INTEGRATED CIRCUIT MODULE WITH INTEGRATED PASSIVE DEVICE

• US 20100078760A1
• Filed: 09/30/2008
• Published: 04/01/2010
• Est. Priority Date: 09/30/2008
• Status: Active Grant

• Current Assignee: North Star Innovations Inc. (Wi-LAN Inc.)
• Original Assignee: Freescale Semiconductor, Inc. (NXP Semiconductors NV)
• Inventors: Tang, Jinbang, Wenzel, Robert J., Frear, Darrel R.
• Granted Patent: US 7,763,976 B2
• Time in Patent Office: Days
• US Class Current: 257/531
• CPC Class Codes: H01L 21/568 Temporary substrate used as encapsulation process aid H01L21/4832 and H01L21/566 take precedence
• CPC Class Codes: H01L 2223/6627 Waveguides, e.g. microstrip line, strip line, coplanar line
• CPC Class Codes: H01L 2224/04105 Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
• CPC Class Codes: H01L 2224/20 Structure, shape, material or disposition of high density interconnect preforms
• CPC Class Codes: H01L 2224/96 the devices being encapsulated in a common layer, e.g. neo-wafer or pseudo-wafer, said common layer being separable into individual assemblies after connecting
• CPC Class Codes: H01L 23/50 for integrated circuit devices, e.g. power bus, number of leadsH01L23/482 - H01L23/498 take precedence
• CPC Class Codes: H01L 23/5389 the chips being integrally enclosed by the interconnect and support structures
• CPC Class Codes: H01L 24/19 Manufacturing methods of high density interconnect preforms
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/01027 Cobalt [Co]
• CPC Class Codes: H01L 2924/01029 Copper [Cu]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01075 Rhenium [Re]
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/1815 Shape
• CPC Class Codes: H01L 2924/19041 being a capacitor
• CPC Class Codes: H01L 2924/19042 being an inductor
• CPC Class Codes: H01L 2924/19043 being a resistor

Abstract

A disclosed integrated circuit (IC) module includes an IC panel and multi level circuit structure, referred to as an IPD structure, overlying an upper surface of the IC panel. The IC panel includes an electrically conductive embedded ground plane (EGP), an integrated circuit (IC) die, and an encapsulating material. The EGP is a substantially planar structure that includes or defines a plurality of cavities. The EGP may include or define an IC cavity and an IPD cavity. The IC die may be positioned within the IC cavity such that a perimeter of the IC cavity surrounds the IC die. The IPD structure may define or include a passive device such as an inductor. The passive device may be positioned or located overlying the void in the EGP.

Claims

1. An IC module, comprising:

an IC panel, comprising;

an electrically conductive embedded ground plane (EGP) defining an integrated circuit (IC) cavity and an integrated passive device (IPD) cavity;

an IC die positioned wherein a perimeter of the IC cavity surrounds the IC die; and

an encapsulating material encapsulating substantially all but an active surface of the IC die and the EGP and filling the IPD void; and

an IPD structure overlying an upper surface of the IC panel, wherein the IPD structure defines an IPD having a first terminal in electrical contact with the IC die and wherein at least a portion of the IPD overlies the encapsulating material filling the IPD cavity.

2. The module of claim 1, wherein the IPD comprises an inductive transmission line element including an inductor.

3. The module of claim 2, wherein the IPD comprises a microstrip (MS) inductor.

4. The module of claim 2, wherein the IPD comprises a coplanar wave guide (CPW) inductor.

5. The module of claim 1, wherein the EGP comprises a conductive material selected from the group consisting of aluminum and copper.

6. The module of claim 1, wherein the EGP includes an exposed surface and further wherein the active surface of the IC die and the exposed surface of the EGP are substantially co-planar.

7. The module of claim 6, wherein an upper surface of the .encapsulating material is substantially co-planar with the active surface of the IC die.

8. The module of claim 1, wherein the IPD structure includes a first layer formed in contact with an upper surface of the IC panel, the first layer including a first dielectric layer, first via elements contacting elements of the IC die, and a first interconnect element.

9. The module of claim 8, wherein the IPD structure includes a second layer formed in contact with an upper surface of the first layer, the second layer including a second dielectric layer, second via elements contacting elements of the first dielectric layer, and a second interconnect element.

10. The module of claim 1, wherein the IC die comprises a radio frequency IC.

21. The IC module of claim 1, wherein the encapsulating material comprises a spun-on polymer.

22. The IC module of claim 1, wherein the encapsulating material comprises a dielectric molding material.

23. The IC module of claim 1, wherein the encapsulating material comprises an epoxy-based, heat-curable encapsulating material.

11-17. -17. (canceled)

18. A multi-component assembly, comprising:

a radio frequency (RF) integrated circuit (IC) operable as an RF transceiver;

an electrically conductive embedded ground plane (EGP), wherein the EGP includes;

a device cavity defining a device cavity perimeter that surrounds the RF IC; and

an IPD cavity;

an encapsulating material encapsulating the RF IC and the EGP, wherein an active surface of the RF IC, a surface of the EGP, and a surface of the encapsulating material are substantially co-planar and wherein the encapsulating material occupies the IPD cavity;

a plurality of interconnect layers defining an inductor, wherein the inductor overlies the encapsulating material occupying the IPD cavity.

19. The assembly of claim 18, wherein the inductor comprises a microstrip inductor.

20. The assembly of claim 18, wherein the inductor comprises a coplanar waveguide inductor.

24. The multi-component assembly of claim 18, wherein the encapsulating material comprises a spun-on polymer.

25. The multi-component assembly of claim 18, wherein the encapsulating material comprises a dielectric molding material.

26. The multi-component assembly of claim 18, wherein the encapsulating material comprises an epoxy-based, heat-curable encapsulating material.