PLASMA PROCESSING APPARATUS AND METHODS FOR REMOVING EXTRANEOUS MATERIAL FROM SELECTED AREAS ON A SUBSTRATE
First Claim
1. A method for plasma treating a substrate in the processing space of the vacuum chamber, the substrate having a first side, a plurality of features projecting from the first side, a second side opposite to the first side, and an extraneous material on the second side, the method comprising:
- covering the first side of the substrate with a mask having a plurality of concavities each positioned and dimensioned to receive a respective one of the plurality of features projecting from the first side of the first substrate;
sealing about each of the plurality of concavities to prevent the ingress of a plasma into the plurality of concavitiesgenerating a plasma in the processing space; and
exposing the second side of the substrate to the plasma to remove the extraneous material.
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Accused Products
Abstract
Apparatus and methods for shielding a feature projecting from a first area on a substrate to a plasma while simultaneously removing extraneous material from a different area on the substrate with the plasma. The apparatus includes at least one concavity positioned and dimensioned to receive the feature such that the feature is shielded from the plasma. The apparatus further includes a window through which the plasma removes the extraneous material. The method generally includes removing the extraneous material while shielding the feature against plasma exposure.
46 Citations
7 Claims
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1. A method for plasma treating a substrate in the processing space of the vacuum chamber, the substrate having a first side, a plurality of features projecting from the first side, a second side opposite to the first side, and an extraneous material on the second side, the method comprising:
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covering the first side of the substrate with a mask having a plurality of concavities each positioned and dimensioned to receive a respective one of the plurality of features projecting from the first side of the first substrate; sealing about each of the plurality of concavities to prevent the ingress of a plasma into the plurality of concavities generating a plasma in the processing space; and exposing the second side of the substrate to the plasma to remove the extraneous material. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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Specification