Zigzag Pattern for TSV Copper Adhesion
First Claim
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1. A semiconductor device comprising:
- a substrate with a first conductive feature;
a passivation layer over the first conductive feature; and
a first contact pad extending through multiple openings in the passivation layer to make multiple discontinuous contacts with the first conductive feature.
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Abstract
A system and method for forming a TSV contact is presented. A preferred embodiment includes a TSV in contact with a portion of the uppermost metal layer of a semiconductor die. The interface between the TSV conductor and the contact pad is preferably characterized by a non-planar zigzag pattern that forms a grid pattern of contacts. Alternatively, the contacts may form a plurality of metal lines that make contact with the contact pad.
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Citations
20 Claims
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1. A semiconductor device comprising:
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a substrate with a first conductive feature; a passivation layer over the first conductive feature; and a first contact pad extending through multiple openings in the passivation layer to make multiple discontinuous contacts with the first conductive feature. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A semiconductor device comprising:
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a semiconductor substrate; metal layers over the semiconductor substrate; a passivation layer over the metal layers; and a first conductor extending through multiple openings in the passivation layer and sharing an interface with an uppermost metal layer, wherein, in a first direction, the first conductor alternates between contacting the uppermost metal layer and the passivation layer. - View Dependent Claims (10, 11, 12, 13, 14)
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15. A semiconductor device comprising:
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a semiconductor substrate comprising a first metal layer; a passivation layer over portions of the first metal layer; and a first conductive layer shaped in a zigzag pattern with a plurality of extensions through the passivation layer to make a plurality of contact points with the first metal layer, the first conductive layer in contact with between about 30% and about 70% of the first metal layer. - View Dependent Claims (16, 17, 18, 19, 20)
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Specification