Manufacturing method of a flexible printed circuit board and a structure thereof

• US 20100084168A1
• Filed: 01/22/2009
• Published: 04/08/2010
• Est. Priority Date: 10/03/2008
• Status: Abandoned Application

• Current Assignee: Po-Ju Chou
• Original Assignee: Po-Ju Chou
• Inventors: Chou, Po-Ju
• Application Number:
  US12/357,396
• Publication Number:
  US 20100084168A1
• Time in Patent Office: Days
• US Class Current: 174/254
• CPC Class Codes: H05K 1/0289 having a matrix lay-out, i.e. having selectively interconnectable sets of X-conductors and Y-conductors in different planes
• CPC Class Codes: H05K 1/0393 Flexible materials H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups
• CPC Class Codes: H05K 1/095 for polymer thick films, i.e. having a permanent organic polymeric binder
• CPC Class Codes: H05K 3/249 comprising carbon particles as main constituent
• CPC Class Codes: H05K 3/4664 Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders H05K3/4647 takes precedence
• CPC Class Codes: Y10T 29/49155 Manufacturing circuit on or in base

Abstract

In a manufacturing method of a flexible printed circuit board and its structure, the manufacturing method includes the steps of: providing a substrate; performs a preheating and drying process to the substrate; forming a circuit pattern including a ground circuit, an X-axis circuit, a Y-axis circuit and an external circuit on a surface of the substrate by a screen printing method, forming a ground circuit layer on the substrate and corresponding to the ground circuit, forming on a Y-axis circuit layer on a surface of the substrate and corresponding to the Y-axis circuit, forming an X-axis circuit layer on a surface of the substrate and corresponding to the X-axis circuit, and forming a carbon paste enhancement layer according to the external circuit.

Claims

1. A manufacturing method of a flexible printed circuit board, comprising the steps of:

(1) providing a substrate;

(2) performing a reheating and drying process to the substrate;

(3) forming a circuit pattern including at least one ground circuit, at least one X-axis circuit, at least one Y-axis circuit and at least one external circuit on a surface of the substrate;

(4) forming at least one ground circuit layer on a surface of the substrate according to the ground circuit;

(5) forming at least one Y-axis circuit layer on a surface of the substrate according to the Y-axis circuit;

(6) forming at least one X-axis circuit layer on a surface of the substrate according to the X-axis circuit; and

(7) forming a carbon paste enhancement layer at the position of the external circuit.

2. The manufacturing method of a flexible printed circuit board as recited in claim 1, wherein the preheating and drying process of the Step (2) is performed for one or more times at a predetermined temperature for a predetermined time.

3. The manufacturing method of a flexible printed circuit board as recited in claim 1, wherein the circuit pattern of the Step (3) is formed by a screen printing method.

4. The manufacturing method of a flexible printed circuit board as recited in claim 1, wherein the Step (4) further comprises:

(4A) forming at least one ground circuit conductor layer;

(4B) attaching at least one insulating layer onto the ground circuit conductor layer; and

(4C) forming a plurality of ground circuit layer conducting holes at predetermined positions on the insulating layer.

5. The manufacturing method of a flexible printed circuit board as recited in claim 4, wherein the ground circuit conductor layer of the Step (4A) is thermoset for one or more times at a predetermined temperature for a predetermined time.

6. The manufacturing method of a flexible printed circuit board as recited in claim 4, wherein the insulating material of the Step (4B) is attached for one or more times at a predetermined temperature for a predetermined time.

7. The manufacturing method of a flexible printed circuit board as recited in claim 1, wherein the Step (5) further comprises:

(5A) forming at least one Y-axis circuit conductor layer;

(5B) attaching at least one insulating layer onto the Y-axis circuit conductor layer; and

(5C) forming a plurality of Y-axis circuit layer conducting holes at predetermined positions on the insulating layer.

8. The manufacturing method of a flexible printed circuit board as recited in claim 7, wherein the Y-axis circuit conductor layer of the Step (5A) is thermoset for one or more times at a predetermined temperature for a predetermined time.

9. The manufacturing method of a flexible printed circuit board as recited in claim 7, wherein the insulating material of the Step (5B) is attached for one or more times at a predetermined temperature for a predetermined time.

10. The manufacturing method of a flexible printed circuit board as recited in claim 1, wherein the Step (6) further comprises:

(6A) forming at least one X-axis circuit conductor layer;

(6B) attaching at least one insulating layer onto the X-axis circuit conductor layer; and

(6C) forming a plurality of X-axis circuit layer conducting holes at predetermined positions on the insulating layer.

11. The manufacturing method of a flexible printed circuit board as recited in claim 10, wherein the X-axis circuit conductor layer of the Step (6A) is thermoset for one or more times at a predetermined temperature for a predetermined time.

12. The manufacturing method of a flexible printed circuit board as recited in claim 10, wherein the insulating material of the Step (6B) is attached for one or more times at a predetermined temperature for a predetermined time.

13. The manufacturing method of a flexible printed circuit board as recited in claim 1, wherein the Step 7 the carbon paste enhancement layer is thermoset at a predetermined temperature for a predetermined time and covered onto a circuit layer of the external circuit.

14. A structure of a flexible printed circuit board, comprising:

a substrate;

a circuit pattern, formed on a surface of the substrate by a screen printing method, and having at least one ground circuit, at least one X-axis circuit, at least one Y-axis circuit and at least one external circuit;

at least one ground circuit layer, formed on the ground circuit, and disposed on a lateral surface of the substrate;

at least one Y-axis circuit layer on the Y-axis circuit disposed on the ground circuit layer;

at least one X-axis circuit layer on the X-axis circuit disposed on the Y-axis circuit layer; and

at least one carbon paste enhancement layer at the external circuit.

15. The structure of a flexible printed circuit board as recited in claim 14, wherein the substrate is made of polyethylene terephthalate (PET), and has a thickness from 100 μ

m to 175 μ

m.

16. The structure of a flexible printed circuit board as recited in claim 14, wherein the external circuit is extended from the X-axis circuit, the Y-axis circuit or a combination of the X-axis and Y-axis circuits.

17. The structure of a flexible printed circuit board as recited in claim 14, wherein the ground circuit layer further comprises:

at least one ground circuit conductor layer;

at least one ground circuit insulating layer, formed on the conductor layer; and

a plurality of ground circuit conducting holes, disposed at predetermined positions of the insulating layer.

18. The structure of a flexible printed circuit board as recited in claim 17, wherein the ground circuit conductor layer is made of silver, copper or another conducting metal.

19. The structure of a flexible printed circuit board as recited in claim 14, wherein the Y-axis circuit layer further comprises:

at least one Y-axis circuit conductor layer;

at least one Y-axis circuit insulating layer, formed on the conductor layer; and

a plurality of Y-axis circuit conducting holes, disposed at predetermined positions of the insulating layer.

20. The structure of a flexible printed circuit board as recited in claim 19, wherein the Y-axis circuit conductor layer is made of silver, copper or another conducting metal.

21. The structure of a flexible printed circuit board as recited in claim 14, wherein the X-axis circuit layer further comprises:

at least one X-axis circuit conductor layer;

at least one X-axis circuit insulating layer, formed on the conductor layer; and

a plurality of X-axis circuit conducting holes, disposed at predetermined positions of the insulating layer.

22. The structure of a flexible printed circuit board as recited in claim 21, wherein the X-axis circuit conductor layer is made of silver, copper or another conducting metal.

23. A structure of a flexible printed circuit board, comprising:

a substrate;

a circuit pattern, formed on a surface of the substrate by a screen printing method, and having at least one ground circuit, at least one X-axis circuit, at least one Y-axis circuit and at least one external circuit;

at least one ground circuit layer, formed on the ground circuit, and disposed on a first lateral surface of the substrate;

at least one Y-axis circuit layer, formed on the Y-axis circuit disposed on the ground circuit layer;

at least one X-axis circuit layer, formed on the X-axis circuit disposed on a second lateral surface of the substrate corresponding to the first lateral surface; and

at least one carbon paste enhancement layer, formed at the external circuit.

24. The structure of a flexible printed circuit board as recited in claim 23, wherein the substrate is made of polyethylene terephthalate (PET), and has a thickness from 100 μ

m to 175 μ

m.

25. The structure of a flexible printed circuit board as recited in claim 23, wherein the substrate includes a plurality of conducting holes for electrically coupling the X-axis circuit layer and the ground circuit layer.

26. The structure of a flexible printed circuit board as recited in claim 23, wherein the external circuit is extended from the X-axis circuit, the Y-axis circuit or a combination of the X-axis and Y-axis circuits.

27. The structure of a flexible printed circuit board as recited in claim 23, wherein the ground circuit layer further comprises:

at least one ground circuit conductor layer, made of silver, copper or another conducting metal;

at least one ground circuit insulating layer, formed on the conductor layer; and

a plurality of ground circuit conducting holes, formed at predetermined positions of the insulating layer.

28. The structure of a flexible printed circuit board as recited in claim 23, wherein the Y-axis circuit layer further comprises:

at least one Y-axis circuit conductor layer, made of silver, copper or another conducting metal;

at least one Y-axis circuit insulating layer, formed on the conductor layer; and

a plurality of Y-axis circuit conducting holes, formed at predetermined positions of the insulating layer.

29. The structure of a flexible printed circuit board as recited in claim 23, wherein the X-axis circuit layer, further comprises:

at least one X-axis circuit conductor layer, made of silver, copper or another conducting metal;

at least one X-axis circuit insulating layer, formed on the conductor layer; and

a plurality of X-axis circuit conducting holes, formed at predetermined positions of the insulating layer.

30. A structure of a flexible printed circuit board, comprising:

a substrate;

a circuit pattern, formed on a surface of the substrate by a screen printing method, and having at least one ground circuit, at least one X-axis circuit, at least one Y-axis circuit and at least one external circuit;

at least two ground circuit layers, formed on the ground circuit, and disposed on

a first lateral surface and a second lateral surface of the substrate respectively;

at least one Y-axis circuit layer, formed on the Y-axis circuit, and disposed on the first lateral surface of the ground circuit layer;

at least one X-axis circuit layer, formed on the X-axis circuit, and disposed on the ground circuit layer of the second lateral surface; and

at least one carbon paste enhancement layer formed at the external circuit.

31. The structure of a flexible printed circuit board as recited in claim 30, wherein the substrate is made of polyethylene terephthalate (PET), and has a thickness from 100 μ

m to 175 μ

m.

32. The structure of a flexible printed circuit board as recited in claim 30, wherein the external circuit is extended from the X-axis circuit, the Y-axis circuit or a combination of the X-axis and Y-axis circuits.

33. The structure of a flexible printed circuit board as recited in claim 30, wherein the ground circuit layer further comprises:

at least one ground circuit conductor layer, made of silver, copper or another conducting metal;

at least one ground circuit insulating layer, formed on the conductor layer; and

a plurality of ground circuit conducting holes, formed at predetermined positions of the insulating layer.

34. The structure of a flexible printed circuit board as recited in claim 30, wherein the Y-axis circuit layer further comprises:

at least one Y-axis circuit conductor layer, made of silver, copper or another conducting metal;

at least one Y-axis circuit insulating layer, formed on the conductor layer; and

a plurality of Y-axis circuit conducting holes, formed at predetermined positions of the insulating layer.

35. The structure of a flexible printed circuit board as recited in claim 30, wherein the X-axis circuit layer further comprises:

at least one X-axis circuit conductor layer, made of silver, copper another conducting metal;

at least one X-axis circuit insulating layer, formed on the conductor layer; and

a plurality of X-axis circuit conducting holes, formed at predetermined positions of the insulating layer.