POWER ELECTRONIC MODULE IGBT PROTECTION METHOD AND SYSTEM

• US 20100080024A1
• Filed: 09/30/2008
• Published: 04/01/2010
• Est. Priority Date: 09/30/2008
• Status: Active Grant

• Current Assignee: Rockwell Automation Technologies Incorporated (Allen-Bradley Co., Inc.)
• Original Assignee: Rockwell Automation Technologies Incorporated (Allen-Bradley Co., Inc.)
• Inventors: Tsuyoshi, Masahiro, Lukaszewski, Richard A., Wei, Lixiang
• Granted Patent: US 8,148,929 B2
• Time in Patent Office: Days
• US Class Current: 363/74
• CPC Class Codes: H02M 1/32 Means for protecting converters other than automatic disconnection
• CPC Class Codes: H03K 17/0828 in composite switches
• CPC Class Codes: H03K 2017/0806 against excessive temperature

Abstract

A power electronics device with an improved IGBT protection mechanism is provided. More specifically, systems and methods are provided for reducing the switching frequency of an inverter module based on the junction temperature variation of the IGBT.

Claims

1. A method of delivering power to a load comprising:

activating and deactivating a solid state switch at a specified switching frequency to generate an output current waveform;

determining a junction temperature variation of the solid state switch;

reducing the switching frequency based upon the junction temperature variation.

2. The method of claim 1, comprising increasing the switching frequency if the junction temperature variation is lower than a specified low temperature.

3. The method of claim 2, wherein the switching frequency is reduced if the temperature difference is higher than 60 degrees Celsius and is increased thereafter if the temperature difference is lower than approximately 55 degrees Celsius.

4. The method of claim 1, wherein determining a junction temperature variation of the solid state switch comprises estimating a power loss of the solid state switch.

5. The method of claim 1, wherein determining a junction temperature variation of the solid state switch comprises determining a thermal impedance between the solid state switch and a case to which the solid state switch is mounted.

6. The method of claim 1, wherein determining the junction temperature variation comprises calculating a boost factor.

7. The method of claim 1, wherein determining the junction temperature variation comprises estimating a peak junction temperature for one cycle of the output current waveform.

8. A method of operating an inverter module, comprising:

activating and deactivating a solid state switch at a switching frequency to generate an output current waveform, wherein the solid state switch is electrically coupled in parallel to a diode;

varying the switching frequency based on an estimated temperature of the solid state switch or the diode.

9. The method of claim 8, wherein varying the switching frequency based on an estimated temperature of the solid state switch comprises varying the switching frequency based on an estimated temperature variation of the solid state switch.

10. The method of claim 9, wherein varying the switching frequency comprises setting the switching frequency to a specified high frequency if the estimated temperature variation is below a low temperature threshold, and setting the switching frequency to a specified low frequency if the estimated temperature variation is above a high temperature threshold.

11. The method of claim 10, wherein the high temperature threshold is approximately 60 degrees Celsius and the low temperature threshold is approximately 55 degrees Celsius.

12. The method of claim 8, comprising generating an estimated temperature of the solid state switch.

13. The method of claim 12, wherein generating an estimated temperature of the solid state switch comprises estimating a power loss of the solid state switch.

14. The method of claim 9, comprising generating an estimated temperature variation of the solid state switch.

15. The method of claim 14, wherein generating an estimated temperature variation of the solid state switch comprises determining a thermal impedance between the solid state switch and a case to which the solid state switch is mounted.

16. The method of claim 14, wherein generating an estimated temperature variation of the solid state switch comprises estimating a junction temperature variation for one cycle of the output current waveform.

17. A motor control system, comprising:

an inverter module comprising a solid state switch coupled to a case, the inverter module configured to generate an output current waveform;

control circuitry coupled to the inverter module and configured to vary a switching frequency of the inverter module based on an estimated junction temperature of the solid state switch.

18. The motor control system of claim 17, comprising junction temperature determination circuitry configured to determine the estimated junction temperature of the solid state switch

19. The motor control system of claim 18, wherein the junction temperature determination circuitry is configured to determine the junction temperature by estimating a power loss of the solid state switch.

20. The motor control system of claim 17, wherein the control circuitry is configured to vary the switching frequency of the inverter module based on an estimated junction temperature variation of the solid state switch for one cycle of output current waveform.

21. The motor control system of claim 20, comprising junction temperature determination circuitry configured to determine the estimated junction temperature variation of the solid state switch for one cycle of output current waveform.

22. The motor control system of claim 21, wherein the junction temperature determination circuitry is configured to factor the junction temperature by a thermal impedance between a junction of the solid state switch and the case.

23. The motor control system of claim 20, wherein the control circuitry is configured to increase the switching frequency of the inverter module if the estimated junction temperature variation of the solid state switch is less than a specified low temperature and decrease the switching frequency of the inverter module if the estimated junction temperature variation of the solid state switch is more than a specified high temperature

24. The motor control system of claim 23, wherein the specified high temperature is approximately 60 degrees Celsius and the specified low temperature is approximately 55 degrees Celsius.