LED PHOSPHOR DEPOSITION

• US 20100078664A1
• Filed: 09/30/2008
• Published: 04/01/2010
• Est. Priority Date: 09/30/2008
• Status: Active Grant

• Current Assignee: Bridgelux Incorporated
• Original Assignee: Bridgelux Incorporated
• Inventors: Helbing, Rene Peter
• Granted Patent: US 8,247,827 B2
• Time in Patent Office: Days
• US Class Current: 257/98
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 33/483 Containers
• CPC Class Codes: H01L 33/54 having a particular shape
• CPC Class Codes: H01L 33/60 Reflective elements

Abstract

LED phosphor deposition for use with LEDs. In an aspect, a method is provided for forming an encapsulation. The method includes determining a geometric shape for the encapsulation, selecting a dam material, applying the dam material to a substrate to form a boundary defining a region having the geometric shape, and filling the region with encapsulation material to form the encapsulation. In another aspect, an LED apparatus is provided that includes at least one LED chip and an encapsulation disposed on the at least one LED chip. The encapsulation is formed by determining a geometric shape for the encapsulation, selecting a dam material, applying the dam material to a substrate to form a boundary defining a region having the geometric shape, and filling the region with encapsulation material to form the encapsulation.

Claims

1. A method for forming an encapsulation, the method comprising:

determining a geometric shape for the encapsulation;

selecting a dam material;

applying the dam material to a substrate to form a boundary defining a region having the geometric shape; and

filling the region with encapsulation material to form the encapsulation.

2. The method of claim 1, wherein said selecting comprises selecting the dam material to provide a selected radiation pattern.

3. The method of claim 1, wherein said selecting comprises selecting the dam material to be a reflective material that reflects light.

4. The method of claim 1, wherein said selecting comprises selecting the dam material to be a transparent material that passes light.

5. The method of claim 1, wherein said applying comprises applying the dam material so that it has at least one of a selected cross-section and a selected height above the substrate.

6. The method of claim 1, wherein said selecting comprises selecting one of silicone or epoxy as the dam material.

7. The method of claim 1, wherein said applying comprises applying the dam material with an automated dispenser.

8. A light emitting diode (LED) apparatus comprising:

at least one LED chip; and

an encapsulation disposed on the at least one LED chip, wherein the encapsulation is formed by;

determining a geometric shape for the encapsulation;

selecting a dam material;

applying the dam material to a substrate to form a boundary defining a region having the geometric shape; and

filling the region with encapsulation material to form the encapsulation.

9. The apparatus of claim 8, wherein the dam material is selected to provide a selected radiation pattern.

10. The apparatus of claim 8, wherein the dam material is a reflective material that reflects light.

11. The apparatus of claim 8, wherein the dam material is a transparent material that passes light.

12. The apparatus of claim 8, wherein said applying comprises applying the dam material so that it has at least one of a selected cross-section and a selected height above the substrate.

13. The apparatus of claim 8, wherein said selecting comprises selecting one of silicone or epoxy as the dam material.

14. The apparatus of claim 8, wherein said applying comprises applying the dam material with an automated dispenser.

15. A light emitting diode (LED) lamp comprising:

a package;

a light emitting diode apparatus coupled to the package and comprising;

at least one LED chip and an encapsulation disposed on the at least one LED chip, wherein the encapsulation is formed by;

determining a geometric shape for the encapsulation;

selecting a dam material;

applying the dam material to a substrate to form a boundary defining a region having the geometric shape; and

filling the region with encapsulation material to form the encapsulation.

16. The lamp of claim 15, wherein the dam material is selected to provide a selected radiation pattern.

17. The lamp of claim 15, wherein the dam material is a reflective material that reflects light.

18. The lamp of claim 15, wherein the dam material is a transparent material that passes light.

19. The lamp of claim 15, wherein said applying comprises applying the dam material so that it has at least one of a selected cross-section and a selected height above the substrate.

20. The lamp of claim 15, wherein said selecting comprises selecting one of silicone or epoxy as the dam material.

21. (canceled)