ELECTRONIC PACKAGE DEVICE
First Claim
Patent Images
1. An electronic package device having a substantially sealed accommodation space, comprising:
- a fluid located in the accommodation space;
an electronic element disposed in the accommodation space, wherein at least a part of the electronic element contacts with the fluid; and
a first space buffer mechanism at least partially contacting with the fluid and providing displacement or deformation to buffer a volume variation of the fluid.
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Abstract
An electronic package device has an accommodation space being substantially sealed. The electronic package device includes a fluid, an electronic element and a space buffer mechanism. The fluid is located in the accommodation space. The electronic element is also disposed in the accommodation space, and at least a part thereof contacts with the fluid. The space buffer mechanism at least partially contacts with the fluid and provides the displacement or deformation to buffer the volume variation of the fluid.
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Citations
20 Claims
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1. An electronic package device having a substantially sealed accommodation space, comprising:
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a fluid located in the accommodation space; an electronic element disposed in the accommodation space, wherein at least a part of the electronic element contacts with the fluid; and a first space buffer mechanism at least partially contacting with the fluid and providing displacement or deformation to buffer a volume variation of the fluid. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19)
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20. An electronic package device, comprising:
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a case; a space buffer mechanism forming a fluid accommodation space with the case and providing displacement or deformation corresponding to a volume variation of the fluid accommodation space; a fluid located in the fluid accommodation space; and an electronic element disposed in the fluid accommodation space, wherein at least a part of the electronic element contacts with the fluid.
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Specification