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SEMICONDUCTOR APPARATUS, SUBSTRATE DESIGN METHOD, AND SUBSTRATE DESIGN APPARATUS

  • US 20100078810A1
  • Filed: 09/28/2009
  • Published: 04/01/2010
  • Est. Priority Date: 09/30/2008
  • Status: Active Grant
First Claim
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1. A semiconductor apparatus comprising:

  • a substrate; and

    a semiconductor chip mounted on the substrate, wherein the substrate has plural holes, and the plural holes are provided such that the density on a substrate surface of the holes in a first area, which is an area of the substrate facing a semiconductor chip peripheral portion, is higher than the density on the substrate surface of the holes in an area excluding the first area on the substrate.

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