ELECTRONIC PACKAGE DEVICE

• US 20100084162A1
• Filed: 09/30/2009
• Published: 04/08/2010
• Est. Priority Date: 10/03/2008
• Status: Abandoned Application

• Current Assignee: Aussmak Optoelectronics Corp.
• Original Assignee: Aussmak Optoelectronics Corp.
• Inventors: LIN, Chung-Jyh
• Application Number:
  US12/570,862
• Publication Number:
  US 20100084162A1
• Time in Patent Office: Days
• US Class Current: 174/17.R
• CPC Class Codes: H01L 23/22 liquid at the normal operating temperature of the device
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/12044 OLED
• CPC Class Codes: H01L 2924/1433 Application-specific integrated circuit [ASIC]
• CPC Class Codes: H05K 5/068 having a pressure compensation device, e.g. membrane venting means H05K5/0213

Abstract

An electronic package device has an accommodation space being substantially sealed. The electronic package device includes a fluid, an electronic element and a space buffer mechanism. The fluid is located in the accommodation space. The electronic element is also disposed in the accommodation space, and at least a part thereof contacts with the fluid. The space buffer mechanism at least partially contacts with the fluid and provides the displacement or deformation to buffer the volume variation of the fluid.

Claims

1. An electronic package device having a substantially sealed accommodation space, comprising:

a fluid located in the accommodation space;

an electronic element disposed in the accommodation space, wherein at least a part of the electronic element contacts with the fluid; and

a first space buffer mechanism at least partially contacting with the fluid and providing displacement or deformation to buffer a volume variation of the fluid.

2. The electronic package device according to claim 1, further comprising:

a case containing the accommodation space.

3. The electronic package device according to claim 2, wherein the first space buffer mechanism is disposed inside or outside the case.

4. The electronic package device according to claim 1, further comprising:

at least one case combining with the first space buffer mechanism to form the accommodation space.

5. The electronic package device according to claim 4, wherein electronic package device comprises a plurality of the cases, and two ends of the first space buffer mechanism are connected with the cases to form the accommodation space.

6. The electronic package device according to claim 5, wherein one of the cases has an opening substantially matching with the size and shape of another one of the cases.

7. The electronic package device according to claim 4, further comprising:

a second space buffer mechanism disposed in the accommodation space, wherein a buffer space is formed in the second space buffer mechanism.

8. The electronic package device according to claim 2, wherein at least a part of the case is a circuit board.

9. The electronic package device according to claim 4, wherein at least a part of the case is a circuit board.

10. The electronic package device according to claim 2, wherein the case and the first space buffer mechanism are connected by adhering or embedding.

11. The electronic package device according to claim 4, wherein the case and the first space buffer mechanism are connected by adhering or embedding.

12. The electronic package device according to claim 2, wherein the case has a first portion and a second portion connected with each other, and the first space buffer mechanism is connected with the first portion and the second portion.

13. The electronic package device according to claim 4, wherein the case has a first portion and a second portion connected with each other, and the first space buffer mechanism is connected with the first portion and the second portion.

14. The electronic package device according to claim 4, wherein the first space buffer mechanism is disposed outside the case.

15. The electronic package device according to claim 1, wherein the first space buffer mechanism comprises:

a channel; and

a sliding partition member slidingly disposed in the channel.

16. The electronic package device according to claim 1, wherein the first space buffer mechanism has a buffer space.

17. The electronic package device according to claim 1, wherein the first space buffer mechanism comprises an elastic member or a sliding member.

18. The electronic package device according to claim 1, wherein the first space buffer mechanism comprises a silica gel film, a balloon or a piston.

19. The electronic package device according to claim 1, wherein the fluid is doped with a fluorescent transformation material.

20. An electronic package device, comprising:

a case;

a space buffer mechanism forming a fluid accommodation space with the case and providing displacement or deformation corresponding to a volume variation of the fluid accommodation space;

a fluid located in the fluid accommodation space; and

an electronic element disposed in the fluid accommodation space, wherein at least a part of the electronic element contacts with the fluid.