APPARATUS AND METHOD FOR REDUCING SLIPPAGE BETWEEN STRUCTURES IN AN INTERFEROMETRIC MODULATOR

• US 20100085626A1
• Filed: 12/04/2009
• Published: 04/08/2010
• Est. Priority Date: 09/27/2004
• Status: Active Grant

• Current Assignee: Snaptrack Incorporated (Qualcomm, Inc.)
• Original Assignee: Qualcomm MEMS Technologies Incorporated (Qualcomm, Inc.)
• Inventors: Floyd, Philip D., Cummings, William J., Tung, Ming-Hau, Arbuckle, Brian W.
• Granted Patent: US 7,924,494 B2
• Time in Patent Office: Days
• US Class Current: 359/290
• CPC Class Codes: G02B 26/001 based on interference in an adjustable optical cavity interference filters G02B5/28; devices or arrangements using multiple reflections in spectrometry or monochromators G01J3/26

Abstract

A support structure within an interferometric modulator device may contact various other structures within the device. Increased bond strengths between the support structure and the other structures may be achieved in various ways, such as by providing roughened surfaces and/or adhesive materials at the interfaces between the support structures and the other structures. In an embodiment, increased adhesion is achieved between a support structure and a substrate layer. In another embodiment, increased adhesion is achieved between a support structure and a moveable layer. Increased adhesion may reduce undesirable slippage between the support structures and the other structures to which they are attached within the interferometric modulator.

Claims

1. An electromechanical systems device, comprising:

a substrate layer comprising a first reflective surface formed on a transparent substrate, the first reflective surface being partially transmissive;

a movable layer comprising a second reflective surface, the second reflective surface being spaced from the first reflective surface, the first reflective surface and the second reflective surface defining a cavity therebetween;

a support structure positioned at a side of the cavity and configured to separate at least a portion of the substrate layer from at least a portion of the movable layer; and

a roughened interface between a surface of the support structure and a surface of the movable layer connected to the surface of the support structure, the roughened interface being configured to increase adhesion between the support structure and the movable layer.

2. The device of claim 1, wherein the first reflective surface and the second reflective surface define an interferometric cavity.

3. The device of claim 1, wherein the roughened interface comprises a roughened surface of the support structure.

4. The device of claim 1, wherein the roughened interface comprises a roughened surface of the movable layer.

5. The device of claim 1, wherein the second reflective surface is suspended from the movable layer.

6. The device of claim 1, further comprising an adhesive layer disposed at the roughened interface.

7. The device of claim 6, wherein the adhesive layer comprises aluminum.

8. The device of claim 6, wherein the adhesive layer is connected to the support structure and the movable layer.

9. A display device comprising the electromechanical device of claim 1.

10. The display device of claim 9, further comprising:

a display;

a processor that is in electrical communication with the display, the processor being configured to process image data;

a memory device in electrical communication with the processor.

11. The display device of claim 10, further comprising:

a driver circuit configured to send at least one signal to the display.

12. The display device of claim 11, further comprising:

a controller configured to send at least a portion of the image data to the driver circuit.

13. The display device of claim 10, further comprising:

an image source module configured to send the image data to the processor.

14. The display device of claim 13, wherein the image source module comprises at least one of a receiver, transceiver, and transmitter.

15. The display device of claim 10, further comprising:

an input device configured to receive input data and to communicate the input data to the processor.

16. An electromechanical device comprising:

first means for reflecting light, the first reflecting means being partially transmissive;

second means for reflecting light, the second reflecting means being movable and spaced apart from the first reflecting means;

means for supporting the first reflecting means over the second reflecting means; and

means for bonding the support means to at least one of the first reflecting means and the second reflecting means, the bonding means being configured to increase adhesion between the supporting means and at least one of the first reflecting means and the second reflecting means.

17. The electromechanical device of claim 16, wherein the first reflecting means comprises a fixed layer.

18. The electromechanical device of claim 17, wherein the fixed layer comprises a first reflective surface formed on a substrate.

19. The electromechanical device of claim 18, wherein the substrate is transparent.

20. The electromechanical device of claim 16, wherein first reflecting means and the second reflecting means define an interferometric cavity.

21. The electromechanical device of claim 16, wherein the second reflecting means comprises a movable layer.

22. The electromechanical device of claim 16, wherein the bonding means comprises an adhesive.

23. The electromechanical device of claim 17, wherein the adhesive comprises aluminum.

24. The electromechanical device of claim 16, wherein the bonding means comprises a roughened interface between the support means and at least one of the first reflecting means and the second reflecting means.

25. The electromechanical device of claim 16, wherein the bonding means comprises a roughened surface of the support means.

26. The electromechanical device of claim 16, wherein the bonding means comprises a roughened surface of the first reflecting means.

27. The electromechanical device of claim 16, wherein the bonding means comprises a roughened surface of the second reflecting means.

28. The electromechanical device of claim 16, wherein the support means comprises a post.

29. An electromechanical device comprising:

a substrate layer comprising a first reflective surface formed on a transparent substrate, the first reflective surface being partially transmissive;

a movable layer comprising a second reflective surface, the first reflective surface and the second reflective surface defining a cavity therebetween;

a support structure positioned at a side of the cavity and configure to separate at least a portion of the substrate layer from at least a portion of the movable layer; and

an adhesive disposed between a surface of the support structure and a surface of the substrate layer connected to the surface of the support structure, the adhesive being configured to increase adhesion between the support structure and the substrate layer.

30. The device of claim 29, wherein the adhesive comprises aluminum.

31. The device of claim 29, wherein the adhesive is between the support structure and the transparent substrate.

32. The device of claim 29, wherein adhesive is between the support structure and the first reflective surface.

33. The device of claim 29, further comprising a roughened interface between a surface of the support structure and a surface of the substrate layer connected to the surface of the support structure.

34. An electromechanical device, comprising:

a substrate layer comprising a first reflective surface formed on a transparent substrate, the first reflective surface being partially transmissive;

a movable layer comprising a second reflective surface, the first reflective surface and the second reflective surface defining a cavity therebetween;

a support structure positioned at a side of the cavity and configured to separate at least a portion of the substrate layer from at least a portion of the movable layer; and

an adhesive disposed between a surface of the support structure and a surface of the movable layer connected to the surface of the support structure, the adhesive being configured to increase adhesion between the support structure and the movable layer.