Exposure apparatus, exposure method, and method for producing device

• US 20100079743A1
• Filed: 08/13/2009
• Published: 04/01/2010
• Est. Priority Date: 09/29/2008
• Status: Active Grant

• Current Assignee: Nikon Corporation
• Original Assignee: Nikon Corporation
• Inventors: Hidaka, Yasuhiro, Nagayama, Tadashi, Kiuchi, Tohru
• Granted Patent: US 8,384,875 B2
• Time in Patent Office: Days
• US Class Current: 355/74
• CPC Class Codes: G03F 7/70208 Multiple illumination paths, e.g. radiation distribution devices, microlens illumination systems, multiplexers or demultiplexers for single or multiple projection systems
• CPC Class Codes: G03F 7/70275 Multiple projection paths, e.g. array of projection systems, microlens projection systems or tandem projection systems

Abstract

An exposure apparatus includes a mask-moving section movable in a first direction while holding a mask formed with a pattern; an illumination system which forms first and second illumination areas separated each other by a spacing distance in the first direction; a substrate-moving section movable in a second direction while holding a photosensitive substrate; a projection optical system which forms first and second projected images of the patterns of the first and second illumination areas; and a restricting section which restricts the first and second projected images to be within first and second projection areas respectively. A spacing distance between a first conjugate area with the first projection area and a second conjugate area with the second projection area is set to be such a spacing distance that scanning exposures are successively performed for first and second transfer areas provided adjacently in the second direction.

Claims

1. An exposure apparatus comprising:

a mask-moving section which holds a mask formed with a pattern and which is movable in a first direction;

an illumination system which irradiates an exposure light onto the mask held by the mask-moving section and which forms a first illumination area and a second illumination area separated from each other by a spacing distance in the first direction;

a substrate-moving section which holds a photosensitive substrate and which is movable in a second direction corresponding to the first direction and in synchronization with the mask-moving section;

a projection optical system which forms a first projected image of the pattern positioned in the first illumination area and a second projected image of the pattern positioned in the second illumination area, on the photosensitive substrate held by the substrate-moving section; and

a restricting section which restricts the first projected image and the second projected image on the photosensitive substrate to be within a first projection area and a second projection area respectively on the photosensitive substrate;

wherein an area-to-area spacing distance, in the first direction, between a first conjugate area optically conjugate with the first projection area via the projection optical system and a second conjugate area optically conjugate with the second projection area via the projection optical system is set to be such a spacing distance that scanning exposures with the pattern with respect to a first transfer area and a second transfer area provided adjacently in the second direction on the photosensitive substrate are successively performed corresponding to synchronous movement of the mask-moving section and the substrate-moving section.

2. The exposure apparatus according to claim 1, wherein the area-to-area spacing distance is set to be a spacing distance based on a size of the first transfer area or the second transfer area in the second direction, a spacing distance between the first projection area and the second projection area in the second direction, a spacing distance between the first transfer area and the second transfer area in the second direction, and a magnification of the projection optical system.

3. The exposure apparatus according to claim 2, wherein the following relationship holds among a center-to-center spacing distance U between a center of the first conjugate area and a center of the second conjugate area in the first direction, a size S of the first transfer area or the second transfer area in the second direction, a center-to-center spacing distance V between a center of the first projection area and a center of the second projection area in the second direction, a spacing distance K between the first transfer area and the second transfer area in the second direction, and an absolute value β

of the projection magnification of the projection optical system;

U=(S+K+V)/β

.

4. The exposure apparatus according to claim 1, wherein the following relationship holds among a center-to-center spacing distance U between a center of the first conjugate area and a center of the second conjugate area in the first direction, a size P of a pattern area formed with the pattern on the mask in the first direction, a center-to-center spacing distance V between a center of the first projection area and a center of the second projection area in the second direction, a spacing distance K between the first transfer area and the second transfer area in the second direction, and an absolute value β

of a projection magnification of the projection optical system;

U=P+(K+V)/β

.

5. The exposure apparatus according to claim 1, wherein the following relationship holds among a center-to-center spacing distance U between a center of the first illumination area and a center of the second illumination area in the first direction, a size P of a pattern area formed with the pattern on the mask in the first direction, a size D of the first illumination area or the second irradiation area in the first direction, a spacing distance T between the first projection area and the second projection area in the second direction, a spacing distance K between the first transfer area and the second transfer area in the second direction, and an absolute value β

of a projection magnification of the projection optical system;

U=P+D+(T+K)/β

.

6. The exposure apparatus according to claim 3, wherein the substrate-moving section is moved in a direction directed from the first projection area to the second projection area in the second direction and in synchronization with movement of the mask-moving section in a direction directed from the first conjugate area to the second conjugate area in the first direction.

7. The exposure apparatus according to claim 4, wherein the substrate-moving section is moved in a direction directed from the first projection area to the second projection area in the second direction and in synchronization with movement of the mask-moving section in a direction directed from the first conjugate area to the second conjugate area in the first direction.

8. The exposure apparatus according to claim 5, wherein the substrate-moving section is moved in a direction directed from the first projection area to the second projection area in the second direction and in synchronization with movement of the mask-moving section in a direction directed from the first conjugate area to the second conjugate area in the first direction.

9. The exposure apparatus according to claim 2, wherein the following relationship holds among a center-to-center spacing distance U between a center of the first conjugate area and a center of the second conjugate area in the first direction, a size S of the first transfer area or the second transfer area in the second direction, a center-to-center spacing distance V between a center of the first projection area and a center of the second projection area in the second direction, a spacing distance K between the first transfer area and the second transfer area in the second direction, and an absolute value β

of the projection magnification of the projection optical system;

U=(S+K−

V)/β

.

10. The exposure apparatus according to claim 1, wherein the following relationship holds among a center-to-center spacing distance U between a center of the first conjugate area and a center of the second conjugate area in the first direction, a size P of a pattern area formed with the pattern on the mask in the first direction, a center-to-center spacing distance V between a center of the first projection area and a center of the second projection area in the second direction, a spacing distance K between the first transfer area and the second transfer area in the second direction, and an absolute value β

of a projection magnification of the projection optical system;

U=P+(K−

V)/β

.

11. The exposure apparatus according to claim 1, wherein the following relationship holds among a center-to-center spacing distance U between a center of the first illumination area and a center of the second illumination area in the first direction, a size P of a pattern area formed with the pattern on the mask in the first direction, a size D of the first illumination area or the second irradiation area in the first direction, a spacing distance T between the first projection area and the second projection area in the second direction, a spacing distance K between the first transfer area and the second transfer area in the second direction, and an absolute value β

of a projection magnification of the projection optical system;

U=P−

D−

(T−

K)/β

.

12. The exposure apparatus according to claim 9, wherein the substrate-moving section is moved in a direction directed from the second projection area to the first projection area in the second direction and in synchronization with movement of the mask-moving section in a direction directed from the first conjugate area to the second conjugate area in the first direction.

13. The exposure apparatus according to claim 10, wherein the substrate-moving section is moved in a direction directed from the second projection area to the first projection area in the second direction and in synchronization with movement of the mask-moving section in a direction directed from the first conjugate area to the second conjugate area in the first direction.

14. The exposure apparatus according to claim 11, wherein the substrate-moving section is moved in a direction directed from the second projection area to the first projection area in the second direction and in synchronization with movement of the mask-moving section in a direction directed from the first conjugate area to the second conjugate area in the first direction.

15. The exposure apparatus according to claim 1, wherein the restricting section sets a first size of the first projection area in the second direction and a second size of the second projection area in the second direction corresponding to synchronous movement of the mask-moving section and the substrate-moving section.

16. The exposure apparatus according to claim 15, wherein the restricting section sets the first size and the second size based on movement information corresponding to a movement position of the mask-moving section in the first direction and a movement position of the substrate-moving section in the second direction.

17. The exposure apparatus according to claim 16, wherein the restricting section includes a light-shielding member which is provided movably in a direction intersecting an optical path for the exposure light, and a shielding controller which sets a position of the light-shielding member with respect to the optical path for the exposure light based on the movement information.

18. The exposure apparatus according to claim 1 wherein the projection optical system includes a first imaging system which forms a first intermediate image of the pattern, a second imaging system which forms a second intermediate image of the pattern, and a third imaging system which forms the first projected image in the first projection area based on the first intermediate image and which forms the second projected image in the second projection area based on the second intermediate image.

19. The exposure apparatus according to claim 18, wherein the first imaging system and the second imaging system are catadioptric optical systems which are provided symmetrically in relation to an optical axis of the third imaging system.

20. The exposure apparatus according to claim 18, wherein the first imaging system has a first front side imaging system which forms a third intermediate image of the pattern, and a first rear side imaging system which forms the first intermediate image based on the third intermediate image;

and

the second imaging system has a second front side imaging system which forms a fourth intermediate image of the pattern, and a second rear side imaging system which forms the second intermediate image based on the fourth intermediate image.

21. The exposure apparatus according to claim 20, wherein the first rear side imaging system and the second rear side imaging system are catadioptric optical systems which are provided symmetrically in relation to an optical axis of the third imaging system.

22. The exposure apparatus according to claim 1, wherein the illumination system has a first illumination optical system which forms the first illumination area based on a light from a first light source, and a second illumination optical system which forms the second illumination area based on a light from a second light source.

23. The exposure apparatus according to claim 22, wherein the first light source and the second light source have a light source common to the first illumination optical system and the second illumination optical system.

24. The exposure apparatus according to claim 1, wherein the illumination system has a common illumination optical system which forms the first illumination area and the second illumination area based on a light from a common light source.

37. A method for producing a device, comprising:

using the exposure apparatus as defined in claim 1 to transfer the pattern of the mask to the photosensitive substrate; and

processing the photosensitive substrate, to which the pattern has been transferred, based on the pattern.

25. An exposure apparatus which exposes a substrate with an image of a pattern formed on a mask, the exposure apparatus comprising:

an illumination system which forms a first illumination area and a second illumination area, with a spacing distance, on a plane same as the mask;

a mask-moving section which is movable continuously while holding the mask to make the pattern pass successively through the first illumination area and the second illumination area;

a projection system which projects a first image and a second image on the substrate, the first image and the second image being formed when the pattern passes through the first illumination area and the second illumination area, respectively; and

a substrate-moving section which is movable continuously, while holding the substrate, in a direction corresponding to movement of the mask-moving section and in synchronization with the movement of the mask-moving section to successively form the first image and the second image in different areas, respectively, on the substrate.

26. The exposure apparatus according to claim 25, further comprising a first blind and a second blind which restrict the first illumination area and the second illumination area when the first image and the second image are successively formed in the different areas on the substrate, respectively.

27. The exposure apparatus according to claim 26, wherein the different areas on the substrate are a first area and a second area in which the first image and the second image are formed respectively;

and

the first blind prevents the first image from being formed in the second area and the second blind prevents the second image from being formed in the first area.

39. A method for producing a device, comprising:

using the exposure apparatus as defined in claim 25 to transfer the pattern of the mask to the photosensitive substrate; and

processing the photosensitive substrate, to which the pattern has been transferred, based on the pattern.

28. An exposure method comprising:

irradiating an exposure light onto a mask formed with a pattern to form a first illumination area and a second illumination area which are separated from each other by a spacing distance in a first direction;

forming, on a photosensitive substrate, a first projected image of the pattern positioned in the first illumination area and a second projected image of the pattern positioned in the second illumination area; and

synchronously moving the mask and the photosensitive substrate in the first direction and a second direction corresponding to the first direction respectively to successively perform scanning exposures with the pattern with respect to a first transfer area and a second transfer area which are provided adjacently in the second direction on the photosensitive substrate.

29. The exposure method according to claim 28, wherein the successive scanning exposures with respect to the first and second transfer areas include moving the mask successively to a first area and a second area which are provided in the first illumination area and the second illumination area respectively while being separated from each other in the first direction by a spacing distance based on a size of the first transfer area or the second transfer area in the second direction, a spacing distance between the first projection area and the second projection area in the second direction, a spacing distance between the first transfer area and the second transfer area in the second direction, and a projection magnification of the projection optical system.

30. The exposure method according to claim 28, wherein the successive scanning exposures with respect to the first and second transfer areas include setting a first size of the first projected image in the second direction and a second size of the second projected image in the second direction on the photosensitive substrate, corresponding to synchronous movement of the mask and the photosensitive substrate.

31. The exposure method according to claim 30, wherein the setting of the first size and the second size includes setting the first size and the second size based on movement information corresponding to a movement position of the mask in the first direction and a movement position of the photosensitive substrate in the second direction.

32. The exposure method according to claim 31, wherein the setting of the first size and the second size includes setting a position of a light-shielding member, which shields the exposure light, with respect to an optical path for the exposure light based on the movement information.

38. A method for producing a device, comprising:

using the exposure method as defined in claim 28 to transfer the pattern of the mask to the photosensitive substrate; and

processing the photosensitive substrate, to which the pattern has been transferred, based on the pattern.

33. An exposure method for exposing a substrate with an image of a pattern formed on a mask, the exposure method comprising:

forming a first illumination area and a second illumination area, with a spacing distance, on a plane same as the mask;

moving the mask continuously relative to the first illumination area and the second illumination area to make the pattern pass successively through the first illumination area and the second illumination area;

projecting a first image and a second image on the substrate, the first image and the second image being formed when the pattern passes through the first illumination area and the second illumination area, respectively; and

moving the substrate continuously in a direction corresponding to movement of the mask and in synchronization with the movement of the mask to successively form the first image and the second image in different areas, respectively, on the substrate.

34. The exposure method according to claim 33, wherein the first illumination area and the second illumination area are aligned in a first direction;

and

a width in the first direction of each of the first and second illumination areas is smaller than a width in the first direction of the pattern.

35. The exposure method according to claim 33, further comprising moving the substrate in a different direction, different from the direction in which the substrate is successively moved, after the first image and the second image are successively formed in the different areas respectively on the substrate, and continuously moving the mask relative to the second illumination area and the first illumination area to make the pattern successively pass through the second illumination area and the first illumination area;

projecting, onto the substrate, a third image and a fourth image which are formed when the pattern passes through the second illumination area and the first illumination area respectively; and

moving the substrate continuously in the direction corresponding to the movement of the mask and in synchronization with the movement of the mask to successively form the third image and the fourth image in different areas, respectively, on the substrate.

36. The exposure method according to claim 33, wherein the different areas on the substrate are a first area and a second area in which the first image and the second image are formed respectively;

and

when the first image and the second image are successively formed in the first area and the second area, respectively, on the substrate, the first illumination area is restricted so as to prevent the first image from being formed in the second area and the second illumination area is restricted so as to prevent the second image from being formed in the first area.

40. A method for producing a device, comprising:

using the exposure method as defined in claim 33 to transfer the pattern of the mask to the photosensitive substrate; and

processing the photosensitive substrate, to which the pattern has been transferred, based on the pattern.