COOLING SYSTEM FOR RACK-MOUNTED ELECTRONICS EQUIPMENT
First Claim
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1. A rack-mount case system comprising:
- a case;
a frame located within the case and configured to receivably secure electronics equipment;
a cooling unit coupled to the frame, the cooling unit having at least one heat sink in fluid communication with a first blower and at least one manifold in fluid communication with a second blower;
a thermoelectric component located between the at least one heat sink and the manifold; and
a first vent opening located in at least one portion of the case, the first vent opening in fluid communication with the cooling unit,wherein at least the second blower is configured to move air at a desired flow rate within the case.
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Abstract
A rack-mount case system for receiving, supporting and storing electronics equipment includes a slide-out frame closely received and shock mounted in a case. The system includes a cooling unit having at least one heat sink in fluid communication with a first blower and a manifold in fluid communication with a second blower. A thermoelectric unit is located between the heat sink and the manifold to provide a compact cooling unit that may be secured to a side of the slide-out frame with a bracket, for example.
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Citations
14 Claims
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1. A rack-mount case system comprising:
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a case; a frame located within the case and configured to receivably secure electronics equipment; a cooling unit coupled to the frame, the cooling unit having at least one heat sink in fluid communication with a first blower and at least one manifold in fluid communication with a second blower; a thermoelectric component located between the at least one heat sink and the manifold; and a first vent opening located in at least one portion of the case, the first vent opening in fluid communication with the cooling unit, wherein at least the second blower is configured to move air at a desired flow rate within the case. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A rack-mount case system comprising:
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means for slideably receiving electronics equipment within an interior region of a rack-mount case; means for cooling the interior region by drawing air over a heat sink unit and through a manifold; and means for exchanging air from the interior region with an ambient environment. - View Dependent Claims (9, 10, 11, 12, 13, 14)
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Specification