wherein providing the post and the base includes:

providing a metal plate;

forming an etch mask on the metal plate that selectively exposes the metal plate;

etching the metal plate in a pattern defined by the etch mask, thereby forming a recess in the metal plate that extends into but not through the metal plate; and

then

removing the etch mask, wherein the post includes an unetched portion of the metal plate that protrudes above the base and is laterally surrounded by the recess, and the base includes an unetched portion of the metal plate below the post and the recess.

78. The method of claim 76, wherein:

providing the adhesive includes providing a prepreg with uncured epoxy;

flowing the adhesive includes melting the uncured epoxy and compressing the uncured epoxy between the base and the substrate; and

solidifying the adhesive includes curing the uncured epoxy.

79. The method of claim 76, wherein flowing the adhesive includes filling the gap with the adhesive.

80. The method of claim 76, wherein providing the pad includes removing selected portions of the conductive layer after solidifying the adhesive.

81. The method of claim 76, wherein providing the pad and the terminal includes removing selected portions of the conductive layer after solidifying the adhesive.

82. The method of claim 76, wherein providing the terminal includes removing selected portions of the base after solidifying the adhesive.

83. The method of claim 76, wherein providing the cap includes providing an etch mask that defines the cap.

84. The method of claim 76, wherein mounting the semiconductor device includes providing a first solder joint between the semiconductor device and the pad and a second solder joint between the semiconductor device and the cap, electrically connecting the semiconductor device includes providing the first solder joint between the semiconductor device and the pad, and thermally connecting the semiconductor device includes providing the second solder joint between the semiconductor device and the cap.

85. The method of claim 76, wherein mounting the semiconductor device includes providing a die attach between the semiconductor device and the cap, electrically connecting the semiconductor device includes providing a wire bond between the semiconductor device and the pad, and thermally connecting the semiconductor device includes providing the die attach between the semiconductor device and the cap.

86. A method of making a semiconductor chip assembly, comprising:

providing a post and a base, wherein the post is adjacent to and integral with the base and extends above the base in an upward direction, and the base extends below the post in a downward direction opposite the upward direction and extends laterally from the post in lateral directions orthogonal to the upward and downward directions;

providing an adhesive, wherein an opening extends through the adhesive;

providing a substrate that includes a conductive layer and a dielectric layer, wherein an aperture extends through the substrate;

mounting the adhesive on the base, including inserting the post through the opening, wherein the adhesive extends above the base and the post extends through the opening;

mounting the substrate on the adhesive, including inserting the post into the aperture, wherein the substrate extends above the adhesive, the conductive layer extends above the dielectric layer, the post extends through the opening into the aperture, the adhesive is sandwiched between the base and the substrate and is non-solidified, and a gap is located in the aperture between the post and the substrate;

then

applying heat to melt the adhesive;

moving the base and the substrate towards one another, thereby moving the post upward in the aperture and applying pressure to the molten adhesive between the base and the substrate, wherein the pressure forces the molten adhesive to flow into and upward in the gap and the post and the molten adhesive extend above the dielectric layer;

applying heat to solidify the molten adhesive, thereby mechanically attaching the post and the base to the substrate;

then

providing a pad, a terminal and a cap, wherein the pad includes a selected portion of the conductive layer and the cap is above and adjacent to and covers in the upward direction and extends laterally in the lateral directions from a top of the post;

then

mounting a semiconductor device on the cap, wherein a heat spreader includes the post, the base and the cap, the semiconductor device overlaps the post and the pad is electrically connected to the terminal;

electrically connecting the semiconductor device to the pad, thereby electrically connecting the semiconductor device to the terminal; and

thermally connecting the semiconductor device to the cap, thereby thermally connecting the semiconductor device to the base.

87. The method of claim 86, wherein providing the post and the base includes:

providing a metal plate;

forming an etch mask on the metal plate that selectively exposes the metal plate;

etching the metal plate in a pattern defined by the etch mask, thereby forming a recess in the metal plate that extends into but not through the metal plate; and

then

removing the etch mask, wherein the post includes an unetched portion of the metal plate that protrudes above the base and is laterally surrounded by the recess, and the base includes an unetched portion of the metal plate below the post and the recess.

88. The method of claim 86, wherein:

providing the adhesive includes providing a prepreg with uncured epoxy;

flowing the adhesive includes melting the uncured epoxy and compressing the uncured epoxy between the base and the substrate; and

solidifying the adhesive includes curing the uncured epoxy.

89. The method of claim 86, wherein providing the pad and the terminal includes removing selected portions of the conductive layer using an etch mask that defines the pad, the terminal and the cap after solidifying the adhesive.

90. The method of claim 86, wherein providing the pad includes removing selected portions of the conductive layer using an etch mask that defines the pad and the cap after solidifying the adhesive, and providing the terminal includes removing selected portions of the base using an etch mask that defines the terminal after solidifying the adhesive.

91. The method of claim 86, wherein providing the pad and the terminal includes:

grinding the post, the adhesive and the conductive layer such that the post, the adhesive and the conductive layer are laterally aligned with one another at a top lateral surface that faces in the upward direction; and

then

removing selected portions of the conductive layer using an etch mask that defines the pad, the terminal and the cap.

92. The method of claim 86, wherein providing the pad and the cap includes:

depositing a second conductive layer on the post, the adhesive and the conductive layer; and

then

removing selected portions of the second conductive layer using an etch mask that defines the pad and the cap.

93. The method of claim 86, wherein providing the pad and the cap includes:

grinding the post, the adhesive and the conductive layer such that the post, the adhesive and the conductive layer are laterally aligned with one another at a top lateral surface that faces in the upward direction;

then

depositing a second conductive layer on the post, the adhesive and the conductive layer;

forming an etch mask on the second conductive layer;

etching the conductive layers using the etch mask to define the pad;

etching the second conductive layer using the etch mask to define the cap; and

then

removing the etch mask.

94. The method of claim 86, including providing a thermal via that is spaced from the post, extends through the dielectric layer and the adhesive outside the opening and the aperture and is adjacent to and thermally connects the base and the cap.

95. The method of claim 86, wherein mounting the semiconductor device includes mounting an LED package that includes an LED chip on the pad using a first solder joint and on the cap using a second solder joint, electrically connecting the semiconductor device includes providing the first solder joint between the LED package and the pad, and thermally connecting the semiconductor device includes providing the second solder joint between the LED package and the cap.

96. A method of making a semiconductor chip assembly, comprising:

providing a post and a base, wherein the post is adjacent to and integral with the base and extends above the base in an upward direction, and the base extends below the post in a downward direction opposite the upward direction and extends laterally from the post in lateral directions orthogonal to the upward and downward directions;

providing an adhesive, wherein an opening extends through the adhesive;

providing a substrate that includes a first conductive layer and a dielectric layer, wherein an aperture extends through the substrate;

mounting the adhesive on the base, including inserting the post through the opening, wherein the adhesive extends above the base and the post extends through the opening;

mounting the substrate on the adhesive, including inserting the post into the aperture, wherein the substrate extends above the adhesive, the first conductive layer extends above the dielectric layer, the post extends through the opening into the aperture, the adhesive is sandwiched between the base and the substrate and is non-solidified, and a gap is located in the aperture between the post and the substrate;

then

applying heat to melt the adhesive;

moving the base and the substrate towards one another, thereby moving the post upward in the aperture and applying pressure to the molten adhesive between the base and the substrate, wherein the pressure forces the molten adhesive to flow into and upward in the gap and the post and the molten adhesive extend above the dielectric layer;

applying heat to solidify the molten adhesive, thereby mechanically attaching the post and the base to the substrate;

then

depositing a second conductive layer on the post, the adhesive and the first conductive layer;

then

providing a pad and a terminal that include selected portions of the conductive layers, including removing selected portions of the conductive layers;

providing a cap on the post that includes a selected portion of the second conductive layer, including removing selected portions of the second conductive layer, wherein the cap is above and adjacent to and covers in the upward direction and extends laterally in the lateral directions from a top of the post;

then

mounting a semiconductor device on the cap, wherein a heat spreader includes the post, the base and the cap, the semiconductor device overlaps the post and includes a thermal contact surface that faces towards the cap, the pad is electrically connected to the terminal, the cap is shaped and sized to accommodate the thermal contact surface and the top of the post is not shaped and sized to accommodate the thermal contact surface;

electrically connecting the semiconductor device to the pad, thereby electrically connecting the semiconductor device to the terminal; and

thermally connecting the semiconductor device to the cap, thereby thermally connecting the semiconductor device to the base.

97. The method of claim 96, wherein:

providing the adhesive includes providing a prepreg with uncured epoxy;

flowing the adhesive includes melting the uncured epoxy and compressing the uncured epoxy between the base and the substrate; and

solidifying the adhesive includes curing the uncured epoxy.

98. The method of claim 96, wherein providing the pad and the cap includes:

grinding the post, the adhesive and the first conductive layer such that the post, the adhesive and the first conductive layer are laterally aligned with one another at a top lateral surface that faces in the upward direction;

then

depositing the second conductive layer on the post, the adhesive and the first conductive layer;

then

forming an etch mask on the second conductive layer;

etching the conductive layers using the etch mask to define the pad;

etching the second conductive layer using the etch mask to define the cap; and

then

removing the etch mask.

99. The method of claim 96, wherein providing the pad, the terminal and the cap includes:

grinding the post, the adhesive and the first conductive layer such that the post, the adhesive and the first conductive layer are laterally aligned with one another at a top lateral surface that faces in the upward direction;

then

depositing the second conductive layer on the post, the adhesive and the first conductive layer;

then

forming an etch mask on the second conductive layer;

etching the conductive layers using the etch mask to define the pad and the terminal;

etching the second conductive layer using the etch mask to define the cap; and

then

removing the etch mask.

100. The method of claim 96, wherein mounting the semiconductor device includes mounting an LED package that includes an LED chip on the pad using a first solder joint and on the cap using a second solder joint, electrically connecting the semiconductor device includes providing the first solder joint between the LED package and the pad, and thermally connecting the semiconductor device includes providing the second solder joint between the LED package and the cap.