CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME
First Claim
1. A circuit device comprising:
- a semiconductor element;
a conductive member which is connected to the semiconductor element via a thin metal wire; and
a sealing resin which is made of a resin material mixed with filler particles and which seals the circuit device with the semiconductor element and the thin metal wire disposed therein, whereina thickness of a portion, covering a top portion of the thin metal wire, of the sealing resin is made smaller than a maximum diameter of the filler particles, andthe filler particles located in an uppermost portion of the sealing resin are covered with the resin material.
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Accused Products
Abstract
Provided are a thin circuit device with show-through of thin metal wires prevented and a method of manufacturing the circuit device. A circuit device mainly includes: a substrate including a first substrate and second substrates; pads formed respectively on upper surfaces of the second substrates; a semiconductor element fixed on an upper surface of the first substrate; thin metal wires each connecting the semiconductor elements and a corresponding one of the pads; and a sealing resin with which the semiconductor element and the thin metal wires are covered, and which thereby seals the circuit device with the semiconductor element and the thin metal wires disposed therein. Furthermore, filler particles located in the uppermost portion of the sealing resin are covered with a resin material constituting the sealing resin.
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Citations
12 Claims
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1. A circuit device comprising:
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a semiconductor element; a conductive member which is connected to the semiconductor element via a thin metal wire; and a sealing resin which is made of a resin material mixed with filler particles and which seals the circuit device with the semiconductor element and the thin metal wire disposed therein, wherein a thickness of a portion, covering a top portion of the thin metal wire, of the sealing resin is made smaller than a maximum diameter of the filler particles, and the filler particles located in an uppermost portion of the sealing resin are covered with the resin material. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A method of manufacturing a circuit device, the method comprising the steps of:
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connecting an electrode formed on an upper surface of a semiconductor element to a conductive member via a thin metal wire; and covering the semiconductor element and the thin metal wire with a sealing resin by injection molding using a mold, the sealing resin being made of a resin material mixed with filler particles, wherein in the covering step, a thickness of a portion, covering a top portion of the thin metal wire, of the sealing resin is made smaller than a maximum diameter of the filler particles, and the filler particles located in an uppermost portion of the sealing resin are covered with the resin material. - View Dependent Claims (9, 10, 11, 12)
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Specification