PASTE APPLICATOR AND PASTE APPLICATION METHOD

• US 20100080912A1
• Filed: 09/28/2009
• Published: 04/01/2010
• Est. Priority Date: 10/01/2008
• Status: Active Grant

• Current Assignee: Panasonic Intellectual Property Management Co., Ltd. (Panasonic Holdings Corporation)
• Original Assignee: Panasonic Corporation (Panasonic Holdings Corporation)
• Inventors: Komyoji, Daido, Koyama, Masayoshi, Tsukahara, Norihito
• Granted Patent: US 9,162,249 B2
• Time in Patent Office: Days
• US Class Current: 427/256
• CPC Class Codes: B05C 1/027 only at particular parts of the articles at particular parts of work of indefinite length B05C1/16
• CPC Class Codes: B05C 11/1034 specially designed for conducting intermittent application of small quantities, e.g. drops, of coating material B05C5/0225, B05C11/1026 take precedence
• CPC Class Codes: B05C 5/02 the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
• CPC Class Codes: B05C 5/0212 only at particular parts of the articles at particular part of web, band, strip, belt or ribbon B05C5/025
• CPC Class Codes: B05C 5/0225 characterised by flow controlling means, e.g. valves, located proximate the outlet B05C5/0258, B05C5/0275 take precedence; supply valves upstream the coating head B05C11/1036
• CPC Class Codes: B05C 9/02 for applying liquid or other fluent material to surfaces by single means not covered by groups B05C1/00 - B05C7/00, whether or not also using other means
• CPC Class Codes: B05D 1/26 performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface
• CPC Class Codes: B05D 3/0466 the gas being a non-reacting gas B05D3/0406 takes precedence
• CPC Class Codes: B23K 1/0016 Brazing of electronic components
• CPC Class Codes: B23K 2101/40 Semiconductor devices
• CPC Class Codes: B23K 3/0692 with intermediary means for bringing solder on workpiece, e.g. rollers
• CPC Class Codes: G01F 11/00 Apparatus requiring external operation adapted at each repeated and identical operation to measure and separate a predetermined volume of fluid or fluent solid material from a supply or container, without regard to weight, and to deliver it
• CPC Class Codes: H05K 2203/0126 Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
• CPC Class Codes: H05K 3/3485 Applying solder paste, slurry or powder thick film methods for applying conductive paste or ink patterns H05K3/12

Abstract

A pin (125) is moved down in a nozzle (121), the end of paste (101) protruded from the discharge opening (122) of the nozzle (121) to a target object (102) is brought into contact with the target object (102), and the pin (125) is moved away from the discharge opening (122) to divide the paste in contact with the target object.

Claims

1. A paste applicator comprising:

a nozzle which has a discharge opening formed on an end, is disposed above a target object with the discharge opening placed at a bottom, is filled with paste, and is relatively moved toward and away from the target object; and

a pin which is disposed in the nozzle, moves toward and away from the discharge opening, and does not protrude from the discharge opening to an outside of the nozzle,

wherein while the discharge opening of the nozzle comes close to the target object, the pin is brought close to the discharge opening and the paste protruded to the target object so as not to drip from the discharge opening is brought into contact with the target object, and in a relative movement increasing a distance between the nozzle and the target object, the pin is moved away from the discharge opening and the paste in contact with the target object is divided from the paste around the discharge opening.

2. The paste applicator according to claim 1, wherein at a position where the discharge opening of the nozzle is close to the target object, a height from a surface of the target object to the discharge opening is in a range from 0.5 times to 1.5 times as large as a bore of the discharge opening.

3. The paste applicator according to claim 1, wherein the pin moves up at a velocity not lower than a descending velocity of the pin.

4. The paste applicator according to claim 1, wherein the pin moves up at a velocity at least twice a descending velocity of the pin.

5. The paste applicator according to claim 1, wherein the pin has an end shaped such that a larger resistance is applied from the paste when the pin is moved up than when the pin is moved down.

12. The paste application method according to claim 1, wherein in the application and the division, the molten filler protruded from the discharge opening of the nozzle has a surface kept in inert gas.

6. A paste application method comprising the steps of:

placing a nozzle which has a discharge opening formed on an end, is disposed above a target object with the discharge opening placed at a bottom, and is filled with paste, the nozzle being placed such that the nozzle is relatively moved toward and away from the target object and the discharge opening comes close to the target object;

applying the paste to the target object by bringing a pin close to the discharge opening while the discharge opening of the nozzle comes close to the target object and bringing the paste into contact with the target object, the paste being protruded to the target object so as not to drip from the discharge opening; and

separating the paste in contact with the target object from the paste around the discharge opening by moving the pin away from the discharge opening in a relative movement increasing a distance between the nozzle and the target object.

7. The paste application method according to claim 6, wherein at a position where the discharge opening of the nozzle is close to the target object, a height from a surface of the target object to the discharge opening is in a range from 0.5 times to 1.5 times as large as a bore of the discharge opening.

8. The paste application method according to claim 6, wherein the pin moves up at a velocity not lower than a descending velocity of the pin.

9. The paste application method according to claim 6, wherein the paste is applied into a plurality of points on the target object by repeating the application and the separation on varying application points.

10. The paste application method according to claim 6, wherein the paste is applied into a line on the target object by repeating the application and the separation on varying application points such that the application points overlap each other.

11. A paste application method comprising the steps of:

supplying paste containing a filler to a nozzle and heating the paste in the nozzle to at least a melting point of the filler;

placing a discharge opening of the nozzle above an application position of a target object;

applying an end of the molten filler to the target object, the filler being protruded from the discharge opening of the nozzle and brought into contact with the target object by moving a pin in the nozzle without bringing the pin into contact with the discharge opening in the nozzle or protruding the pin out of the nozzle;

dividing, from the molten filler in the nozzle, the molten filler protruded from the discharge opening of the nozzle by lifting the pin to an upper position; and

separating the nozzle from the application position of the target object after completion of application.

13. The paste application method according to claim 11, wherein in the placement, a distance between the nozzle and the target object is 0.5 times to 1.5 times as large as an opening diameter of the discharge opening.

14. The paste application method according to claim 11, wherein the pin moves in the paste in the division at a velocity (V1) not lower than a velocity (V2) of the pin moving in the paste in the application.

15. The paste application method according to claim 11, wherein the pin moves in the paste in the division at a velocity (V1) at least twice as high as a velocity (V2) of the pin moving in the paste in the application.

16. The paste application method according to claim 11, wherein a plurality of bumps are formed on the target object by repeating the placement, the application, and the division.

17. A paste applicator comprising:

a nozzle having a discharge opening formed at a bottom,

a pin which is disposed in the nozzle, moves toward and away from the discharge opening, and does not protrude from the discharge opening to an outside of the nozzle,

a driving section connected to the pin to move up and down the pin;

an elevator mount for ascending and descending the nozzle, the pin, and the driving section; and

a heating section for heating paste containing a filler in the nozzle to at least a melting point of the filler,

wherein while the discharge opening of the nozzle comes close to a target object, the pin is brought close to the discharge opening and an end of the molten filler protruded to the target object so as not to drip from the discharge opening is brought into contact with the target object, and the pin is moved away from the discharge opening to divide, from the molten filler in the nozzle, the molten filler protruded from the discharge opening of the nozzle.

18. The paste applicator according to claim 17, further comprising a mechanism for covering, with inert gas, a surface of the molten filler protruded from the discharge opening of the nozzle.

19. The paste applicator according to claim 17, wherein the pin has an end shaped such that a larger resistance is applied from the paste when the pin is moved up than when the pin is moved down.

20. The paste applicator according to claim 17, wherein at a position where the discharge opening of the nozzle is close to the target object, a height from a surface of the target object to the discharge opening is in a range from 0.5 times to 1.5 times as large as a bore of the discharge opening.