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Zigzag Pattern for TSV Copper Adhesion

  • US 20100084747A1
  • Filed: 10/03/2008
  • Published: 04/08/2010
  • Est. Priority Date: 10/03/2008
  • Status: Active Grant
First Claim
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1. A semiconductor device comprising:

  • a substrate with a first conductive feature;

    a passivation layer over the first conductive feature; and

    a first contact pad extending through multiple openings in the passivation layer to make multiple discontinuous contacts with the first conductive feature.

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